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Here, it is reported on Ti<jats:sub>3<\/jats:sub>C<jats:sub>2<\/jats:sub>T<jats:italic><jats:sub>x<\/jats:sub><\/jats:italic> MXene microstrip transmission lines with low\u2010energy attenuation and patch antennas with high\u2010power radiation at frequencies from 5.6 to 16.4\u00a0GHz. The radiation efficiency of a 5.5\u00a0\u00b5m thick MXene patch antenna manufactured by spray\u2010coating from aqueous solution reaches 99% at 16.4\u00a0GHz, which is about the same as that of a standard 35\u00a0\u00b5m thick copper patch antenna at about 15% of its thickness and 7% of the copper weight. MXene outperforms all other materials evaluated for patch antennas to date. Moreover, it is demonstrated that an MXene patch antenna array with integrated feeding circuits on a conformal surface has comparable performance with that of a copper antenna array at 28\u00a0GHz, which is a target frequency in practical 5G applications. The versatility of MXene antennas in wide frequency ranges coupled with the flexibility, scalability, and ease of solution processing makes MXene promising for integrated RF components in various flexible electronic devices.<\/jats:p>","DOI":"10.1002\/adma.202003225","type":"journal-article","created":{"date-parts":[[2020,11,30]],"date-time":"2020-11-30T03:05:25Z","timestamp":1606705525000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":183,"title":["Solution\u2010Processed Ti<sub>3<\/sub>C<sub>2<\/sub>T<i><sub>x<\/sub><\/i> MXene Antennas for Radio\u2010Frequency Communication"],"prefix":"10.1002","volume":"33","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3309-988X","authenticated-orcid":false,"given":"Meikang","family":"Han","sequence":"first","affiliation":[{"name":"A. J. 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Drexel Nanomaterials Institute and Department of Materials Science and Engineering Drexel University  Philadelphia PA 19104 USA"},{"name":"Department of Electrical and Computer Engineering Drexel University  Philadelphia PA 19104 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Christopher","family":"Israel","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering Villanova University  Villanova PA 19085 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-6656-3776","authenticated-orcid":false,"given":"Md Abu Saleh","family":"Tajin","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering Drexel University  Philadelphia PA 19104 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gary","family":"Friedman","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering Drexel University  Philadelphia PA 19104 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vladimir","family":"Volman","sequence":"additional","affiliation":[{"name":"Lockheed Martin Co.  Moorestown NJ 08057 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9707-7463","authenticated-orcid":false,"given":"Ahmad","family":"Hoorfar","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering Villanova University  Villanova PA 19085 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1936-2514","authenticated-orcid":false,"given":"Kapil R.","family":"Dandekar","sequence":"additional","affiliation":[{"name":"Department of Electrical and Computer Engineering Drexel University  Philadelphia PA 19104 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9423-4032","authenticated-orcid":false,"given":"Yury","family":"Gogotsi","sequence":"additional","affiliation":[{"name":"A. J. 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