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In this study, we present an unconventional electrochemical strategy to achieve unexpected hydroxyl radical (\u2022OH) generation at a remarkably low voltage of 0.4\u00a0V (vs. Ag\/AgCl). This is realized through an integrated system comprising CPs of poly(fluorene\u2010alt\u2010thienopyrazine) (PFTP) adsorbed onto the partially oxidized copper sheet. Microscopy and surface analysis techniques demonstrated that the Cu\n                    <jats:sub>2<\/jats:sub>\n                    O layer on the copper sheet surface could enhance the interaction between PFTP and copper sheet, thereby tuning the oxidation potential of PFTP from 1.27 to 1.70\u00a0V (vs. Ag\/AgCl). It was the specific shift that makes thermodynamically capable of oxidizing water into \u2022OH upon electrical stimulation. Theoretical calculations and mass spectrometry imaging results indicated that the PFTP\/Copper interaction is mainly attributed to the interaction between the S atoms on the PFTP backbone and Cu\n                    <jats:sub>2<\/jats:sub>\n                    O sites, and the weak interfacial interaction effectively tuned the HOMO energy level of PFTP. Finally, the PFTP\/Copper system demonstrates a superior sterilization rate of 99% against bacterial biofilms at low operating voltages, offering a sustainable and energy\u2010efficient solution for anti\u2010biofouling applications.\n                  <\/jats:p>","DOI":"10.1002\/adma.73666","type":"journal-article","created":{"date-parts":[[2026,6,15]],"date-time":"2026-06-15T04:59:12Z","timestamp":1781499552000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Electrochemical Oxidation of Water Through Conducting Polymer for Hydroxyl Radical Generation at Ultra\u2010Low Voltage"],"prefix":"10.1002","volume":"38","author":[{"given":"Shengpeng","family":"Xia","sequence":"first","affiliation":[{"name":"Beijing National Laboratory For Molecular Sciences Institute of Chemistry Chinese Academy of Sciences  Beijing P. R. 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