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While aromatic polyimide (PI) has superior thermal resistance, its dense\n                    <jats:italic>\u03c0\u2013\u03c0<\/jats:italic>\n                    stacking facilitates the formation of charge transfer complexes, causing significant leakage and capacitive failure at elevated temperatures. In this study, we developed an entropy\u2010driven conformational disorder strategy to maximize the conformational entropy of our designed ternary random copolymerized PI (R\u2010PI, \u0394\n                    <jats:italic>S<\/jats:italic>\n                    <jats:sub>conf<\/jats:sub>\n                    = 5.76 J\/(mol\u00b7K)). The \u03c0\u2010conjugation decoupling and electron localization of the R\u2010PI were achieved by dynamic conformational flipping. Density functional theory and molecular dynamics calculations indicate that the structural randomized state generates a highly fluctuating electrostatic potential field. This field creates high\u2010density deep energy traps that effectively suppress the long\u2010range hopping transport of charge carriers. As a result, the optimal R\u2010PI\u20100.5 delivers a discharged energy density of 6.12 J\/cm\n                    <jats:sup>3<\/jats:sup>\n                    (\n                    <jats:italic>\u03b7<\/jats:italic>\n                    = 91.1%) under an applied field of 650 MV\/m at 200\u00b0C. This molecular\u2010level design paradigm leverages conformational entropy to exceed traditional dielectric limits, offering a robust pathway for next\u2010generation harsh\u2010environment energy storage.\n                  <\/jats:p>","DOI":"10.1002\/adma.73875","type":"journal-article","created":{"date-parts":[[2026,7,6]],"date-time":"2026-07-06T09:16:21Z","timestamp":1783329381000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Entropy\u2010Driven Conformational Disorder Enables Outstanding High\u2010Temperature Energy Storage in Dielectric Polymers"],"prefix":"10.1002","volume":"38","author":[{"given":"Hongfei","family":"Li","sequence":"first","affiliation":[{"name":"Shanghai Engineering Research Center of Advanced Thermal Functional Materials Shanghai Polytechnic University  Shanghai 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