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However, the Coulombic Efficiency and capacity often decline due to interface side reactions. To address this, a lithiophilic layer is introduced, promoting stable and uniform Li deposition. Despite its effectiveness, this layer often undergoes electrochemical deactivation over time. This work investigates lithiophilic silver (Ag), prepared via magnetron sputtering on a copper (Cu) current collector. Finite element simulations identify stress changes from alloying reactions as a key cause of Ag particle pulverization and deactivation. A high Young\u2032s modulus coating layer is proposed to mitigate this. The Ag<jats:sub>2<\/jats:sub>TiO<jats:sub>3<\/jats:sub>@Ag@TiO<jats:sub>2<\/jats:sub>@Cu composite electrode, designed with multi\u2010layer structures, demonstrates a slower deactivation process through galvanostatic electrochemical cycling. Characterization methods such as SEM, AFM, and TEM confirm the suppression of Ag particle pulverization, while uncoated Ag fractures and deactivates. This work uncovers a potential failure mechanism of lithiophilic metallic nanoparticles and proposes a strategy for deactivation suppression using an artificial coating layer.<\/jats:p>","DOI":"10.1002\/cssc.202401535","type":"journal-article","created":{"date-parts":[[2024,9,7]],"date-time":"2024-09-07T04:39:45Z","timestamp":1725683985000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":4,"title":["High Young\u2032s Modulus Li<sub>x<\/sub>TiO<sub>2<\/sub> Layer Suppressing the Pulverization and Deactivation of Lithiophilic Ag Nanoparticles"],"prefix":"10.1002","volume":"18","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-7043-4475","authenticated-orcid":false,"given":"Wangqi","family":"Dai","sequence":"first","affiliation":[{"name":"Shanghai Key Laboratory of Molecular Catalysis and Innovative Materials Department of Chemistry Fudan University  Shanghai 200433 People's Republic of 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