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The squishy touch sensor is developed with custom\u2010made graphite paste on a tiny permanent magnet, encapsulated in Sil\u2010Poxy, and the actuator (15\u2009\u03bc\u2010thick coil) is fabricated on polyimide by Lithographie Galvanoformung Abformung (LIGA) micromolding method. The actuator can operate in two modes (expansion and contraction\/squeeze) and two states (vibration and nonvibration). The sensor was tested with up to 12\u2009N applied forces and exhibited \u224870% average relative resistance variation (\u0394<jats:italic>R<\/jats:italic>\/<jats:italic>R<\/jats:italic><jats:sub>o<\/jats:sub>), \u22480.346\u2009kPa<jats:sup>\u22121<\/jats:sup> sensitivity, and \u224849\u2009ms response time with excellent repeatability (\u224812.7% coefficient of variation) at 5\u2009N. During simultaneous sensing and actuation, the modulation of coil current, due to \u0394<jats:italic>R<\/jats:italic>\/<jats:italic>R<\/jats:italic><jats:sub>o<\/jats:sub> (\u224814% at 2\u2009N force) in the sensor, allows the close loop control (\u0394<jats:italic>I<\/jats:italic>\/<jats:italic>I<\/jats:italic><jats:sub>o<\/jats:sub> \u2248385%) of expansion\/contraction (\u224869.8\u2009\u03bcm expansion in nonvibration state and \u2248111.5\u2009\u03bcm peak\u2010to\u2010peak in the vibration state). Finally, the soft sensor is embedded in the 3D\u2010printed fingertip of a robotic hand to demonstrate its use for pressure mapping along with remote vibrotactile stimulation using SensAct device. The self\u2010controllable actuation of SensAct could provide eSkin the ability to tune stiffness and the vibration states could be utilized for controlled haptic feedback.<\/jats:p><\/jats:sec>","DOI":"10.1002\/aisy.201900145","type":"journal-article","created":{"date-parts":[[2021,1,21]],"date-time":"2021-01-21T13:05:43Z","timestamp":1611234343000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":81,"title":["SensAct: The Soft and Squishy Tactile Sensor with Integrated Flexible Actuator"],"prefix":"10.1002","volume":"3","author":[{"given":"Oliver","family":"Ozioko","sequence":"first","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt School of Engineering University of Glasgow  G12 8 QQ Glasgow UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Prakash","family":"Karipoth","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt School of Engineering University of Glasgow  G12 8 QQ Glasgow UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Pablo","family":"Escobedo","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt School of Engineering University of Glasgow  G12 8 QQ Glasgow UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Markellos","family":"Ntagios","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt School of Engineering University of Glasgow  G12 8 QQ Glasgow UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Abhilash","family":"Pullanchiyodan","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt School of Engineering University of Glasgow  G12 8 QQ Glasgow UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3858-3841","authenticated-orcid":false,"given":"Ravinder","family":"Dahiya","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt School of Engineering University of Glasgow  G12 8 QQ Glasgow UK"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"311","published-online":{"date-parts":[[2021,1,21]]},"reference":[{"key":"e_1_2_9_2_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-018-0045-x"},{"key":"e_1_2_9_2_2","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2018.2890729"},{"key":"e_1_2_9_2_3","doi-asserted-by":"publisher","DOI":"10.1016\/j.mechatronics.2017.11.002"},{"key":"e_1_2_9_2_4","first-page":"31","author":"Dahiya R.","year":"2015","journal-title":"Inf. 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