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Herein, tunable thermoplastic polyurethane (TPU)\u2010based conductive composite filaments are presented for development of either strain sensors or different circuit elements. The filaments are developed with two filler materials, namely, silver and multiwalled carbon nanotubes (MWCNT). The influences of filler aspect ratio (AR), concentration, functionalization, and morphology on the composites' mechanical, thermal, and electrical properties are studied. Printed tracks of the 10\u2009wt% high\u2010AR MWCNT\/TPU filament exhibit a maximum electrical conductivity of 0.92\u2009S\u2009cm<jats:sup>\u22121<\/jats:sup> and withstand powers &gt;1\u2009W and currents &gt;100\u2009mA. The filament shows negligible change in impedance over the frequency range 1\u2009kHz\u20131\u2009MHz and a change in the resistance of &lt;5% with 90\u00b0 bending. Conversely, printed tracks using filaments with 3\u2009wt% low\u2010AR MWCNT exhibit a change in resistance of \u224830% with 90\u00b0 bending, allowing a clear distinction between various bending angles, and thus could be used for embedded strain\/bend sensors. These results suggest that, with the correct optimization, multimaterial additive manufacturing can be utilized with tunable conductive filaments to fabricate complex 3D electronic systems by constructing reliable circuit tracks, bendable interconnects, and sensors.<\/jats:p>","DOI":"10.1002\/aisy.202300075","type":"journal-article","created":{"date-parts":[[2023,8,21]],"date-time":"2023-08-21T11:56:08Z","timestamp":1692618968000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":6,"title":["Tunable Conductive Composite for Printed Sensors and Embedded Circuits"],"prefix":"10.1002","volume":"5","author":[{"given":"Habib","family":"Nassar","sequence":"first","affiliation":[{"name":"James Watt School of Engineering University of Glasgow  Glasgow G12 8QQ UK"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Abhishek Singh","family":"Dahiya","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sustainable Technologies (BEST) Group Department of Electrical and Computer Engineering Northeastern University  Boston MA 02115 USA"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-3858-3841","authenticated-orcid":false,"given":"Ravinder","family":"Dahiya","sequence":"additional","affiliation":[{"name":"Bendable Electronics and Sustainable Technologies (BEST) Group Department of Electrical and Computer Engineering Northeastern University  Boston MA 02115 USA"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2023,8,17]]},"reference":[{"key":"e_1_2_8_2_1","unstructured":"H.Nassar M.Ntagios W. 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