{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,14]],"date-time":"2026-09-14T09:04:18Z","timestamp":1789376658873,"version":"build-2803163510"},"reference-count":36,"publisher":"Wiley","issue":"51","license":[{"start":{"date-parts":[[2026,6,17]],"date-time":"2026-06-17T00:00:00Z","timestamp":1781654400000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2026,6,17]],"date-time":"2026-06-17T00:00:00Z","timestamp":1781654400000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"funder":[{"DOI":"10.13039\/501100005090","name":"Beijing Nova Program","doi-asserted-by":"publisher","award":["20230484256"],"award-info":[{"award-number":["20230484256"]}],"id":[{"id":"10.13039\/501100005090","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100005090","name":"Beijing Nova Program","doi-asserted-by":"publisher","award":["20240484536"],"award-info":[{"award-number":["20240484536"]}],"id":[{"id":"10.13039\/501100005090","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["advanced.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Advanced Science"],"published-print":{"date-parts":[[2026,9]]},"abstract":"<jats:title>ABSTRACT<\/jats:title>\n                  <jats:p>\n                    Skin is the largest\u2010area organ for humans and embodied intelligent robots, serving as a critical interface for environmental interaction. Thanks to the well\u2010organized taxel, dynamic\u2010taxel\u2010density and fully body wrapping, human skin works as an efficient tactile system for embodied intelligent robots to emulate. Thin\u2010film transistor (TFT) technology is a well\u2010known mature semiconductor process for mass production with the largest\u2010area substrate, inherently suitable for artificial skin developing. In this work, we propose an active multimode fused (AMF) artificial skin developed from a standard TFT process for intelligent robots. A novel 2T\u20101C taxel integrating optical and electrostatic capacitive receptors is developed for cross\u2010modal feature extraction. A 10\u00d710 AMF artificial skin sample within 1 cm\n                    <jats:sup>2<\/jats:sup>\n                    is fabricated and experimentally validated through Braille perception. The AMF skin has high tactile robustness, retaining 81.7% accuracy in complex fingerprint tasks even with 45% information loss. Moreover, a fully skin\u2010wrapped dexterous hand integrated with a dynamic\u2010taxel\u2010density tactile system is presented, enabling accurate texture\u2010 and shape\u2010dependent object recognition with 80% less data movement and 76.6% lower computational cost. The TFT\u2010based artificial skin paves an approach for the development of embodied intelligent robots with full\u2010body skin wrapping.\n                  <\/jats:p>","DOI":"10.1002\/advs.76190","type":"journal-article","created":{"date-parts":[[2026,6,17]],"date-time":"2026-06-17T13:10:40Z","timestamp":1781701840000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Thin\u2010Film Transistor Based Active Taxel for Multimode Tactile Perception and Fused Processing"],"prefix":"10.1002","volume":"13","author":[{"ORCID":"https:\/\/orcid.org\/0009-0002-9823-0922","authenticated-orcid":false,"given":"Sihao","family":"Wu","sequence":"first","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zheng","family":"Zhou","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Aoran","family":"Xu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lutong","family":"Wang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Tingchen","family":"Yi","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chuanlin","family":"Sun","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"School of Information &amp; Communication Engineering Beijing Information Science and Technology University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haotong","family":"Zhu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiaqi","family":"Li","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junchen","family":"Dong","sequence":"additional","affiliation":[{"name":"School of Information &amp; Communication Engineering Beijing Information Science and Technology University  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Li","family":"Zhou","sequence":"additional","affiliation":[{"name":"BOE Technology Group Co., Ltd.  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Lifeng","family":"Liu","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yimao","family":"Cai","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dedong","family":"Han","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xing","family":"Zhang","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Peking University  Beijing China"},{"name":"Beijing Advanced Innovation Center for Integrated Circuits  Beijing China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"311","published-online":{"date-parts":[[2026,6,17]]},"reference":[{"key":"e_1_2_10_2_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41583\u2010021\u201000489\u2010x"},{"key":"e_1_2_10_3_1","doi-asserted-by":"publisher","DOI":"10.1038\/nrn2621"},{"key":"e_1_2_10_4_1","doi-asserted-by":"publisher","DOI":"10.1126\/science.1254229"},{"key":"e_1_2_10_5_1","doi-asserted-by":"publisher","DOI":"10.1038\/nature719"},{"key":"e_1_2_10_6_1","doi-asserted-by":"publisher","DOI":"10.1038\/39807"},{"key":"e_1_2_10_7_1","doi-asserted-by":"publisher","DOI":"10.1152\/jn.00313.2020"},{"key":"e_1_2_10_8_1","first-page":"1","volume-title":"Handbook of Neuroengineering","author":"Graczyk E. 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