{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,5,20]],"date-time":"2026-05-20T15:42:51Z","timestamp":1779291771307,"version":"3.51.4"},"reference-count":165,"publisher":"Wiley","issue":"10","license":[{"start":{"date-parts":[[2024,9,29]],"date-time":"2024-09-29T00:00:00Z","timestamp":1727568000000},"content-version":"am","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2024,9,29]],"date-time":"2024-09-29T00:00:00Z","timestamp":1727568000000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"funder":[{"DOI":"10.13039\/501100000923","name":"Australian Research Council","doi-asserted-by":"publisher","award":["DE240100960"],"award-info":[{"award-number":["DE240100960"]}],"id":[{"id":"10.13039\/501100000923","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["advanced.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Advanced Intelligent Systems"],"published-print":{"date-parts":[[2024,10]]},"abstract":"<jats:p>The advent of 3D printing has transformed manufacturing. However, extending the library of materials to improve 3D printing quality remains a challenge. Defects can occur when printing parameters like print speed and temperature are chosen incorrectly. These can cause structural or dimensional issues in the final product. This review investigates closed\u2010loop artificial intelligence\u2010augmented additive manufacturing (AI2AM) technology that integrates AI\u2010based monitoring, automation, and optimization of printing parameters and processes. AI2AM uses AI to improve defect detection and prevention, improving additive manufacturing quality and efficiency. This article explores generic 3D printing processes and issues using existing research and developments. Next, it focuses on fused deposition modeling (FDM) printers and reviews their parameters and issues. The current remedies developed for defect detection and monitoring in FDM 3D printers are presented. Then, the article investigates AI\u2010based 3D printing monitoring, closed\u2010loop feedback systems, and parameter optimization development. Finally, closed\u2010loop 3D printing challenges and future directions are discussed. AI\u2010based systems detect and correct 3D printing failures, enabling current printers to operate within optimal conditions and minimizing the risk of defects or failures, which in turn leads to more sustainable manufacturing with minimum waste and extending the library of materials.<\/jats:p>","DOI":"10.1002\/aisy.202400102","type":"journal-article","created":{"date-parts":[[2024,9,30]],"date-time":"2024-09-30T01:35:50Z","timestamp":1727660150000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":73,"title":["Artificial Intelligence\u2010Augmented Additive Manufacturing: Insights on Closed\u2010Loop 3D Printing"],"prefix":"10.1002","volume":"6","author":[{"ORCID":"https:\/\/orcid.org\/0009-0009-9865-358X","authenticated-orcid":false,"given":"Abdul Rahman","family":"Sani","sequence":"first","affiliation":[{"name":"School of Engineering Deakin University  Geelong Victoria 3216 Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-5302-360X","authenticated-orcid":false,"given":"Ali","family":"Zolfagharian","sequence":"additional","affiliation":[{"name":"School of Engineering Deakin University  Geelong Victoria 3216 Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Abbas Z.","family":"Kouzani","sequence":"additional","affiliation":[{"name":"School of Engineering Deakin University  Geelong Victoria 3216 Australia"}],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2024,9,29]]},"reference":[{"key":"e_1_2_10_2_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesa.2020.106114"},{"key":"e_1_2_10_3_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10462-020-09876-9"},{"key":"e_1_2_10_4_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmrt.2022.10.015"},{"key":"e_1_2_10_5_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.tws.2020.107228"},{"key":"e_1_2_10_6_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.promfg.2018.07.111"},{"key":"e_1_2_10_7_1","unstructured":"H.Al Jassmi F.Al Najjar A.