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Realizing their potential requires scalable visible\u2010light\u2010source integration methods compatible with high\u2010volume manufacturing and efficient optical coupling. Here, we demonstrate passive\u2010alignment flip\u2010chip bonding of 450\u2010nm InGaN laser diodes onto a foundry\u2010fabricated visible\u2010light silicon (Si) photonics platform with silicon nitride (SiN) waveguides, thermo\u2010optic devices, and photodetectors. Hybrid laser integration is realized using a sub\u2010micron\u2010precision die bonder with a vision alignment system and heatable pickup tool, allowing placement of multiple lasers on a single Si chip. Co\u2010design of the lasers and Si photonics, with lithographically defined alignment marks and mechanical stoppers, enables precise post\u2010bonding alignment. Efficient coupling to SiN waveguides is demonstrated, with a 1.1\u00a0dB minimum coupling loss. We measure 19.0\u00a0mW mean on\u2010chip optical power at 90\u00a0mA drive current; at 185\u00a0mA, maximum on\u2010chip power reaches 60.7\u00a0mW, the highest reported for hybrid\u2010integrated visible\u2010spectrum lasers, to our knowledge. A maximum wall\u2010plug efficiency of 7.8% is measured. An active PIC is shown, integrating a bonded laser, photodetector power monitor, and thermo\u2010optic switch for routing and variable attenuation. This work highlights passive\u2010alignment flip\u2010chip bonding as a practical, high\u2010performance approach for integrating lasers onto visible\u2010spectrum PICs.<\/jats:p>","DOI":"10.1002\/nap2.70037","type":"journal-article","created":{"date-parts":[[2026,4,10]],"date-time":"2026-04-10T12:12:11Z","timestamp":1775823131000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Hybrid Integration of InGaN Lasers in a Foundry\u2010Fabricated Visible\u2010Light Photonics Platform"],"prefix":"10.1002","volume":"15","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6188-7969","authenticated-orcid":false,"given":"Xin","family":"Mu","sequence":"first","affiliation":[{"name":"Max Planck Institute of Microstructure Physics  Halle Germany"},{"name":"University of Toronto  Toronto Ontario Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Frank","family":"Weiss","sequence":"additional","affiliation":[{"name":"Max Planck Institute of Microstructure Physics  Halle Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Hongyao","family":"Chua","sequence":"additional","affiliation":[{"name":"Advanced Micro Foundry Pte. 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S.","family":"Poon","sequence":"additional","affiliation":[{"name":"University of Toronto  Toronto Ontario Canada"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Mariel","family":"Jama","sequence":"additional","affiliation":[{"name":"ams OSRAM International GmbH  Regensburg Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Wesley D.","family":"Sacher","sequence":"additional","affiliation":[{"name":"Max Planck Institute of Microstructure Physics  Halle Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"311","published-online":{"date-parts":[[2026,4,10]]},"reference":[{"key":"e_1_2_12_2_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.optlastec.2018.10.059"},{"key":"e_1_2_12_3_1","doi-asserted-by":"publisher","DOI":"10.1109\/jstqe.2019.2904443"},{"key":"e_1_2_12_4_1","first-page":"Tu3C\u20135","volume-title":"Optical Fiber Communication Conference","author":"Sacher W. 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