{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,7,20]],"date-time":"2026-07-20T12:05:25Z","timestamp":1784549125283,"version":"3.55.0"},"reference-count":58,"publisher":"Wiley","issue":"12","license":[{"start":{"date-parts":[[2021,9,27]],"date-time":"2021-09-27T00:00:00Z","timestamp":1632700800000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100000266","name":"Engineering and Physical Sciences Research Council","doi-asserted-by":"publisher","award":["EP\/R029644\/1"],"award-info":[{"award-number":["EP\/R029644\/1"]}],"id":[{"id":"10.13039\/501100000266","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100000266","name":"Engineering and Physical Sciences Research Council","doi-asserted-by":"publisher","award":["EP\/R03480X\/1"],"award-info":[{"award-number":["EP\/R03480X\/1"]}],"id":[{"id":"10.13039\/501100000266","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100000266","name":"Engineering and Physical Sciences Research Council","doi-asserted-by":"publisher","award":["EP\/R511705\/1"],"award-info":[{"award-number":["EP\/R511705\/1"]}],"id":[{"id":"10.13039\/501100000266","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["advanced.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Advanced Intelligent Systems"],"published-print":{"date-parts":[[2021,12]]},"abstract":"<jats:sec><jats:label\/><jats:p>Multimaterial 3D printing in electronics is expanding due to the ability to realize geometrically complex systems with simplified processes compared with conventional printed circuit board. Herein, the feasibility of using a copper\u2010based filament to realize 3D circuits with planar and vertical interconnections is presented. The resistivity of the tracks (1\u20133\u2009mm wide) is studied with reference to printing parameters and orientation. Using lateral infill for 1\u2009mm tracks offers lower resistance compared with longitudinal infill (\u224875%). For wider tracks, the effect of infill orientation on resistance diminishes. The evaluation of tracks embedded in polylactic acid shows a drop in maximum current (to \u224811\u2009mA) compared with exposed tracks (\u224816\u2009mA). There is no observed correlation between electrical performance and number of embedding layers. However, a significant correlation is observed between the tracks\u2019 resistance and the amount of time the filament remains in the heated nozzle. This in\u2010depth study leads to optimum resolution to realize conductive tracks of 0.67\u2009mm thickness and the first integration of fused deposition modeling (FDM)\u2010printed conductive traces with small\u2010outline integrated circuits to open a pathway for higher\u2010density 3D printed circuits. Finally, the transmission of digital data by a 3D printed circuit is demonstrated.<\/jats:p><\/jats:sec>","DOI":"10.1002\/aisy.202100102","type":"journal-article","created":{"date-parts":[[2021,9,28]],"date-time":"2021-09-28T01:43:08Z","timestamp":1632793388000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":62,"title":["Fused Deposition Modeling\u2010Based 3D\u2010Printed Electrical Interconnects and Circuits"],"prefix":"10.1002","volume":"3","author":[{"given":"Habib","family":"Nassar","sequence":"first","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt South Building, School of Engineering University of Glasgow  Glasgow G12 8QQ UK"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3858-3841","authenticated-orcid":false,"given":"Ravinder","family":"Dahiya","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sensing Technologies (BEST) Group James Watt South Building, School of Engineering University of Glasgow  Glasgow G12 8QQ UK"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"311","published-online":{"date-parts":[[2021,9,27]]},"reference":[{"key":"e_1_2_10_2_1","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.201900051"},{"key":"e_1_2_10_3_1","doi-asserted-by":"publisher","DOI":"10.1002\/admt.201700051"},{"key":"e_1_2_10_4_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-014-5717-7"},{"key":"e_1_2_10_5_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2019.2941665"},{"key":"e_1_2_10_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2019.2941366"},{"key":"e_1_2_10_7_1","doi-asserted-by":"crossref","first-page":"65","DOI":"10.1007\/978-94-007-0579-1","volume-title":"Robotic