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In this work, similar dimensionless figure of merit (\n                    <jats:italic>ZT<\/jats:italic>\n                    ) values have been maintained for Bi\n                    <jats:sub>2<\/jats:sub>\n                    Te\n                    <jats:sub>3<\/jats:sub>\n                    \u2010based constituents with strengthened phonon scattering, further assembling optimized flexible TEDs (F\u2010TEDs). Thus, a maximum\n                    <jats:italic>ZT<\/jats:italic>\n                    value of 1.2 at 373 K has been implemented for p\u2010type Bi\n                    <jats:sub>0.5<\/jats:sub>\n                    Sb\n                    <jats:sub>1.5<\/jats:sub>\n                    Te\n                    <jats:sub>3<\/jats:sub>\n                    material, where the related thermal conductivity gradually reduced by modifying the grain size. Subsequently, a 200\u2010pair F\u2010TED with a packing factor of 35% has been delivered, where the open\u2010circuit voltage and power density can achieve 3.0\u00a0V and 13.8\u00a0mW cm\n                    <jats:sup>\u22122<\/jats:sup>\n                    at the temperature difference of 73 K, respectively. After a stretching test at the bending radius of 5\u00a0mm, the TED remains complete and ascertains excellent electrical stability and structural reliability. Besides, the height and weight have been decreased by 70% and 75%, as compared to those of the pristine TED. Therefore, the attributes of comfort and high flexibility have been endowed through halving the leg height and applying the high\u2010density strategy, further boosting the practicality of Bi\n                    <jats:sub>2<\/jats:sub>\n                    Te\n                    <jats:sub>3<\/jats:sub>\n                    \u2010based F\u2010TEDs for wearable applications.\n                  <\/jats:p>","DOI":"10.1002\/smll.202506029","type":"journal-article","created":{"date-parts":[[2025,9,19]],"date-time":"2025-09-19T05:31:42Z","timestamp":1758259902000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Boosting the Compatibility Between Thermoelectric Materials and Flexibility by Grain Boundary Engineering"],"prefix":"10.1002","volume":"21","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-1513-8561","authenticated-orcid":false,"given":"Ruopu","family":"Liu","sequence":"first","affiliation":[{"name":"Institute of Materials China Academy of Engineering Physics  Jiangyou Sichuan 621908 P. 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