\u2010H. I.Mourad inIOP Conf. Series: Materials Science and Engineering IOP Publishing Bristol UK2018."},{"key":"e_1_2_10_8_1","doi-asserted-by":"publisher","DOI":"10.4028\/p-94a9zb"},{"key":"e_1_2_10_9_1","doi-asserted-by":"publisher","DOI":"10.1007\/s40033-021-00284-z"},{"key":"e_1_2_10_10_1","volume-title":"3D Printing Industry","author":"Petch M.","year":"2018"},{"key":"e_1_2_10_11_1","doi-asserted-by":"publisher","DOI":"10.1007\/s11095-017-2311-3"},{"key":"e_1_2_10_12_1","doi-asserted-by":"publisher","DOI":"10.3390\/ma14010191"},{"key":"e_1_2_10_13_1","doi-asserted-by":"publisher","DOI":"10.34133\/cbsystems.0043"},{"key":"e_1_2_10_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmbbm.2023.105930"},{"key":"e_1_2_10_15_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201503132"},{"key":"e_1_2_10_16_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cej.2019.122565"},{"key":"e_1_2_10_17_1","doi-asserted-by":"publisher","DOI":"10.1002\/aenm.202002815"},{"key":"e_1_2_10_18_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijgfs.2020.100260"},{"key":"e_1_2_10_19_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.egypro.2017.09.562"},{"key":"e_1_2_10_20_1","doi-asserted-by":"publisher","DOI":"10.1080\/14686996.2018.1431862"},{"key":"e_1_2_10_21_1","volume-title":"Actuators","author":"Walker J.","year":"2020"},{"key":"e_1_2_10_22_1","doi-asserted-by":"publisher","DOI":"10.1088\/0964-1726\/25\/11\/115009"},{"key":"e_1_2_10_23_1","doi-asserted-by":"publisher","DOI":"10.34133\/cbsystems.0009"},{"key":"e_1_2_10_24_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.coche.2020.04.001"},{"key":"e_1_2_10_25_1","volume-title":"International Scholarly Research Notices","author":"Wong K. V.","year":"2012"},{"key":"e_1_2_10_26_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2020.10.225"},{"key":"e_1_2_10_27_1","doi-asserted-by":"publisher","DOI":"10.1155\/2021\/5756563"},{"key":"e_1_2_10_28_1","doi-asserted-by":"publisher","DOI":"10.1080\/17436753.2018.1447834"},{"key":"e_1_2_10_29_1","first-page":"396","volume":"7","author":"Ramya A.","year":"2016","journal-title":"Int. J. Mech. Eng. Technol."},{"key":"e_1_2_10_30_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmrt.2021.07.050"},{"key":"e_1_2_10_31_1","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-323-58118-9.00002-6"},{"key":"e_1_2_10_32_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ifacol.2016.11.111"},{"key":"e_1_2_10_33_1","unstructured":"Massachusetts Institute of Technology Larry Hornbeck | Lemelson 2024 https:\/\/lemelson.mit.edu\/resources\/larry\u2010hornbeck(accessed: December 2023)."},{"key":"e_1_2_10_34_1","doi-asserted-by":"publisher","DOI":"10.1007\/s40964-022-00336-0"},{"key":"e_1_2_10_35_1","unstructured":"A.Pandian C.Belavek in2016 ASEE North Central Section Conf. American Society for Engineering Education Michigan MI2016."},{"key":"e_1_2_10_36_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4939-2113-3"},{"key":"e_1_2_10_37_1","doi-asserted-by":"publisher","DOI":"10.1080\/17452759.2013.778175"},{"key":"e_1_2_10_38_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mio.2016.08.001"},{"key":"e_1_2_10_39_1","doi-asserted-by":"publisher","DOI":"10.2174\/1389450120666190114122815"},{"key":"e_1_2_10_40_1","volume-title":"Application of SLA 3D Printing for Polymers","author":"Wilson T.","year":"2022"},{"key":"e_1_2_10_41_1","volume-title":"Intelligent Systems in Design and Manufacturing","author":"Park W. S.","year":"1998"},{"key":"e_1_2_10_42_1","doi-asserted-by":"publisher","DOI":"10.3390\/polym15122716"},{"key":"e_1_2_10_43_1","unstructured":"G.Chouhan P.Bidare R.Doodi G. B.Murali inInt. Conf. Research into Design Springer New York NY USA2023."