{"status":"ok","message-type":"member","message-version":"1.0.0","message":{"last-status-check-time":1786921905762,"primary-name":"IMAPS - International Microelectronics Assembly and Packaging Society","counts":{"current-dois":966,"backfile-dois":3668,"total-dois":4634},"breakdowns":{"dois-by-issued-year":[[2012,433],[2026,407],[2011,349],[2013,348],[2015,338],[2010,318],[2014,309],[2016,300],[2025,282],[2024,277],[2017,264],[2023,236],[2019,220],[2018,174],[2021,110],[2020,76],[2009,37],[2005,30],[2004,30],[2007,26],[2006,26],[2008,25],[2022,19]]},"prefixes":["10.4071"],"coverage":{"affiliations-current":1.0,"affiliation-ror-ids-backfile":0.004907306434023991,"similarity-checking-current":1.0,"descriptions-current":0.0,"ror-ids-current":0.2608695652173913,"funders-backfile":0.0,"licenses-backfile":0.003544165757906216,"funders-current":0.0,"affiliations-backfile":0.8751363140676118,"resource-links-backfile":0.0,"orcids-backfile":0.0,"funder-ror-ids-current":0.0,"update-policies-current":0.0,"ror-ids-backfile":0.004907306434023991,"orcids-current":0.0,"similarity-checking-backfile":0.9956379498364231,"references-backfile":0.2380043620501636,"descriptions-backfile":0.0,"award-numbers-backfile":0.0,"update-policies-backfile":0.0,"licenses-current":0.03105590062111801,"award-numbers-current":0.0,"abstracts-backfile":0.9634678298800436,"resource-links-current":0.0,"affiliation-ror-ids-current":0.2608695652173913,"funder-ror-ids-backfile":0.0,"abstracts-current":0.994824016563147,"references-current":0.01759834368530021},"prefix":[{"name":"IMAPS - International Microelectronics Assembly and Packaging Society","value":"10.4071"}],"id":2525,"tokens":["imaps","international","microelectronics","assembly","and","packaging","society"],"counts-type":{"all":{"journal-article":4634},"backfile":{"journal-article":3668},"current":{"journal-article":966}},"coverage-type":{"all":{"journal-article":{"last-status-check-time":1786921905762,"affiliations":0.9011652999568407,"abstracts":0.9700043159257661,"orcids":0.0,"affiliation-ror-ids":0.05826499784203712,"licenses":0.00927924039706517,"references":0.1920586965904186,"funders":0.0,"similarity-checking":0.9965472593871385,"funder-ror-ids":0.0,"award-numbers":0.0,"ror-ids":0.05826499784203712,"update-policies":0.0,"resource-links":0.0,"descriptions":0.0}},"backfile":{"journal-article":{"last-status-check-time":1786921905762,"affiliations":0.8751363140676118,"abstracts":0.9634678298800436,"orcids":0.0,"affiliation-ror-ids":0.004907306434023991,"licenses":0.003544165757906216,"references":0.2380043620501636,"funders":0.0,"similarity-checking":0.9956379498364231,"funder-ror-ids":0.0,"award-numbers":0.0,"ror-ids":0.004907306434023991,"update-policies":0.0,"resource-links":0.0,"descriptions":0.0}},"current":{"journal-article":{"last-status-check-time":1786921905762,"affiliations":1.0,"abstracts":0.994824016563147,"orcids":0.0,"affiliation-ror-ids":0.2608695652173913,"licenses":0.03105590062111801,"references":0.01759834368530021,"funders":0.0,"similarity-checking":1.0,"funder-ror-ids":0.0,"award-numbers":0.0,"ror-ids":0.2608695652173913,"update-policies":0.0,"resource-links":0.0,"descriptions":0.0}}},"flags":{"deposits-abstracts-current":true,"deposits-orcids-current":false,"deposits-affiliation-ror-ids-current":true,"deposits":true,"deposits-affiliations-backfile":true,"deposits-update-policies-backfile":false,"deposits-similarity-checking-backfile":true,"deposits-award-numbers-current":false,"deposits-resource-links-current":false,"deposits-ror-ids-current":true,"deposits-articles":true,"deposits-affiliations-current":true,"deposits-affiliation-ror-ids-backfile":true,"deposits-funders-current":false,"deposits-references-backfile":true,"deposits-funder-ror-ids-current":false,"deposits-ror-ids-backfile":true,"deposits-abstracts-backfile":true,"deposits-licenses-backfile":true,"deposits-award-numbers-backfile":false,"deposits-descriptions-current":false,"deposits-references-current":true,"deposits-resource-links-backfile":false,"deposits-descriptions-backfile":false,"deposits-orcids-backfile":false,"deposits-funders-backfile":false,"deposits-funder-ror-ids-backfile":false,"deposits-update-policies-current":false,"deposits-similarity-checking-current":true,"deposits-licenses-current":true},"location":"Washington, DC, United States","names":["IMAPS - International Microelectronics Assembly and Packaging Society"]}}