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Although post\u2010treatment of InP cores with zinc compounds is a common approach to alleviate interface strain, conventional synthesis methods often fail to achieve effective doping, typically leaving zinc on the core surface rather than within the lattice. Herein, we present a dual\u2010mode strain relief strategy using the small\u2010molecule precursor Zn(Ac)\n                    <jats:sub>2<\/jats:sub>\n                    . Its ionic bonding character and low steric hindrance enable efficient Zn doping into the InP core and promote uniform epitaxial shell growth, leading to a 50% reduction in interfacial strain and a near\u2010unity photoluminescence quantum yield in InP QDs. This approach simultaneously addresses two major sources of strain: lattice mismatch between the core and shell and steric hindrance from bulky surface ligands. The fabricated green InP\u2010based QLED achieved a high external quantum efficiency of 26.3% and a current efficiency of 108.3\u00a0cd\u00a0A\n                    <jats:sup>\u22121<\/jats:sup>\n                    . We believe this strategy provides a general and scalable strain engineering platform for QDs, with broad applicability across various material systems.\n                  <\/jats:p>","DOI":"10.1002\/anie.202509765","type":"journal-article","created":{"date-parts":[[2025,7,8]],"date-time":"2025-07-08T10:32:12Z","timestamp":1751970732000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":8,"title":["Dual\u2010Mode Strain Relief via Zinc Acetate Enables High\u2010Efficiency InP Quantum Dot Light\u2010Emitting Diodes"],"prefix":"10.1002","volume":"64","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-2252-7765","authenticated-orcid":false,"given":"Changwei","family":"Yuan","sequence":"first","affiliation":[{"name":"School of Environmental Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"},{"name":"Macao Institute of Materials Science and Engineering (MIMSE) Macau University of Science and Technology  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