{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,14]],"date-time":"2026-10-14T13:53:32Z","timestamp":1791986012350,"version":"4.4.0"},"reference-count":47,"publisher":"Wiley","license":[{"start":{"date-parts":[[2026,10,14]],"date-time":"2026-10-14T00:00:00Z","timestamp":1791936000000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"},{"start":{"date-parts":[[2026,10,14]],"date-time":"2026-10-14T00:00:00Z","timestamp":1791936000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["U20A6004"],"award-info":[{"award-number":["U20A6004"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Small"],"abstract":"<jats:title>ABSTRACT<\/jats:title>\n                  <jats:p>Nanoimprint lithography (NIL) is widely used to pattern material surfaces for functional modification. To advance this capability, we develop a sequential dissolution demolding (SDD) technique based on selective material solubility, enabling two consecutive, stress\u2010free demolding processes. This approach capitalizes on the differential solubility of positive photoresists, which withstand non\u2010polar solvents but dissolve readily in alkaline aqueous solutions following UV exposure. Utilizing this mechanism, the high\u2010aspect\u2010ratio (HAR) micropillar arrays (aspect ratios up to 20:1) on photoresist masters were successfully replicated into lipophilic polystyrene (PS) films, yielding intermediate templates comprising deep microcavities. These cavities were subsequently metallized via an electroplating process. By dissolving the PS template in a non\u2010polar solvent, high\u2010quality, free\u2010standing HAR copper (Cu) micropillars were isolated without inducing mechanical strain. Furthermore, these engineered Cu structures exhibited valuable multifunctional properties, including anti\u2010reflective and antibacterial characteristics. This stress\u2010free demolding strategy provides a robust pathway to broaden the applicability of NIL in complex nanofabrication.<\/jats:p>","DOI":"10.1002\/smll.76212","type":"journal-article","created":{"date-parts":[[2026,10,14]],"date-time":"2026-10-14T13:37:52Z","timestamp":1791985072000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Sequential Dissolution Demolding for the Replication of Multifunctional High\u2010Aspect\u2010Ratio Copper Micropillar Arrays"],"prefix":"10.1002","author":[{"ORCID":"https:\/\/orcid.org\/0009-0006-3897-4478","authenticated-orcid":false,"given":"Shuo","family":"Chen","sequence":"first","affiliation":[{"name":"School of Integrated Circuits Wuhan University  Wuhan China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Ruiqi","family":"Cheng","sequence":"additional","affiliation":[{"name":"School of Integrated Circuits Wuhan University  Wuhan China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhaofeng","family":"Xue","sequence":"additional","affiliation":[{"name":"Simax Shanghai Co., Ltd.  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