{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,8]],"date-time":"2026-10-08T09:51:06Z","timestamp":1791453066295,"version":"4.3.3"},"reference-count":197,"publisher":"Wiley","license":[{"start":{"date-parts":[[2026,9,24]],"date-time":"2026-09-24T00:00:00Z","timestamp":1790208000000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2026,9,24]],"date-time":"2026-09-24T00:00:00Z","timestamp":1790208000000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"funder":[{"DOI":"10.13039\/100000006","name":"Office of Naval Research","doi-asserted-by":"publisher","award":["N0001424WX01021"],"award-info":[{"award-number":["N0001424WX01021"]}],"id":[{"id":"10.13039\/100000006","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Small Methods"],"abstract":"<jats:title>ABSTRACT<\/jats:title>\n                  <jats:p>With the growing need for controlling heat dissipation in modern technologies, a comprehensive understanding of thermal transport in electrically insulating materials is essential. Electrically insulating thin films and sheets often exhibit anisotropic thermal conductivity across in\u2010plane and cross\u2010plane directions, either intrinsically, or through structural engineering. This anisotropy enables targeted heat dissipation, such as around sensitive components in modern electronics. This review summarizes the recent progress in enhancing the thermal conductivity of electrically insulating thin films and sheets, in particular, those exhibiting anisotropy in the thermal conductivity. It considers how fabrication strategies impact the structure of the material to control thermal conductivity and thermal conductivity anisotropy, and summarizes the techniques leveraged to measure the thermal conductivity, and evaluates the corresponding electrical parameters. Trends across various material systems, including polymers, ceramics, and composites, are discussed, with additional insights into thickness\u2010dependent behavior, compositing strategies, alignment methods, and trends in filler loadings. Special attention is given to boron nitride (BN)\u2010based composites, where filler alignment, morphology, and loading fraction critically influence anisotropic thermal performance. By analyzing these interrelationships, this review provides a framework for designing next\u2010generation insulating materials with tunable anisotropic thermal properties for advanced thermal management applications.<\/jats:p>","DOI":"10.1002\/smtd.71012","type":"journal-article","created":{"date-parts":[[2026,9,24]],"date-time":"2026-09-24T09:39:57Z","timestamp":1790242797000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Anisotropic Thermal Properties of Electrically Insulating Thin Films and Sheets: A Review"],"prefix":"10.1002","author":[{"ORCID":"https:\/\/orcid.org\/0009-0000-6612-3706","authenticated-orcid":false,"given":"Shanmukhi","family":"Sripada","sequence":"first","affiliation":[{"name":"Birck Nanotechnology Center and The School of Mechanical Engineering Purdue University West Lafayette Indiana USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-2106-3671","authenticated-orcid":false,"given":"Cole R.","family":"Davis","sequence":"additional","affiliation":[{"name":"Naval Surface Warfare Center Crane Division Crane Indiana USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Aalok U.","family":"Gaitonde","sequence":"additional","affiliation":[{"name":"Birck Nanotechnology Center and The School of Mechanical Engineering Purdue University West Lafayette Indiana USA"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-7506-2888","authenticated-orcid":false,"given":"Amy M.","family":"Marconnet","sequence":"additional","affiliation":[{"name":"Birck Nanotechnology Center and The School of Mechanical Engineering Purdue University West Lafayette Indiana