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Epoxy\u2010based shape memory polymers (SMPs) have shown great potential for various 4D printing applications. However, due to their thermocurable nature, the fabrication of 4D constructs using epoxy\u2010based materials is often limited to a mold casting strategy, limiting design flexibility and often yielding flat structures. In this work, photocurable smart 4D inks are developed by integrating polyethylene glycol diacrylate (PD) into epoxy\u2010based materials. These inks undergo a two\u2010step crosslinking process: i) photocuring of the PD network, and ii) thermocuring of the SMP, resulting in an interpenetrating polymer network (IPN). The inclusion of PD in the 4D inks not only enables the formation of complex shapes via the restructuring step but also allows for fine\u2010tuning of mechanical properties and thermal responsiveness. Additionally, these inks offered greater versatility in employable fabrication techniques, including mold casting, photolithography, and stereolithography (SLA).<\/jats:p>","DOI":"10.1002\/adhm.202501574","type":"journal-article","created":{"date-parts":[[2025,7,1]],"date-time":"2025-07-01T03:00:56Z","timestamp":1751338856000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Development of Smart Photocrosslinkable Epoxy\u2010Based Inks for 4D Printing"],"prefix":"10.1002","volume":"15","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3300-7781","authenticated-orcid":false,"given":"Tarun","family":"Agarwal","sequence":"first","affiliation":[{"name":"Department of Mechanical and Aerospace Engineering The George Washington University  Washington DC 20052 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Shengbo","family":"Guo","sequence":"additional","affiliation":[{"name":"Department of Mechanical 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