{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,10,17]],"date-time":"2025-10-17T00:22:05Z","timestamp":1760660525197,"version":"build-2065373602"},"reference-count":6,"publisher":"Wiley","issue":"5-6","license":[{"start":{"date-parts":[[2005,2,4]],"date-time":"2005-02-04T00:00:00Z","timestamp":1107475200000},"content-version":"vor","delay-in-days":4205,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":["Microscopy Res &amp; Technique"],"published-print":{"date-parts":[[1993,8]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>Copper samples, hot solder (eutectic) dipped and thermally aged, were cross\u2010sectioned and placed in an environmental scanning electronic microscope (ESEM). While in the ESEM the samples were heated for \u223c 2.5 h at 170\u00b0C to stimulate the growth of additional Cu\/Sn intermetallic compound. The intent of the study was to obtain a continuous real\u2010time videotape record of the diffusion process and compare the observations to static SEM images reported to represent long\u2010term, naturally aged intermetallic growth. The video obtained allows the observation of the diffusion process and relativistic growth phenomena at the Cu, Cu<jats:sub>3<\/jats:sub>Sn, Cu<jats:sub>6<\/jats:sub>Sn<jats:sub>5<\/jats:sub>, and solder interfaces as well as effects on the bulk Cu and solder. Effects contrary to earlier reports were observed; for example, growth rates of Cu<jats:sub>3<\/jats:sub>Sn were found to greatly exceed those of Cu<jats:sub>6<\/jats:sub>Sn<jats:sub>5<\/jats:sub>. \u00a9 1993 Wiley\u2010Liss, Inc.<\/jats:p>","DOI":"10.1002\/jemt.1070250522","type":"journal-article","created":{"date-parts":[[2005,2,23]],"date-time":"2005-02-23T17:25:48Z","timestamp":1109179548000},"page":"503-508","source":"Crossref","is-referenced-by-count":5,"title":["Copper\/Solder intermetallic growth studies"],"prefix":"10.1002","volume":"25","author":[{"given":"Kevin W.","family":"Kirchner","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"George K.","family":"Lucey","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"James","family":"Geis","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"311","published-online":{"date-parts":[[2005,2,4]]},"reference":[{"volume-title":"The Metal Science of Joining","author":"Boetinger W. J.","key":"e_1_2_1_2_1"},{"key":"e_1_2_1_3_1","first-page":"49","volume-title":"Plating and Surface Finishing","author":"Davis P. E.","year":"1983"},{"key":"e_1_2_1_4_1","unstructured":"Davis P. E. Warwick M. E. andKay P. J.(1982)Intermetallic compound growth and solderability. In: Plating and Surface Finishing Vol. 69 pp.72\u201376."},{"key":"e_1_2_1_5_1","first-page":"85","article-title":"Analysis of low temperature intermetallic growth in copper\u2010tin diffusion couples","volume":"23","author":"Mei Z.","year":"1992","journal-title":"Metal Trans. A."},{"key":"e_1_2_1_6_1","unstructured":"Schmidt C. G. andSeaman L. SRI International. (1989)Modeling Cyclic Deformation and Failure of Pb\u2010Sn Solder."},{"key":"e_1_2_1_7_1","unstructured":"Schmidt C. G. andWild R. N.(1988)Summary of the Findings TRI Services Science Advisory Committee for Solder Joint Reliability."}],"container-title":["Microscopy Research and Technique"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/api.wiley.com\/onlinelibrary\/tdm\/v1\/articles\/10.1002%2Fjemt.1070250522","content-type":"unspecified","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/analyticalsciencejournals.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/jemt.1070250522","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,16]],"date-time":"2025-10-16T14:25:56Z","timestamp":1760624756000},"score":1,"resource":{"primary":{"URL":"https:\/\/analyticalsciencejournals.onlinelibrary.wiley.com\/doi\/10.1002\/jemt.1070250522"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[1993,8]]},"references-count":6,"journal-issue":{"issue":"5-6","published-print":{"date-parts":[[1993,8]]}},"alternative-id":["10.1002\/jemt.1070250522"],"URL":"https:\/\/doi.org\/10.1002\/jemt.1070250522","archive":["Portico"],"relation":{},"ISSN":["1059-910X","1097-0029"],"issn-type":[{"type":"print","value":"1059-910X"},{"type":"electronic","value":"1097-0029"}],"subject":[],"published":{"date-parts":[[1993,8]]}}}