},{"key":"e_1_2_10_44_1","volume-title":"XZEED DLP. A Multi\u2010Material 3D Printer Using DLP Technology","author":"Holtrup R.","year":"2015"},{"key":"e_1_2_10_45_1","first-page":"281","volume":"5","author":"Kortelainen J.","year":"2021","journal-title":"Int. J. 3D Print. Technol. Digit. Ind."},{"key":"e_1_2_10_46_1","doi-asserted-by":"crossref","unstructured":"P.Yogesh P.Richa S.Chandrashekhar Advances in Additive Manufacturing and Joining: Proc. AIMTDR 2018 Springer New York NY USA2019 pp.179\u2013187.","DOI":"10.1007\/978-981-32-9433-2_15"},{"key":"e_1_2_10_47_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jeurceramsoc.2022.09.055"},{"key":"e_1_2_10_48_1","volume-title":"Materials Science Forum","author":"Khirotdin R. K.","year":"2017"},{"key":"e_1_2_10_49_1","doi-asserted-by":"publisher","DOI":"10.3390\/app12157373"},{"key":"e_1_2_10_50_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.promfg.2021.06.037"},{"key":"e_1_2_10_51_1","doi-asserted-by":"publisher","DOI":"10.1088\/2053-1591\/abcc5d"},{"key":"e_1_2_10_52_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-017-06504-5"},{"key":"e_1_2_10_53_1","doi-asserted-by":"publisher","DOI":"10.1177\/1687814020916951"},{"key":"e_1_2_10_54_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2019.02.020"},{"key":"e_1_2_10_55_1","doi-asserted-by":"publisher","DOI":"10.3390\/ma13020255"},{"key":"e_1_2_10_56_1","doi-asserted-by":"publisher","DOI":"10.1080\/09506608.2015.1116649"},{"key":"e_1_2_10_57_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-019-04105-2"},{"key":"e_1_2_10_58_1","volume-title":"Investigation of Residual Stresses in the Laser Melting of Metal Powders in Additive Layer Manufacturing","author":"Roberts I. A.","year":"2012"},{"key":"e_1_2_10_59_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmachtools.2022.103908"},{"key":"e_1_2_10_60_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2020.10.436"},{"key":"e_1_2_10_61_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.pmatsci.2020.100707"},{"key":"e_1_2_10_62_1","doi-asserted-by":"publisher","DOI":"10.3390\/polym15102280"},{"key":"e_1_2_10_63_1","first-page":"708","volume":"12","author":"Bayas E.","year":"2023","journal-title":"Eur. Chem. Bull."},{"key":"e_1_2_10_64_1","unstructured":"3D Printer Nozzle Guide \u2010 Everything about 3D Printer Nozzles https:\/\/www.3djake.com\/info\/guide\/3d\u2010printer\u2010nozzle\u2010guide(accessed: January 2024)."},{"key":"e_1_2_10_65_1","doi-asserted-by":"publisher","DOI":"10.1080\/15583724.2019.1597883"},{"key":"e_1_2_10_66_1","doi-asserted-by":"publisher","DOI":"10.2139\/ssrn.4459139"},{"key":"e_1_2_10_67_1","doi-asserted-by":"publisher","DOI":"10.3390\/mi13040553"},{"key":"e_1_2_10_68_1","doi-asserted-by":"publisher","DOI":"10.1177\/0954406219861664"},{"key":"e_1_2_10_69_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-022-10795-y"},{"key":"e_1_2_10_70_1","doi-asserted-by":"publisher","DOI":"10.1007\/978-1-4842-0025-4"},{"key":"e_1_2_10_71_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2021.10.003"},{"key":"e_1_2_10_72_1","volume-title":"A Review on Optimization of Process Parameters of Fused Deposition Modeling Research on Engineering Structures & Materials","author":"Suniya N. K.","year":"2023"},{"key":"e_1_2_10_73_1","doi-asserted-by":"publisher","DOI":"10.1007\/s40436-014-0097-7"},{"key":"e_1_2_10_74_1","first-page":"284","volume":"3","author":"Abeykoon C.","year":"2020","journal-title":"Int. J. Lightweight Mater. Manuf."