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Reliable transfer methods for wafer\u2010scale 2D materials are a key prerequisite. As one of the most promising 2D semiconductors, bismuth oxygen selenide (Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se) films show significant promise as high\u2010performance photodetectors and advanced\u2010architecture transistors. Although considerable efforts have been devoted to transfer methods for 2D Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se, challenges such as limited film size, transfer\u2010induced defects, cracks, and contamination remain. Herein, we report a novel transfer method for wafer\u2010scale 2D Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se single\u2010crystal films based on the stress modulation of metal films. A composite transfer medium comprising tensile\u2010stressed Ni and stress\u2010free Cu was developed to enable intact and crack\u2010free exfoliation of 2D Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se films. By modulating the strain and fracture energies of the composite metal film, the transferred 4\u2010inch 2D Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se film exhibited a crack\u2010free, intact, and uniform morphology, and two\u2010layer and three\u2010layer\u2010stacked 2D Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se films with clean interfaces were fabricated. Integrated 2D Bi\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>2<\/jats:sub>\n                    Se transistors exhibit high carrier mobility reaching up to \u223c150 cm\n                    <jats:sup>2<\/jats:sup>\n                    V\n                    <jats:sup>\u22121<\/jats:sup>\n                    s\n                    <jats:sup>\u22121<\/jats:sup>\n                    with an on\/off ratio \u223c10\n                    <jats:sup>6<\/jats:sup>\n                    , which is better than other transferred wafer\u2010scale 2D semiconductors. Overall, our findings are promising for the future integration of 2D materials into advanced electronics and optoelectronics.\n                  <\/jats:p>","DOI":"10.1002\/adma.72808","type":"journal-article","created":{"date-parts":[[2026,4,2]],"date-time":"2026-04-02T13:16:07Z","timestamp":1775135767000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["Monolithic Integration of Crack\u2010Free 2D Bi\n                    <sub>2<\/sub>\n                    O\n                    <sub>2<\/sub>\n                    Se via Stress Modulation"],"prefix":"10.1002","volume":"38","author":[{"given":"Xin","family":"Gao","sequence":"first","affiliation":[{"name":"Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yuteng","family":"Wang","sequence":"additional","affiliation":[{"name":"Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Boyang","family":"Fu","sequence":"additional","affiliation":[{"name":"Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ye","family":"Li","sequence":"additional","affiliation":[{"name":"Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chengyuan","family":"Xue","sequence":"additional","affiliation":[{"name":"Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weiyu","family":"Sun","sequence":"additional","affiliation":[{"name":"Center for Nanochemistry Beijing Science and Engineering Center for Nanocarbons Beijing National Laboratory for Molecular Sciences College of Chemistry and Molecular Engineering Peking University  Beijing China"},{"name":"Academy for Advanced Interdisciplinary Studies Peking University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tingkai","family":"Feng","sequence":"additional","affiliation":[{"name":"Center for Nanochemistry 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