{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,11]],"date-time":"2026-10-11T13:33:14Z","timestamp":1791725594082,"version":"4.3.4"},"reference-count":65,"publisher":"Wiley","issue":"7","license":[{"start":{"date-parts":[[2024,2,29]],"date-time":"2024-02-29T00:00:00Z","timestamp":1709164800000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"}],"funder":[{"DOI":"10.13039\/501100001809","name":"National Natural Science Foundation of China","doi-asserted-by":"publisher","award":["52205398"],"award-info":[{"award-number":["52205398"]}],"id":[{"id":"10.13039\/501100001809","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Small Methods"],"published-print":{"date-parts":[[2024,7]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>Integration of wafer\u2010scale oxide and semiconductor materials meets the difficulties of residual stress and materials incompatibility. In this work, Ag NPs thin film is contributed as an energy confinement layer between oxide (Sapphire) and semiconductor (Si) wafers to localize the materials interaction during ultrafast laser irradiation. Due to the plasmonic effects generated within constructed dielectric\u2013metal\u2013dielectric structures (i.e., Sapphire\u2013Ag\u2013Si), thermal diffusion and chemical reaction between Ag and its neighboring materials facilitate the microwelding of Sapphire and Si wafers. Ag NPs can be totally sintered within the junction area to bridge oxide and semiconductor, while Al\u2500O\u2500Ag bond and Ag\u2500Si bond are formed at Ag\u2013Sapphire and Ag\u2500Si interfaces, respectively. As\u2010received heterogeneous joint exhibits a high shear strength up to 5.4\u00a0MPa, with the fracture occurring inside Si wafer. Meanwhile, insertion of metal nanolayer can greatly relieve the residual stress\u2010induced microcracking inside the brittle materials. Such wafer\u2010scale Sapphire and Si interconnects thus show robust strength and excellent impermeability even after thermal shocking (\u221240 \u00b0C to 120 \u00b0C) for 200 cycles. This metal NPs layer\u2010assisted plasmonic microwelding technology can extend to broad materials integration, which is promising for high\u2010performance microdevices development in MEMS, MOEMS, or microfluidics.<\/jats:p>","DOI":"10.1002\/smtd.202301232","type":"journal-article","created":{"date-parts":[[2024,2,29]],"date-time":"2024-02-29T10:45:47Z","timestamp":1709203547000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":17,"title":["Metal Nanoparticles Assisted Ultrafast Laser Plasmonic Microwelding of Oxide\u2013Semiconductor Interconnects"],"prefix":"10.1002","volume":"8","author":[{"given":"Yifan","family":"Hu","sequence":"first","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3952-0700","authenticated-orcid":false,"given":"Luchan","family":"Lin","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Jiayi","family":"Xu","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Siyuan","family":"Hu","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Junde","family":"Ji","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Weiqing","family":"Wu","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Xinde","family":"Zuo","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Qianyi","family":"Zhang","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Zhuguo","family":"Li","sequence":"additional","affiliation":[{"name":"Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University  Shanghai 200240 China"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"311","published-online":{"date-parts":[[2024,2,29]]},"reference":[{"key":"e_1_2_8_1_1","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.1602640"},{"key":"e_1_2_8_2_1","doi-asserted-by":"publisher","DOI":"10.1038\/srep01510"},{"key":"e_1_2_8_3_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-022-09199-9"},{"key":"e_1_2_8_4_1","doi-asserted-by":"publisher","DOI":"10.1002\/slct.202002340"},{"key":"e_1_2_8_5_1","doi-asserted-by":"publisher","DOI":"10.1038\/ncomms4288"},{"key":"e_1_2_8_6_1","doi-asserted-by":"publisher","DOI":"10.1088\/2058-6272\/ac5af8"},{"key":"e_1_2_8_7_1","doi-asserted-by":"publisher","DOI":"10.1364\/OE.24.022544"},{"key":"e_1_2_8_8_1","first-page":"94","volume":"14","author":"Xu J.","year":"2021","journal-title":"Int J."},{"key":"e_1_2_8_9_1","doi-asserted-by":"publisher","DOI":"10.1088\/1361-6463\/ab8769"},{"key":"e_1_2_8_10_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmst.2014.12.007"},{"key":"e_1_2_8_11_1","doi-asserted-by":"publisher","DOI":"10.1038\/s44172-022-00016-5"},{"key":"e_1_2_8_12_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2019.03.302"},{"key":"e_1_2_8_13_1","doi-asserted-by":"publisher","DOI":"10.1039\/C7TC04811D"},{"key":"e_1_2_8_14_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.5001796"},{"key":"e_1_2_8_15_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2019.116357"},{"key":"e_1_2_8_16_1","doi-asserted-by":"publisher","DOI":"10.7567\/JJAP.57.066501"},{"key":"e_1_2_8_17_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.phpro.2010.08.171"},{"key":"e_1_2_8_18_