{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,22]],"date-time":"2026-10-22T14:43:47Z","timestamp":1792680227846,"version":"4.5.0"},"reference-count":47,"publisher":"Wiley","issue":"59","license":[{"start":{"date-parts":[[2026,8,22]],"date-time":"2026-08-22T00:00:00Z","timestamp":1787356800000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"},{"start":{"date-parts":[[2026,8,22]],"date-time":"2026-08-22T00:00:00Z","timestamp":1787356800000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"content-domain":{"domain":["advanced.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Advanced Materials"],"published-print":{"date-parts":[[2026,10]]},"abstract":"<jats:title>ABSTRACT<\/jats:title>\n                  <jats:p>\n                    Conventional self\u2010assembled monolayers (SAMs) are conformationally rigid. They cannot buffer interfacial strain during rapid perovskite crystallization, limiting both film quality and device stability. We introduce a conformational engineering strategy using 2\u2010benzhydrylidene\u2010succinic acid (BSA), a rigid diphenylmethylene anchor with flexible succinic acid chains to create an elastic buried interface. Atomic simulations show BSA acts as a compressible buffer, delaying stress accumulation by \u223c6\u00a0\u00c5 under displacement. This dynamic strain dissipation improves heterojunction contact and enhances hole extraction and transport. BSA\u2010modified p\u2010i\u2010n devices reach 26.89% (0.045\u00a0cm\n                    <jats:sup>2<\/jats:sup>\n                    , certified 26.52%). Large\u2010area modules (22.95\u00a0cm\n                    <jats:sup>2<\/jats:sup>\n                    ) deliver 24.30% (certified 23.95%), which is among the highest certified values for this area. The devices retain 90% of initial efficiency after 316\u00a0h of diurnal cycling and 88% after 300 extreme transient thermal shock cycles from \u201020\u00a0\u00b0C to 100\u00a0\u00b0C. This conformational design integrates mechanical compliance with electronic functionality in scalable perovskite photovoltaics.\n                  <\/jats:p>","DOI":"10.1002\/adma.74771","type":"journal-article","created":{"date-parts":[[2026,8,22]],"date-time":"2026-08-22T09:16:46Z","timestamp":1787390206000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Conformational Elasticity at the Buried Interface: 26.89% Perovskite Solar Cells and 23.95% Certified Modules"],"prefix":"10.1002","volume":"38","author":[{"given":"Chenguang","family":"Zhou","sequence":"first","affiliation":[{"name":"School of Materials Science and Engineering Jiangsu Collaborative Innovation Center For Photovoltaic Science and Engineering, Changzhou University  Changzhou Jiangsu P. R. 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