{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,17]],"date-time":"2026-03-17T03:32:55Z","timestamp":1773718375984,"version":"3.50.1"},"reference-count":10,"publisher":"Wiley","issue":"12","license":[{"start":{"date-parts":[[2007,3,22]],"date-time":"2007-03-22T00:00:00Z","timestamp":1174521600000},"content-version":"vor","delay-in-days":6289,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Systems &amp; Computers in Japan"],"published-print":{"date-parts":[[1990,1]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>This paper reports on the defect detection algorithm for the LSI wafer multilayer patterns, together with the result of evaluation. The multilayer patterns are constructed by the exposure after alignment between the wafer pattern and the reticle pattern for each chip. Consequently, the position relation between layers is different even for adjacent chips (interlayer registration error). The developed algorithm compares the gray\u2010level images of adjacent chips on the wafer and extracts the defect without being affected by the inter\u2010layer registration error. First, the pattern edge is extracted from the gray\u2010level image, and the position alignment is executed using the edges. Then, by eliminating the region where gray levels are equal, the regions are extracted for which the position alignment is unsatisfactory. The position alignment is attempted again for that region. This procedure is iterated. When the unmatched region of the pattern edge is sufficiently small, it is decided that the interlayer registration error is absorbed, and the unmatched region is extracted as the defect. An automatic visual inspection system was constructed and evaluated experimentally. As a result, it was verified that the whole chip area can be inspected, and the defect of 0.5 \u03bcm or more can be detected in a stable way.<\/jats:p>","DOI":"10.1002\/scj.4690211208","type":"journal-article","created":{"date-parts":[[2007,7,7]],"date-time":"2007-07-07T19:13:01Z","timestamp":1183835581000},"page":"65-77","source":"Crossref","is-referenced-by-count":7,"title":["Automated visual inspection for lsi water multilayer patterns by cascade pattern matching algorithm"],"prefix":"10.1002","volume":"21","author":[{"given":"Shunji","family":"Maeda","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hitoshi","family":"Kubota","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Hiroshi","family":"Makihira","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Takanori","family":"Ninomiya","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yasuo Nakagawa,","family":"Nonmember","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Yuzo Taniguchi,","family":"Nonmember","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2007,3,22]]},"reference":[{"key":"e_1_2_1_2_2","doi-asserted-by":"crossref","unstructured":"P.EraserandB.Wallman.Database inspection of wafer resist images. SPIE Optical Microlithography IV pp.122\u2013129(March1985).","DOI":"10.1117\/12.947756"},{"key":"e_1_2_1_3_2","doi-asserted-by":"publisher","DOI":"10.1117\/12.967057"},{"key":"e_1_2_1_4_2","unstructured":"Y.Matsuyama H.Iwata H.Kubota andY.Nakagawa.Precise visual inspection algorithm for LSI wafer patterns using comparison of gray\u2010scale image comparison. 2nd Symp. Image Sens. in Indust. pp.295\u2013300(July1987)."},{"issue":"11","key":"e_1_2_1_5_2","first-page":"1687","article-title":"Realtime image processing algorithm for visual inspection of semiconductor wafer patterns","volume":"69","author":"Sakou Y.","year":"1986","journal-title":"Trans. (D), I. E. I. C. E., Japan"},{"issue":"4","key":"e_1_2_1_6_2","first-page":"385","article-title":"Study of automating inspection of Al circuit pattern of LSI wafers","volume":"69","author":"Hara Y.","year":"1986","journal-title":"Trans. (C), I. E. I. C. E., Japan"},{"key":"e_1_2_1_7_2","unstructured":"K.Harris P.Sandland andR.Singleton.Automated inspection of wafer patterns with applications in stepping projection and direct write lithography. Solid\u2010State Technology pp.159\u2013179(Feb.1984)."},{"key":"e_1_2_1_8_2","unstructured":"Lasertech Corp.3WD 36 automatic wafer inspection system catalog."},{"key":"e_1_2_1_9_2","doi-asserted-by":"publisher","DOI":"10.1007\/BF01212360"},{"key":"e_1_2_1_10_2","doi-asserted-by":"publisher","DOI":"10.1116\/1.584136"},{"key":"e_1_2_1_11_2","article-title":"Automatic visual inspection of LSI wafer multilayer pattern by cascade pattern matching. Papers of Technical Group on Information Engineering","volume":"87","author":"Maeda S.","year":"1987","journal-title":"I. E. I. C. E., Japan"}],"container-title":["Systems and Computers in Japan"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.wiley.com\/onlinelibrary\/tdm\/v1\/articles\/10.1002%2Fscj.4690211208","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/scj.4690211208","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,10,22]],"date-time":"2023-10-22T11:02:10Z","timestamp":1697972530000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1002\/scj.4690211208"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1990,1]]},"references-count":10,"journal-issue":{"issue":"12","published-print":{"date-parts":[[1990,1]]}},"alternative-id":["10.1002\/scj.4690211208"],"URL":"https:\/\/doi.org\/10.1002\/scj.4690211208","archive":["Portico"],"relation":{},"ISSN":["0882-1666","1520-684X"],"issn-type":[{"value":"0882-1666","type":"print"},{"value":"1520-684X","type":"electronic"}],"subject":[],"published":{"date-parts":[[1990,1]]}}}