},{"key":"e_1_2_10_75_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2017.03.065"},{"key":"e_1_2_10_76_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2022.02.310"},{"key":"e_1_2_10_77_1","doi-asserted-by":"publisher","DOI":"10.3390\/app10144776"},{"key":"e_1_2_10_78_1","doi-asserted-by":"publisher","DOI":"10.1007\/s12008-022-01026-5"},{"key":"e_1_2_10_79_1","doi-asserted-by":"publisher","DOI":"10.1080\/10426914.2019.1594252"},{"key":"e_1_2_10_80_1","doi-asserted-by":"publisher","DOI":"10.59761\/RCR5103"},{"key":"e_1_2_10_81_1","unstructured":"K.G\u00fcnayd\u0131n H. S.T\u00fcrkmen inInt. Congress on 3D Printing (Additive Manufacturing) Technologies and Digital Industry Antalya Turkey2018."},{"key":"e_1_2_10_82_1","doi-asserted-by":"publisher","DOI":"10.3390\/nano10071300"},{"key":"e_1_2_10_83_1","doi-asserted-by":"publisher","DOI":"10.1108\/RPJ-04-2016-0054"},{"key":"e_1_2_10_84_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijmecsci.2016.11.032"},{"key":"e_1_2_10_85_1","doi-asserted-by":"publisher","DOI":"10.26434\/chemrxiv-2023-lw1ns"},{"key":"e_1_2_10_86_1","unstructured":"L.Bergonzi M.Vettori L.Stefanini L.D'Alcamo IOP Conf. Series: Materials Science and Engineering IOP Publishing Bristol UK2021."},{"key":"e_1_2_10_87_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2020.10.482"},{"key":"e_1_2_10_88_1","unstructured":"F. R.Ramli M. A.Nazan inProc. SAKURA Symp. Mechanical Science and Engineering Kyushu Japan2017."},{"key":"e_1_2_10_89_1","doi-asserted-by":"publisher","DOI":"10.11113\/jurnalteknologi.v85.18610"},{"key":"e_1_2_10_90_1","first-page":"8","volume":"2","author":"Haque M. S. S.","year":"2020","journal-title":"ResearchGate"},{"key":"e_1_2_10_91_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2017.09.007"},{"key":"e_1_2_10_92_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-017-1340-8"},{"key":"e_1_2_10_93_1","doi-asserted-by":"publisher","DOI":"10.1007\/s12588-018-9206-y"},{"key":"e_1_2_10_94_1","doi-asserted-by":"publisher","DOI":"10.1515\/eng-2021-0063"},{"key":"e_1_2_10_95_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2019.06.005"},{"key":"e_1_2_10_96_1","doi-asserted-by":"publisher","DOI":"10.12691\/ajme-7-2-1"},{"key":"e_1_2_10_97_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2022.11.008"},{"key":"e_1_2_10_98_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymertesting.2020.106483"},{"key":"e_1_2_10_99_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtcomm.2019.100626"},{"key":"e_1_2_10_100_1","doi-asserted-by":"publisher","DOI":"10.3390\/polym13213737"},{"key":"e_1_2_10_101_1","unstructured":"G.Fazzini P.Paolini R.Paolucci D.Chiulli G.Barile A.Leoni M.MuttilloL.PantoliG.Ferri in2019 II Workshop On Metrology For Industry 4.0 And IoT (MetroInd4. 0&IoT) IEEE Piscataway NJ2019."},{"key":"e_1_2_10_102_1","doi-asserted-by":"crossref","unstructured":"C.Yang J.Liu X.Ao H.Xia inIOP Conf. Series: Earth and Environmental Science IOP Publishing Bristol UK Vol.772 2021 p.012069.","DOI":"10.1088\/1755-1315\/772\/1\/012069"},{"key":"e_1_2_10_103_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2023.103483"},{"key":"e_1_2_10_104_1","doi-asserted-by":"crossref","unstructured":"Y.Wu Z.Dai H.Liu L.Wang M. P.Nemitz 2024 IEEE 7th Int. Conf. on Soft Robotics (RoboSoft) San Diego CA USA2024 