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Rapid Commun."],"published-print":{"date-parts":[[2019,9]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>In this study, an innovative, facile, and low\u2010cost method is developed to prepare phenolic resin (PR) containing boron and silicon (BSiPR). BSiPR is synthesized by a solvent\u2010free, one\u2010pot method using boric acid as the coupling agent instead of silane, and methyltriethoxysilane as the silicon source. The results show that boron and silicon elements are introduced into PR via B\uf8ffO\uf8ffC and B\uf8ffO\uf8ffSi structures. The char yield of the resulting resin at 800\u00a0\u00b0C is improved to 76%. The reasons for higher char yield are investigated. The formation of B\uf8ffO\uf8ffC can reduce the content of phenolic hydroxyl, which helps to decrease the weight loss. B<jats:sub>2<\/jats:sub>O<jats:sub>3<\/jats:sub> is also formed at 400\u00a0\u00b0C, and it can prevent the release of carbon oxides. Moreover, thermally stable B\uf8ffO\uf8ffSi and Si\uf8ffO structures remain stable during the pyrolysis. In addition, the mechanical and ablative properties of fiber\u2010reinforced composites are also enhanced.<\/jats:p>","DOI":"10.1002\/marc.201800702","type":"journal-article","created":{"date-parts":[[2018,12,17]],"date-time":"2018-12-17T09:32:33Z","timestamp":1545039153000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":51,"title":["Boric Acid as a Coupling Agent for Preparation of Phenolic Resin Containing Boron and Silicon with Enhanced Char Yield"],"prefix":"10.1002","volume":"40","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3886-8094","authenticated-orcid":false,"given":"Jin","family":"Yun","sequence":"first","affiliation":[{"name":"Department of Applied Chemistry, School of Natural and Applied Sciences Northwestern Polytechnical University  Xi'an 710072 China"},{"name":"Research &amp; Development Institute of Northwestern Polytechnical University in Shenzhen  Guangdong 518057 P. R. 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