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The heat dissipation capability of such integrated systems is fundamentally governed by thermal transport across GaN\/BAs interfaces, and buffer layers such as Al\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>3<\/jats:sub>\n                    have been widely adopted to accommodate lattice mismatch and facilitate heterointegration. However, the atomic\u2010scale structural factors governing thermal transport across GaN\/BAs interfaces remain unclear, limiting further improvements in interfacial thermal conductance. Herein, we propose an atomic\u2010scale interfacial structural\u2010uniformity strategy for engineering ultrahigh thermal conductance across GaN\/BAs interfaces using molecular dynamics simulations augmented by machine\u2010learning interatomic potentials. We show that interfacial structural uniformity plays a more important role than individual bond strength in determining thermal transport across the investigated GaN\/BAs interfaces. For instance, the As\u2010N\u2010terminated coherent interface exhibits the highest interfacial structural uniformity and achieves an ultrahigh interfacial thermal conductance of approximately 2000 MW\u00b7m\n                    <jats:sup>\u2212<\/jats:sup>\n                    <jats:sup>2<\/jats:sup>\n                    \u00b7K\n                    <jats:sup>\u2212<\/jats:sup>\n                    <jats:sup>1<\/jats:sup>\n                    , representing a nearly eightfold enhancement over the experimentally reported Al\n                    <jats:sub>2<\/jats:sub>\n                    O\n                    <jats:sub>3<\/jats:sub>\n                    \u2010mediated interface (250 MW\u00b7m\n                    <jats:sup>\u22122<\/jats:sup>\n                    \u00b7K\n                    <jats:sup>\u22121<\/jats:sup>\n                    ). Finite\u2010element analysis indicates that this atomic\u2010scale optimization directly translates into device\u2010scale performance, leading to a substantial improvement in overall heat dissipation efficiency. These findings suggest that engineering interfacial structural uniformity offers a promising strategy for achieving high\u2010efficiency thermal management in next\u2010generation high\u2010power electronic devices.\n                  <\/jats:p>","DOI":"10.1002\/advs.77516","type":"journal-article","created":{"date-parts":[[2026,10,13]],"date-time":"2026-10-13T04:15:26Z","timestamp":1791864926000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Ultrahigh Interfacial Thermal Conductance across GaN\/BAs Interfaces via Atomic\u2010Level Engineering"],"prefix":"10.1002","author":[{"given":"Linfeng","family":"Yu","sequence":"first","affiliation":[{"name":"State Key Laboratory of Mechanics and Control for Mechanical Structures, College of Aerospace Engineering Nanjing University of Aeronautics and Astronautics  Nanjing People's Republic of China"},{"name":"State Key Laboratory of Advanced Design and Manufacturing Technology For Vehicle, College of Mechanical and Vehicle Engineering Hunan University  Changsha People's Republic of China"},{"name":"Department of Mechanical Engineering National University of Singapore  Singapore Singapore"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hongkai","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Design and Manufacturing Technology For Vehicle, College of Mechanical and Vehicle Engineering Hunan University  Changsha People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Haofeng","family":"Qin","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Design and Manufacturing Technology For Vehicle, College of Mechanical and Vehicle Engineering Hunan University  Changsha People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0000-4519-787X","authenticated-orcid":false,"given":"Yi","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Design and Manufacturing Technology For Vehicle, College of Mechanical and Vehicle Engineering Hunan University  Changsha People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jinyuan","family":"Xu","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Design and Manufacturing Technology For Vehicle, College of Mechanical and Vehicle Engineering Hunan University  Changsha People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yiming","family":"Zhao","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering National University of Singapore  Singapore Singapore"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0009-0009-9546-4265","authenticated-orcid":false,"given":"Dongliang","family":"Ding","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering The Chinese University of Hong Kong  Hong Kong People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jianbin","family":"Xu","sequence":"additional","affiliation":[{"name":"Department of Electronics Engineering The Chinese University of Hong Kong  Hong Kong People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sunmi","family":"Shin","sequence":"additional","affiliation":[{"name":"Department of Mechanical Engineering National University of Singapore  Singapore Singapore"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhuhua","family":"Zhang","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Mechanics and Control for Mechanical Structures, College of Aerospace Engineering Nanjing University of Aeronautics and Astronautics  Nanjing People's Republic of China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Guangzhao","family":"Qin","sequence":"additional","affiliation":[{"name":"State Key Laboratory of Advanced Design and Manufacturing Technology For Vehicle, College of Mechanical and Vehicle Engineering Hunan University  Changsha People's Republic of China"},{"name":"Greater Bay Area Institute for Innovation Hunan University  Guangzhou Guangdong Province People's Republic of China"},{"name":"State Key Laboratory of Materials for Integrated Circuits, Shanghai Institute of Microsystem and Information Technology Chinese Academy of Sciences  Shanghai People's Republic of 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