pp.249\u2013254.","DOI":"10.1109\/RoboSoft60065.2024.10521961"},{"key":"e_1_2_10_105_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2022.102838"},{"key":"e_1_2_10_106_1","doi-asserted-by":"publisher","DOI":"10.3390\/asi4020034"},{"key":"e_1_2_10_107_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cie.2021.107314"},{"key":"e_1_2_10_108_1","doi-asserted-by":"publisher","DOI":"10.3390\/machines3020055"},{"key":"e_1_2_10_109_1","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.201900130"},{"key":"e_1_2_10_110_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmapro.2020.08.036"},{"key":"e_1_2_10_111_1","doi-asserted-by":"publisher","DOI":"10.3390\/machines11070712"},{"key":"e_1_2_10_112_1","doi-asserted-by":"publisher","DOI":"10.1007\/s40964-019-00108-3"},{"key":"e_1_2_10_113_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.addma.2018.04.005"},{"key":"e_1_2_10_114_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10845-022-01957-6"},{"key":"e_1_2_10_115_1","doi-asserted-by":"publisher","DOI":"10.1155\/2018\/3426928"},{"key":"e_1_2_10_116_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.precisioneng.2019.06.004"},{"key":"e_1_2_10_117_1","unstructured":"Y.Banadaki N.Razaviarab H.Fekrmandi S.Sharifi arXiv preprint arXiv:2003.087492020."},{"key":"e_1_2_10_118_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2021.109726"},{"key":"e_1_2_10_119_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmsy.2019.04.002"},{"key":"e_1_2_10_120_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmapro.2021.08.057"},{"key":"e_1_2_10_121_1","doi-asserted-by":"publisher","DOI":"10.1109\/TMECH.2020.2996223"},{"key":"e_1_2_10_122_1","doi-asserted-by":"publisher","DOI":"10.3390\/pr8111464"},{"key":"e_1_2_10_123_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-020-06201-0"},{"key":"e_1_2_10_124_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matpr.2022.09.006"},{"key":"e_1_2_10_125_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2017.07.001"},{"key":"e_1_2_10_126_1","unstructured":"Q.Zhang M.Zhang C.Gamanayake C.Yuen Z.Geng H.Jayasekaraand X.Zhang C.Woo J.Low X.Liu 2020 IEEE 18th Int. Conf. Industrial Informatics (INDIN) IEEE Piscataway NJ2020."},{"key":"e_1_2_10_127_1","doi-asserted-by":"publisher","DOI":"10.1122\/1.5054648"},{"key":"e_1_2_10_128_1","unstructured":"I.Cummings E.Hillstrom R.Newton E.Flynn A.Wachtor inTopics in Modal Analysis & Testing Volume 10: Proc. 34th IMAC A Conf. Exposition on Structural Dynamics 2016 Springer New York NY USA2016."},{"key":"e_1_2_10_129_1","volume-title":"AIAA Scitech 2020 Forum","author":"De Backer W.","year":"2020"},{"key":"e_1_2_10_130_1","doi-asserted-by":"publisher","DOI":"10.3390\/s19112589"},{"key":"e_1_2_10_131_1","volume-title":"Materials Science Forum","author":"Jhodkar D.","year":"2021"},{"key":"e_1_2_10_132_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.rcim.2018.05.010"},{"key":"e_1_2_10_133_1","doi-asserted-by":"publisher","DOI":"10.3390\/s23177524"},{"key":"e_1_2_10_134_1","doi-asserted-by":"publisher","DOI":"10.3390\/s22020517"},{"key":"e_1_2_10_135_1","doi-asserted-by":"publisher","DOI":"10.1080\/0951192X.2021.1901316"},{"key":"e_1_2_10_136_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-020-05663-6"},{"key":"e_1_2_10_137_1","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202300152"},{"key":"e_1_2_10_138_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2019.108411"},{"key":"e_1_2_10_139_1","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.aba5575"},{"key":"e_1_2_10_140_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201707495"},{"key":"e_1_2_10_141_1","doi-asserted-by":"publisher","DOI":"10.34133\/cbsystems.0105"},{"key":"e_1_2_10_142_1","unstructured":"D.Sayani Building A Smarter Tomorrow: The Role of AI in Optimizing 3D Printing|3DX Additive Manufacturing https:\/\/3dx.ae\/blogs\/2023\/08\/ai\u2010in\u2010optimizing\u20103d\u2010printing\/(accessed: August 2023)."