USA"}],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"311","published-online":{"date-parts":[[2026,9,24]]},"reference":[{"key":"e_1_2_10_2_1","doi-asserted-by":"publisher","DOI":"10.1186\/S44147\u2010023\u201000309\u20102\/FIGURES\/7"},{"key":"e_1_2_10_3_1","doi-asserted-by":"publisher","DOI":"10.1049\/IET\u2010EST.2015.0050"},{"key":"e_1_2_10_4_1","doi-asserted-by":"publisher","DOI":"10.1049\/HVE.2016.0034"},{"key":"e_1_2_10_5_1","doi-asserted-by":"publisher","DOI":"10.1146\/ANNUREV\u2010MATSCI\u2010070317\u2010124435\/CITE\/REFWORKS"},{"key":"e_1_2_10_6_1","doi-asserted-by":"publisher","DOI":"10.3390\/MA15228121"},{"key":"e_1_2_10_7_1","doi-asserted-by":"publisher","DOI":"10.1016\/0032\u20103861(77)90002\u20107"},{"key":"e_1_2_10_8_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.3C08467"},{"key":"e_1_2_10_9_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.JMRT.2022.03.032"},{"key":"e_1_2_10_10_1","doi-asserted-by":"publisher","DOI":"10.3390\/NANO14151259"},{"key":"e_1_2_10_11_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSANM.2C03200"},{"key":"e_1_2_10_12_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.2C07862\/ASSET\/IMAGES\/LARGE\/NN2C07862_0005.JPEG"},{"key":"e_1_2_10_13_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPOSITESA.2023.107998"},{"key":"e_1_2_10_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mser.2018.06.002"},{"key":"e_1_2_10_15_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0243023"},{"key":"e_1_2_10_16_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPOSITESA.2025.109289"},{"key":"e_1_2_10_17_1","doi-asserted-by":"publisher","DOI":"10.1002\/MARC.202500078"},{"key":"e_1_2_10_18_1","doi-asserted-by":"publisher","DOI":"10.1109\/ACCESS.2020.3040045"},{"key":"e_1_2_10_19_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevMaterials.2.064005"},{"key":"e_1_2_10_20_1","doi-asserted-by":"publisher","DOI":"10.1088\/0022-3719\/4\/13\/021"},{"key":"e_1_2_10_21_1","doi-asserted-by":"publisher","DOI":"10.1002\/ADFM.201707556"},{"key":"e_1_2_10_22_1","doi-asserted-by":"publisher","DOI":"10.1038\/S42005\u2010019\u20100145\u20105;SUBJMETA"},{"key":"e_1_2_10_23_1","doi-asserted-by":"publisher","DOI":"10.1088\/2053\u20101591\/AC4FE1"},{"key":"e_1_2_10_24_1","doi-asserted-by":"publisher","DOI":"10.4236\/msa.2011.27102"},{"key":"e_1_2_10_25_1","doi-asserted-by":"publisher","DOI":"10.1111\/JACE.18826;CTYPE:STRING:JOURNAL"},{"key":"e_1_2_10_26_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.JEURCERAMSOC.2007.02.093"},{"key":"e_1_2_10_27_1","doi-asserted-by":"publisher","DOI":"10.1049\/CP:19990870"},{"key":"e_1_2_10_28_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.PCRYSGROW.2018.10.002"},{"key":"e_1_2_10_29_1","doi-asserted-by":"publisher","DOI":"10.1109\/CRMICO.2014.6959584"},{"key":"e_1_2_10_30_1","doi-asserted-by":"publisher","DOI":"10.1111\/J.1151\u20102916.2002.TB00066.X;REQUESTEDJOURNAL:JOURNAL:15512916;WEBSITE:WEBSITE:CERAMICS;PAGE:STRING:ARTICLE\/CHAPTER"},{"key":"e_1_2_10_31_1","doi-asserted-by":"publisher","DOI":"10.1016\/S0955\u20102219(98)00258\u20101"},{"key":"e_1_2_10_32_1","doi-asserted-by":"publisher","DOI":"10.1111\/J.1151\u20102916.1999.TB02209.X"},{"key":"e_1_2_10_33_1","doi-asserted-by":"publisher","DOI":"10.1111\/J.1151\u20102916.1996.TB09002.X;WGROUP:STRING:PUBLICATION"},{"key":"e_1_2_10_34_1","doi-asserted-by":"publisher","DOI":"10.1023\/A:1004807516791\/METRICS"},{"key":"e_1_2_10_35_1","doi-asserted-by":"publisher","DOI":"10.1088\/1468\u20106996\/9\/3\/033001"},{"key":"e_1_2_10_36_1","doi-asserted-by":"publisher","DOI":"10.1557\/JMR.1999.0206\/METRICS"},{"key":"e_1_2_10_37_1","doi-asserted-by":"publisher","DOI":"10.1016\/0022\u20103697(87)90153\u20103"},{"key":"e_1_2_10_38_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.87.165201"},{"key":"e_1_2_10_39_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.4827419"},{"key":"e_1_2_10_40_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0049531"},{"key":"e_1_2_10_41_1","doi-asserted-by":"publisher","DOI":"10.3390\/APP11041535"},{"key":"e_1_2_10_42_1","unstructured":"\u201cAluminum Oxide Sapphire | Crystal Tech\u201d."},{"key":"e_1_2_10_43_1","unstructured":"Dupont \u201cNomex\u00ae 410 \u2010 Technical Data Sheet \u201d (2016)."},{"key":"e_1_2_10_44_1","unstructured":"Franklin Fibre\u2010Lamitex Corporation \u201cVulcanized Fibre & Fishpaper Datasheet \u201d (2020)."},{"key":"e_1_2_10_45_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM55375.2024.10709544"},{"key":"e_1_2_10_46_1","doi-asserted-by":"publisher","DOI":"10.3390\/POLYM14061269"},{"key":"e_1_2_10_47_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.5C06795"},{"key":"e_1_2_10_48_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSANM.3C01147\/ASSET\/IMAGES\/LARGE\/AN3C01147_0006.JPEG"},{"key":"e_1_2_10_49_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSANM.9B00817\/ASSET\/IMAGES\/LARGE\/AN\u20102019\u2010008175_0010.JPEG"},{"key":"e_1_2_10_50_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.7B02359\/ASSET\/IMAGES\/NN\u20102017\u201002359R_M008.GIF"},{"key":"e_1_2_10_51_1","doi-asserted-by":"publisher","DOI":"10.1021\/AM401939Z"},{"key":"e_1_2_10_52