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Rapid Commun."],"published-print":{"date-parts":[[2024,9]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>Thermosets having low dielectric constant (<jats:italic>D<\/jats:italic><jats:sub>k<\/jats:sub> &lt; 3) and low dielectric dissipation factor (<jats:italic>D<\/jats:italic><jats:sub>f<\/jats:sub> &lt; 0.003), high glass transition temperature (<jats:italic>T<\/jats:italic><jats:sub>g<\/jats:sub> &gt; 150 \u00b0C), and good adhesion to copper are desirable for the low loss layers of the copper clad laminates (CCL) in next generation printed circuit boards. Three different difunctional diazirines are evaluated for both thermal and photochemical crosslinking of a high <jats:italic>T<\/jats:italic><jats:sub>g<\/jats:sub> vinyl\u2010addition polynorbornene resin: poly(5\u2010hexyl\u20101\u2010norbornene) (poly(HNB)). The substrate polymer, crosslinked by the carbenes generated from the activated diazirines, forms thermosets with <jats:italic>D<\/jats:italic><jats:sub>k<\/jats:sub> &lt; 2.3 and <jats:italic>D<\/jats:italic><jats:sub>f<\/jats:sub> &lt; 0.001 at 10\u00a0GHz depending on the identity of the diazirine and the loading. The <jats:italic>D<\/jats:italic><jats:sub>k<\/jats:sub> and <jats:italic>D<\/jats:italic><jats:sub>f<\/jats:sub> values for one composition are stable for 1600\u00a0h at 125 \u00b0C in air and for 1400\u00a0h at 85 \u00b0C and 85% relative humidity, suggesting good long\u2010term reliability of this thermoset. Adhesion of poly(HNB) to copper can be enhanced by priming the copper surface with a diazirine prior to high temperature lamination; peel strength values of greater than 7.5 N cm<jats:sup>\u22121<\/jats:sup> are achieved. Negative\u2010tone photopatterning of poly(HNB) with diazirines upon exposure to 365\u00a0nm light is demonstrated.<\/jats:p>","DOI":"10.1002\/marc.202400200","type":"journal-article","created":{"date-parts":[[2024,6,14]],"date-time":"2024-06-14T20:58:05Z","timestamp":1718398685000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":11,"title":["Crosslinking Vinyl\u2010Addition Polynorbornenes via Difunctional Diazirines to Generate Low Dielectric\u2010Constant and Low Dielectric\u2010Loss Thermosets"],"prefix":"10.1002","volume":"45","author":[{"given":"Pramod","family":"Kandanarachchi","sequence":"first","affiliation":[{"name":"Promerus, LLC  225\u00a0W. Bartges Street Akron OH 44307 USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Gerhard A.","family":"Meyer","sequence":"additional","affiliation":[{"name":"Promerus, LLC  225\u00a0W. 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