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Miniaturized and wireless implants with real\u2010time data transfer capability can alleviate the surgical complexities of cardiac pressure monitoring. Despite recent developments of mm\u2010size implants with complex circuitries and self\u2010powering units, a simple, passive, and effective implant design for the real\u2010time pressure reading is missing. Here, the piezo capsule, a simple, cost\u2010effective, and miniaturized passive ultrasound pressure sensing system, is introduced. The capsule design consists of a 1\u2009mm\u2010cube\u2010sized lead zirconate titanate (PZT) transducer and a T\u2010shaped mechanical pin. The impedance changes of an interrogating ultrasound probe, which is ultrasonically coupled to the receiver implant, correlate to the electrical\/mechanical loading of the piezo capsule. The ultrasonic sensing properties of the proposed device are characterized across a hard\u2010solid medium (e.g., plexiglass) and soft tissue\u2010like media (e.g., polydimethylsiloxane (PDMS) and chicken breast tissue) and verified the impedance changes using finite element simulations. Last, dynamic wireless pressure readings of an artificial vessel for varying fluid flow pulse\u2010frequency and volumetric rate are demonstrated. The sensitivity of 0.375\u2009\u03a9\u2009kPa<jats:sup>\u22121<\/jats:sup> is achieved as the pressure changed from 14 to 86\u2009kPa and pulse frequency from 0 to 100\u2009bpm with a fixed flow rate of 8\u2009mL\u2009min<jats:sup>\u22121<\/jats:sup>.<\/jats:p><\/jats:sec>","DOI":"10.1002\/aisy.202200125","type":"journal-article","created":{"date-parts":[[2022,8,10]],"date-time":"2022-08-10T22:06:23Z","timestamp":1660169183000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Piezo Capsule: Ultrasonic Way of Wireless Pressure Measurement"],"prefix":"10.1002","volume":"4","author":[{"given":"Senol","family":"Mutlu","sequence":"first","affiliation":[{"name":"Physical Intelligence Department Max Planck Institute for Intelligent Systems  Stuttgart 70569 Germany"},{"name":"Department of Electrical and Electronics Engineering Bogazici University  Istanbul 34342 Turkey"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-4301-4053","authenticated-orcid":false,"given":"Amirreza","family":"Aghakhani","sequence":"additional","affiliation":[{"name":"Physical Intelligence Department Max Planck Institute for Intelligent Systems  Stuttgart 70569 Germany"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-8249-3854","authenticated-orcid":false,"given":"Metin","family":"Sitti","sequence":"additional","affiliation":[{"name":"Physical Intelligence Department Max Planck Institute for Intelligent Systems  Stuttgart 70569 Germany"},{"name":"School of Medicine and School of Engineering Koc University  Istanbul Turkey"},{"name":"Institute for Biomedical Engineering ETH Zurich  Zurich Switzerland"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2022,8,10]]},"reference":[{"key":"e_1_2_9_2_1","doi-asserted-by":"publisher","DOI":"10.15420\/cfr.2016:25:2"},{"key":"e_1_2_9_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/TBME.2010.2041058"},{"key":"e_1_2_9_4_1","doi-asserted-by":"publisher","DOI":"10.1097\/MAT.0b013e318239f2e9"},{"key":"e_1_2_9_5_1","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-12-822828-9.00001-0"},{"key":"e_1_2_9_6_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2003.820544"},{"key":"e_1_2_9_7_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10544-007-9146-3"},{"key":"e_1_2_9_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2017.2663358"},{"key":"e_1_2_9_9_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-0384-1"},{"key":"e_1_2_9_10_1","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2004.839650"},{"key":"e_1_2_9_11_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41551-020-0518-9"},{"key":"e_1_2_9_12_1","doi-asserted-by":"publisher","DOI":"10.1109\/MMM.2016.2608638"},{"key":"e_1_2_9_13_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ultras.2009.11.004"},{"key":"e_1_2_9_14_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0189-7"},{"key":"e_1_2_9_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/TBCAS.2020.2971066"},{"key":"e_1_2_9_16_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2012.2221233"},{"key":"e_1_2_9_17_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2017.2684910"},{"key":"e_1_2_9_18_1","unstructured":"X.Wu I.Lee Q.Dong K.Yang D.Kim J.Wang Y.Peng Y.Zhang M.Saligane M.Yasuda K.Kumeno F.Ohno S.Miyoshi M.Kawaminami D.Sylvester D.Blaauw in2018 IEEE Symposium on VLSI Circuits IEEE Piscataway NJ pp.191\u2013192."},{"key":"e_1_2_9_19_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCSI.2008.2011578"},{"key":"e_1_2_9_20_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202107758"},{"key":"e_1_2_9_21_1","doi-asserted-by":"publisher","DOI":"10.1088\/0960-1317\/17\/7\/007"},{"key":"e_1_2_9_22_1","doi-asserted-by":"publisher","DOI":"10.1088\/0964-1726\/24\/2\/023001"},{"key":"e_1_2_9_23_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.medengphy.2013.01.001"},{"key":"e_1_2_9_24_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2008.917125"},{"key":"e_1_2_9_25_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSSC.2010.2074090"},{"journal-title":"Smart Mater. 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