_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.5B03007"},{"key":"e_1_2_10_53_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.CERAMINT.2016.02.098"},{"key":"e_1_2_10_54_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2010.05.012"},{"key":"e_1_2_10_55_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymer.2020.122763"},{"key":"e_1_2_10_56_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.CEJ.2021.133163"},{"key":"e_1_2_10_57_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAELM.2C00858"},{"key":"e_1_2_10_58_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.7B04768"},{"key":"e_1_2_10_59_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2018.09.104"},{"key":"e_1_2_10_60_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.JEURCERAMSOC.2016.02.029"},{"key":"e_1_2_10_61_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2018.03.028"},{"key":"e_1_2_10_62_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.CEJ.2023.145916"},{"key":"e_1_2_10_63_1","doi-asserted-by":"publisher","DOI":"10.1002\/SMLL.202404189"},{"key":"e_1_2_10_64_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.5C02929"},{"key":"e_1_2_10_65_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.5C15470"},{"key":"e_1_2_10_66_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSANM.5C03860"},{"key":"e_1_2_10_67_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSANM.5C02920"},{"key":"e_1_2_10_68_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.CERAMINT.2025.10.268"},{"key":"e_1_2_10_69_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.0C04486\/ASSET\/IMAGES\/LARGE\/AM0C04486_0006.JPEG"},{"key":"e_1_2_10_70_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSANM.9B01684"},{"key":"e_1_2_10_71_1","doi-asserted-by":"publisher","DOI":"10.1021\/JP911431F\/ASSET\/IMAGES\/LARGE\/JP\u20102009\u201011431F_0004.JPEG"},{"key":"e_1_2_10_72_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.8B06290"},{"key":"e_1_2_10_73_1","doi-asserted-by":"publisher","DOI":"10.1002\/ADFM.201900412"},{"key":"e_1_2_10_74_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2020.108245"},{"key":"e_1_2_10_75_1","doi-asserted-by":"publisher","DOI":"10.1002\/SMLL.201502173"},{"key":"e_1_2_10_76_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPOSITESB.2020.107855"},{"key":"e_1_2_10_77_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2017.06.008"},{"key":"e_1_2_10_78_1","doi-asserted-by":"publisher","DOI":"10.1007\/S40820\u2010022\u201000972\u20109\/FIGURES\/5"},{"key":"e_1_2_10_79_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPOSITESA.2023.107638"},{"key":"e_1_2_10_80_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.SNA.2023.114288"},{"key":"e_1_2_10_81_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.9B16070\/ASSET\/IMAGES\/MEDIUM\/AM9B16070_M001.GIF"},{"key":"e_1_2_10_82_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2022.109406"},{"key":"e_1_2_10_83_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.CEJ.2022.135482"},{"key":"e_1_2_10_84_1","doi-asserted-by":"publisher","DOI":"10.1002\/APP.50324;WGROUP:STRING:PUBLICATION"},{"key":"e_1_2_10_85_1","doi-asserted-by":"publisher","DOI":"10.1021\/AM400615Z\/SUPPL_FILE\/AM400615Z_SI_001.PDF"},{"key":"e_1_2_10_86_1","unstructured":"K.Hanson \u201cASTM D 5470 TIM Material Testing \u201d inTwenty\u2010Second Annual IEEE Semiconductor Thermal Measurement And Management Symposium(IEEE Xplore 2006) 50\u201353."},{"key":"e_1_2_10_87_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jpowsour.2017.01.019"},{"key":"e_1_2_10_88_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.5001835"},{"key":"e_1_2_10_89_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.5033966\/155428"},{"key":"e_1_2_10_90_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.4991715"},{"key":"e_1_2_10_91_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2022.122849"},{"key":"e_1_2_10_92_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1728417"},{"key":"e_1_2_10_93_1","unstructured":"ASTM \u201cStandard Test Method for Thermal Diffusivity by the Flash Method \u201d (ASTM International 1992)."