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.msea.2016.03.068"},{"key":"e_1_2_8_19_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2022.155149"},{"key":"e_1_2_8_20_1","doi-asserted-by":"publisher","DOI":"10.1134\/S1063782619010238"},{"key":"e_1_2_8_21_1","doi-asserted-by":"publisher","DOI":"10.1557\/mrs.2016.274"},{"key":"e_1_2_8_22_1","doi-asserted-by":"publisher","DOI":"10.1002\/lpor.202000433"},{"key":"e_1_2_8_23_1","doi-asserted-by":"publisher","DOI":"10.1002\/lpor.202200208"},{"key":"e_1_2_8_24_1","doi-asserted-by":"publisher","DOI":"10.1126\/science.aaw6699"},{"key":"e_1_2_8_25_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.physrep.2006.12.005"},{"key":"e_1_2_8_26_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-017-00907-8"},{"key":"e_1_2_8_27_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matdes.2017.06.022"},{"key":"e_1_2_8_28_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.matchar.2016.08.013"},{"key":"e_1_2_8_29_1","doi-asserted-by":"publisher","DOI":"10.1038\/nmat3238"},{"key":"e_1_2_8_30_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1951057"},{"key":"e_1_2_8_31_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0005334"},{"key":"e_1_2_8_32_1","doi-asserted-by":"publisher","DOI":"10.1364\/OE.23.003427"},{"key":"e_1_2_8_33_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.tsf.2020.137964"},{"key":"e_1_2_8_34_1","doi-asserted-by":"publisher","DOI":"10.3390\/mi12080946"},{"key":"e_1_2_8_35_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41586-022-04568-6"},{"key":"e_1_2_8_36_1","doi-asserted-by":"publisher","DOI":"10.1007\/s11664-019-06984-3"},{"key":"e_1_2_8_37_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.apsusc.2019.05.322"},{"key":"e_1_2_8_38_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41377-021-00596-5"},{"key":"e_1_2_8_39_1","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3727\/38\/16\/029"},{"key":"e_1_2_8_40_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202108802"},{"key":"e_1_2_8_41_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.3116645"},{"key":"e_1_2_8_42_1","doi-asserted-by":"publisher","DOI":"10.1021\/acsnano.5b01673"},{"key":"e_1_2_8_43_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.77.075133"},{"key":"e_1_2_8_44_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.3662897"},{"key":"e_1_2_8_45_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevMaterials.5.106001"},{"key":"e_1_2_8_46_1","doi-asserted-by":"publisher","DOI":"10.1038\/ncomms1275"},{"key":"e_1_2_8_47_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41560-023-01245-4"},{"key":"e_1_2_8_48_1","doi-asserted-by":"publisher","DOI":"10.1016\/S1003-6326(07)60285-4"},{"key":"e_1_2_8_49_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0926-3373(99)00135-6"},{"key":"e_1_2_8_50_1","doi-asserted-by":"publisher","DOI":"10.3390\/ma15238541"},{"key":"e_1_2_8_51_1","doi-asserted-by":"publisher","DOI":"10.1002\/eng2.12339"},{"key":"e_1_2_8_52_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.2353397"},{"key":"e_1_2_8_53_1","doi-asserted-by":"publisher","DOI":"10.1088\/2053-1583\/ac8a01"},{"key":"e_1_2_8_54_1","doi-asserted-by":"publisher","DOI":"10.1021\/cs500248a"},{"key":"e_1_2_8_55_1","doi-asserted-by":"publisher","DOI":"10.1038\/s42004-018-0026-y"},{"key":"e_1_2_8_56_1","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.1995.2817"},{"key":"e_1_2_8_57_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ceramint.2022.10.043"},{"key":"e_1_2_8_58_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.precisioneng.2021.10.001"},{"key":"e_1_2_8_59_1","doi-asserted-by":"publisher","DOI":"10.1109\/JMEMS.2009.2039697"},{"key":"e_1_2_8_60_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.actamat.2005.01.047"},{"key":"e_1_2_8_61_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.microrel.2017.01.010"},{"key":"e_1_2_8_62_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jallcom.2018.10.394"},{"key":"e_1_2_8_63_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.27.985"},{"key":"e_1_2_8_64_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.6.4370"},{"key":"e_1_2_8_65_1","doi-asserted-by":"publisher","DOI":"10.1364\/JOSA.62.001336"}],"container-title":["Small Methods"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/smtd.202301232","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,7,19]],"date-time":"2024-07-19T08:37:20Z","timestamp":1721378240000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1002\/smtd.202301232"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,2,29]]},"references-count":65,"journal-issue":{"issue":"7","published-print":{"date-parts":[[2024,7]]}},"alternative-id":["10.1002\/smtd.202301232"],"URL":"https:\/\/doi.org\/10.1002\/smtd.202301232","archive":["Portico"],"relation":{},"ISSN":["2366-9608","2366-9608"],"issn-type":[{"value":"2366-9608","type":"print"},{"value":"2366-9608","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,2,29]]},"assertion":[{"value":"2023-09-12","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-02-29","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"2301232"}}