Tactile Sensing : Technologies and System","author":"Dahiya R. S.","year":"2013"},{"key":"e_1_2_10_8_1","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.201900145"},{"key":"e_1_2_10_9_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cad.2015.04.001"},{"key":"e_1_2_10_10_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mser.2018.04.001"},{"key":"e_1_2_10_11_1","volume":"1","author":"Ozioko O.","year":"2021","journal-title":"IEEE Sens. J."},{"key":"e_1_2_10_12_1","first-page":"1900080","author":"Ntagios M.","year":"2019","journal-title":"Adv. Intell. Syst."},{"key":"e_1_2_10_13_1","first-page":"611","volume-title":"Printed Circuit Boards: Design, Fabrication and Assembly","author":"Khandpur R.","year":"2006"},{"key":"e_1_2_10_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.procir.2014.07.059"},{"key":"e_1_2_10_15_1","unstructured":"F.Medina A.Lopes A.Inamdar R.Hennessey J.Palmer B.Chavez D.Davis P.Gallegos R.Wicker inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2005 39\u201349."},{"key":"e_1_2_10_16_1","unstructured":"A. J.Lopes M.Navarrete F.Medina J. A.Palmer E.MacDonald R. B.Wicker inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2006 644\u2013655."},{"key":"e_1_2_10_17_1","unstructured":"J.Palmer D.Davis P.Gallegos P.Yang B.Chaves F.Medina R.Wicker inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2005 476\u2013483."},{"key":"e_1_2_10_18_1","unstructured":"E.Denava M.Navarrete A.Lopes M.Alawneh M.Contreras D.Muse S.Castillo E.Macdonald R.Wicker inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2008 362\u2013369."},{"key":"e_1_2_10_19_1","doi-asserted-by":"publisher","DOI":"10.1108\/13552541211212113"},{"key":"e_1_2_10_20_1","doi-asserted-by":"publisher","DOI":"10.1039\/C7NR04111J"},{"key":"e_1_2_10_21_1","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/26\/10\/105005"},{"key":"e_1_2_10_22_1","doi-asserted-by":"publisher","DOI":"10.1007\/s12541-015-0179-x"},{"key":"e_1_2_10_23_1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2014.2311810"},{"key":"e_1_2_10_24_1","unstructured":"K. H.Church H.Tsang R.Rodriguez P.Defembaugh R.Rumpf inProc. IPC Apex Expo San Diego California USA February2013 1242\u20131261."},{"key":"e_1_2_10_25_1","unstructured":"F.Wasserfall inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2015 180\u2013189."},{"key":"e_1_2_10_26_1","unstructured":"J. A.Lewis M. A.Bell T. A.Busbee J. E.Minardi US10462907B2 2014."},{"key":"e_1_2_10_27_1","doi-asserted-by":"publisher","DOI":"10.1002\/admt.201600013"},{"key":"e_1_2_10_28_1","first-page":"1","author":"Nassar H.","year":"2018","journal-title":"Proc. IEEE Sensors"},{"key":"e_1_2_10_29_1","doi-asserted-by":"publisher","DOI":"10.1109\/TMTT.2015.2496180"},{"key":"e_1_2_10_30_1","unstructured":"K. H.Church X.Chen J. M.Goldfarb C. W.Perkowski S.Leblanc presented atIPC Apex Expo Las Vegas NV March2014."},{"key":"e_1_2_10_31_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2019.2892389"},{"key":"e_1_2_10_32_1","unstructured":"C. J.Robinson E.Paso J. A.Palmer inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2006 60\u201369."},{"key":"e_1_2_10_33_1","unstructured":"D.Periard E.Malone H.Lipson inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2007 503\u2013512."},{"key":"e_1_2_10_34_1","unstructured":"J. I.Lipton D.Cohen H.Lipson inProc. Int. Solid Freeform Fabrication Symp. Austin Texas USA2009 711\u2013723."},{"key":"e_1_2_10_35_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201703817"},{"key":"e_1_2_10_36_1","unstructured":"S.Bijadi M.Sc. Thesis University of Minnesota 2014."