},{"key":"e_1_2_10_143_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtbio.2023.100792"},{"key":"e_1_2_10_144_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-022-31985-y"},{"key":"e_1_2_10_145_1","doi-asserted-by":"publisher","DOI":"10.3390\/su141811618"},{"key":"e_1_2_10_146_1","doi-asserted-by":"publisher","DOI":"10.1088\/2057-1976\/acf581"},{"key":"e_1_2_10_147_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2020.108018"},{"key":"e_1_2_10_148_1","doi-asserted-by":"publisher","DOI":"10.3390\/ma14010163"},{"key":"e_1_2_10_149_1","volume-title":"AIP Conf. Proc","author":"Shariff Z. A.","year":"2021"},{"key":"e_1_2_10_150_1","doi-asserted-by":"publisher","DOI":"10.1002\/qre.3513"},{"key":"e_1_2_10_151_1","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202200462"},{"key":"e_1_2_10_152_1","doi-asserted-by":"publisher","DOI":"10.3390\/pr11102892"},{"key":"e_1_2_10_153_1","doi-asserted-by":"publisher","DOI":"10.1080\/0951192X.2022.2145019"},{"key":"e_1_2_10_154_1","unstructured":"Diagnosing a Print Failure (SLA) https:\/\/support.formlabs.com\/s\/article\/Diagnosing\u2010a\u2010print\u2010failure?language=en_US(accessed: Jan 2024)."},{"key":"e_1_2_10_155_1","unstructured":"How to Fix Resin 3D Print Not Sticking to Build Plate But FEP Film https:\/\/www.anycubic.com\/blogs\/3d\u2010printing\u2010guides\/fix\u2010resin\u2010print\u2010not\u2010sticking\u2010to\u2010buildplate(accessed: June 2023)."},{"key":"e_1_2_10_156_1","unstructured":"mchughnoel.DLP 3D Printing Troubleshooting \u2010 L3D https:\/\/l3d.ie\/2018\/06\/29\/dlp\u20103d\u2010printing\u2010troubleshooting\/(accessed: June 2018)."},{"key":"e_1_2_10_157_1","doi-asserted-by":"publisher","DOI":"10.20517\/ss.2022.08"},{"key":"e_1_2_10_158_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-022-08860-7"},{"key":"e_1_2_10_159_1","doi-asserted-by":"publisher","DOI":"10.1007\/s12206-017-0415-7"},{"key":"e_1_2_10_160_1","doi-asserted-by":"publisher","DOI":"10.1590\/s1517-707620200003.1126"},{"key":"e_1_2_10_161_1","doi-asserted-by":"publisher","DOI":"10.1007\/s11665-021-05832-y"},{"key":"e_1_2_10_162_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-018-2820-1"},{"key":"e_1_2_10_163_1","volume-title":"Quality Control\u2010An Anthology of Cases","author":"Randermann M.","year":"2022"},{"key":"e_1_2_10_164_1","doi-asserted-by":"publisher","DOI":"10.1002\/aisy.202200229"},{"key":"e_1_2_10_165_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymer.2018.04.024"},{"key":"e_1_2_10_166_1","unstructured":"C.Chakaravarthi Comparison Guide To Efficiently Fabricate Electronic Enclosures For Your Products https:\/\/circuitdigest.com\/article\/comparision\u2010guide\u2010to\u2010efficiently\u2010fabricate\u2010electronic\u2010enclosures\u2010for\u2010your\u2010products(accessed: May 2020)."}],"container-title":["Advanced Intelligent Systems"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/aisy.202400102","content-type":"application\/pdf","content-version":"vor","intended-application":"syndication"},{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/aisy.202400102","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,7]],"date-time":"2025-10-07T18:52:45Z","timestamp":1759863165000},"score":1,"resource":{"primary":{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/10.1002\/aisy.202400102"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,9,29]]},"references-count":165,"journal-issue":{"issue":"10","published-print":{"date-parts":[[2024,10]]}},"alternative-id":["10.1002\/aisy.202400102"],"URL":"https:\/\/doi.org\/10.1002\/aisy.202400102","archive":["Portico"],"relation":{},"ISSN":["2640-4567","2640-4567"],"issn-type":[{"value":"2640-4567","type":"print"},{"value":"2640-4567","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,9,29]]},"assertion":[{"value":"2024-02-05","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-09-29","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"2400102"}}