{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2023,10,23]],"date-time":"2023-10-23T05:06:11Z","timestamp":1698037571657},"reference-count":0,"publisher":"Wiley","issue":"2","license":[{"start":{"date-parts":[[2008,9,12]],"date-time":"2008-09-12T00:00:00Z","timestamp":1221177600000},"content-version":"vor","delay-in-days":6770,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Trans Emerging Tel Tech"],"published-print":{"date-parts":[[1990,3]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>This paper first presents an overview of present packaging technologies and their market shares for simple and complex (VLSI\u2010type) IC's, and the resulting trends and driving forces for future packaging developments. Then some of the limiting parameters of packaging of high performance IC's are outlined. The importance and cost of reability evaluations, trends in component qualification procedures, and their combined effects on device manufacturing technology are discussed. Finally, interconnection methods to the next packaging level (PWB etc.), the related assembly technologies, and the subsystem performance factors are described.<\/jats:p>","DOI":"10.1002\/ett.4460010219","type":"journal-article","created":{"date-parts":[[2008,9,12]],"date-time":"2008-09-12T13:04:20Z","timestamp":1221224660000},"page":"195-199","source":"Crossref","is-referenced-by-count":0,"title":["IC packaging and interconnections\u2010status and trends"],"prefix":"10.1002","volume":"1","author":[{"given":"Arnold","family":"Pfahnl","sequence":"first","affiliation":[]}],"member":"311","published-online":{"date-parts":[[2008,9,12]]},"container-title":["European Transactions on Telecommunications"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.wiley.com\/onlinelibrary\/tdm\/v1\/articles\/10.1002%2Fett.4460010219","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/ett.4460010219","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,22]],"date-time":"2023-10-22T09:21:57Z","timestamp":1697966517000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1002\/ett.4460010219"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1990,3]]},"references-count":0,"journal-issue":{"issue":"2","published-print":{"date-parts":[[1990,3]]}},"alternative-id":["10.1002\/ett.4460010219"],"URL":"https:\/\/doi.org\/10.1002\/ett.4460010219","archive":["Portico"],"relation":{},"ISSN":["1124-318X","1541-8251"],"issn-type":[{"value":"1124-318X","type":"print"},{"value":"1541-8251","type":"electronic"}],"subject":[],"published":{"date-parts":[[1990,3]]}}}