},{"key":"e_1_2_10_37_1","first-page":"505","volume-title":"3D 4D Print. Polym. Nanocomposite Mater.","author":"Joshi A.","year":"2020"},{"key":"e_1_2_10_38_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2017.10.002"},{"key":"e_1_2_10_39_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2016.06.008"},{"key":"e_1_2_10_40_1","unstructured":"NinjaTek | Eel https:\/\/ninjatek.com\/eel\/ (accessed: November 2020)."},{"key":"e_1_2_10_41_1","unstructured":"B.Krassenstein Graphene 3D Lab Launches BlackMagic3D Filament Brand & New Graphene 3D Printing Material https:\/\/3dprint.com\/51502\/black-magic-3d-graphene\/ (accessed: November 2020)."},{"key":"e_1_2_10_42_1","doi-asserted-by":"publisher","DOI":"10.1371\/journal.pone.0049365"},{"key":"e_1_2_10_43_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apmt.2017.07.001"},{"key":"e_1_2_10_44_1","unstructured":"3D Printing Circuit Boards and Components https:\/\/www.instructables.com\/id\/3D-Printing-Circuit-Boards-and-Components\/ (accessed: November 2020)."},{"key":"e_1_2_10_45_1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2019.2895620"},{"key":"e_1_2_10_46_1","doi-asserted-by":"publisher","DOI":"10.1108\/13552540810862028"},{"key":"e_1_2_10_47_1","first-page":"136","author":"Shojib Hossain M.","year":"2014","journal-title":"J. Manuf. Sci. Eng."},{"key":"e_1_2_10_48_1","doi-asserted-by":"publisher","DOI":"10.1108\/RPJ-02-2013-0017"},{"key":"e_1_2_10_49_1","doi-asserted-by":"publisher","DOI":"10.1115\/1.1688377"},{"key":"e_1_2_10_50_1","author":"Yardimci M.","year":"1997","journal-title":"Solid Free. Fabr."},{"key":"e_1_2_10_51_1","doi-asserted-by":"publisher","DOI":"10.1108\/13552540010373344"},{"key":"e_1_2_10_52_1","unstructured":"M.Zuza Everything about nozzles with a different diameter - Prusa Printers https:\/\/blog.prusaprinters.org\/everything-about-nozzles-with-a-different-diameter_8344\/ (accessed: November 2020)."},{"key":"e_1_2_10_53_1","unstructured":"B.George Nozzle Sizes \u2014 Bob's Project Notebook beta documentation http:\/\/projects.ttlexceeded.com\/3dprinting_nozzle_sizes.html (accessed: November 2020)."},{"key":"e_1_2_10_54_1","unstructured":"Revolutionizing Electronics Manufacturing | Multi3D https:\/\/www.multi3dllc.com\/ (accessed: November 2020)."},{"key":"e_1_2_10_55_1","doi-asserted-by":"publisher","DOI":"10.1002\/ppsc.201700385"},{"key":"e_1_2_10_56_1","unstructured":"Black Magic 3D B.M. 3D conductive graphene filament http:\/\/graphenelab.com\/blackmagic3d\/Filaments\/Conductive_Graphene_Filament_216x279.pdf (accessed: November 2020)."},{"key":"e_1_2_10_57_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.synthmet.2017.01.009"},{"key":"e_1_2_10_58_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymer.2014.10.064"},{"key":"e_1_2_10_59_1","unstructured":"M. P.Ferrando Troubleshooting I2C Bus Protocol https:\/\/www.ti.com\/lit\/an\/scaa106\/scaa106.pdf?ts=1608507709234&ref_url=https%253A%252F%252Fwww.google.com%252F (accessed: November 2020)."}],"container-title":["Advanced Intelligent Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/aisy.202100102","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/full-xml\/10.1002\/aisy.202100102","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/aisy.202100102","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,7]],"date-time":"2025-10-07T22:13:54Z","timestamp":1759875234000},"score":1,"resource":{"primary":{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/10.1002\/aisy.202100102"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2021,9,27]]},"references-count":58,"journal-issue":{"issue":"12","published-print":{"date-parts":[[2021,12]]}},"alternative-id":["10.1002\/aisy.202100102"],"URL":"https:\/\/doi.org\/10.1002\/aisy.202100102","archive":["Portico"],"relation":{},"ISSN":["2640-4567","2640-4567"],"issn-type":[{"value":"2640-4567","type":"print"},{"value":"2640-4567","type":"electronic"}],"subject":[],"published":{"date-parts":[[2021,9,27]]},"assertion":[{"value":"2021-05-23","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2021-09-27","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"2100102"}}