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On the other hand fast turnaround manufacturing requires the use of simple and proven technologies so that the product will be easily manufacturable, possibly in more than one foundry.<\/jats:p><jats:p>Some of the available technologies to implement mutilevel interconnections will be reviewed and the one chosen by VLSI Technology for their 1 \u03bcm ASIC process will be briefly described.<\/jats:p>","DOI":"10.1002\/ett.4460010217","type":"journal-article","created":{"date-parts":[[2008,9,12]],"date-time":"2008-09-12T13:02:15Z","timestamp":1221224535000},"page":"179-184","source":"Crossref","is-referenced-by-count":0,"title":["Interconnections in application specific VLSI"],"prefix":"10.1002","volume":"1","author":[{"given":"Dipankar","family":"Pramanik","sequence":"first","affiliation":[]},{"given":"Gianpaolo","family":"Spadini","sequence":"additional","affiliation":[]}],"member":"311","published-online":{"date-parts":[[2008,9,12]]},"reference":[{"issue":"1","key":"e_1_2_1_2_2","first-page":"127","article-title":"VLSI metallization using Afuminum and its allow","volume":"26","author":"Pramanik D.","year":"1983","journal-title":"Solid Scare Technology."},{"key":"e_1_2_1_3_2","first-page":"13","volume-title":"Effect of thin film interactrons on Silicon device technology. 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