},{"key":"e_1_2_10_94_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.TCA.2017.04.011"},{"key":"e_1_2_10_95_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2020.119659"},{"key":"e_1_2_10_96_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1400151"},{"key":"e_1_2_10_97_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.4949746"},{"key":"e_1_2_10_98_1","doi-asserted-by":"publisher","DOI":"10.1002\/fam.810190107"},{"key":"e_1_2_10_99_1","doi-asserted-by":"publisher","DOI":"10.1080\/14786446308643429"},{"key":"e_1_2_10_100_1","doi-asserted-by":"publisher","DOI":"10.1115\/1.4043619"},{"key":"e_1_2_10_101_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0149659"},{"key":"e_1_2_10_102_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0238285"},{"key":"e_1_2_10_103_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.50.6077"},{"key":"e_1_2_10_104_1","doi-asserted-by":"publisher","DOI":"10.1126\/SCIENCE.1184014"},{"key":"e_1_2_10_105_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1353189"},{"key":"e_1_2_10_106_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1141498"},{"key":"e_1_2_10_107_1","unstructured":"R.Kantharaj I.Srivastava K. R.Thaker et\u00a0al. \u201cThermal Conduction in Graphite Flake\u2010Epoxy Composites Using Infrared Microscopy \u201d in2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)(2017) 1\u20137."},{"key":"e_1_2_10_108_1","unstructured":"A. U.Gaitonde A.Nimmagadda andA. M.Marconnet \u201cExperimental Characterization of Thermal Conductance Across the Separator\u2010shell Interface in Dry Cylindrical Lithium Ion Batteries \u201d in2017 16th IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm)(2017) 1034\u20131039."},{"key":"e_1_2_10_109_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2018.10.099"},{"key":"e_1_2_10_110_1","unstructured":"P.Jiang X.Qian andR.Yang \u201cA New Elliptical\u2010Beam Method Based on Time\u2010Domain Thermoreflectance (TDTR) to Measure the In\u2010Plane Anisotropic Thermal Conductivity and Its Comparison With the Beam\u2010Offset Method \u201d (2018) 9."},{"key":"e_1_2_10_111_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0077039"},{"key":"e_1_2_10_112_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.3504213"},{"key":"e_1_2_10_113_1","doi-asserted-by":"publisher","DOI":"10.1007\/s10765-005-2365-z"},{"key":"e_1_2_10_114_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.4808055\/355522"},{"key":"e_1_2_10_115_1","doi-asserted-by":"publisher","DOI":"10.1115\/1.4003545\/467292"},{"key":"e_1_2_10_116_1","unstructured":"Y.Zhao R.\u2010S.Chu andA.Majumdar \u201cTransient Thermo\u2010Reflectance Method for Characterization of Thermal Interface Material Based on Carbon Nanotube Array \u201d inInternational Conference on Micro\/Nanoscale Heat Transfer 43901(2009) 435\u2013442."},{"key":"e_1_2_10_117_1","doi-asserted-by":"publisher","DOI":"10.1080\/108939500199637"},{"key":"e_1_2_10_118_1","doi-asserted-by":"publisher","DOI":"10.1103\/RevModPhys.94.025002"},{"key":"e_1_2_10_119_1","doi-asserted-by":"publisher","DOI":"10.1109\/TCPMT.2013.2254175"},{"key":"e_1_2_10_120_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1728417"},{"key":"e_1_2_10_121_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymertesting.2005.03.007"},{"key":"e_1_2_10_122_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1717653"},{"key":"e_1_2_10_123_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2020.119331"},{"key":"e_1_2_10_124_1","doi-asserted-by":"publisher","DOI":"10.1088\/0957-0233\/12\/12\/304"},{"key":"e_1_2_10_125_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1140430"},{"key":"e_1_2_10_126_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijheatmasstransfer.2017.01.025"},{"key":"e_1_2_10_127_1","doi-asserted-by":"publisher","DOI":"10.1115\/1.4053108\/1128901"},{"key":"e_1_2_10_128_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.IJHEATMASSTRANSFER.2015.09.032"},{"key":"e_1_2_10_129_1","doi-asserted-by":"publisher","DOI":"10.1115\/1.4047145"},{"key":"e_1_2_10_130_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cej.2020.128128"},{"key":"e_1_2_10_131_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1136158"},{"key":"e_1_2_10_132_1","unstructured":"A. U.Gaitonde \u201cMetrology Development for Thermal Challenges in Advanced Semiconductor Packaging \u201d (Purdue University West Lafayette 2024) 9."},{"key":"e_1_2_10_133_1","doi-asserted-by":"publisher","DOI":"10.1063\/5.0206247"},{"key":"e_1_2_10_134_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.2130718"},{"key":"e_1_2_10_135_1","doi-asserted-by":"publisher","DOI":"10.1142\/11009"},{"key":"e_1_2_10_136_1","doi-asserted-by":"publisher","DOI":"10.1615\/ANNUALREVHEATTRANSFER.V16.20"},{"key":"e_1_2_10_137_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.8B06290\/ASSET\/IMAGES\/LARGE\/NN\u20102018\u201006290K_0006.JPEG"},{"key":"e_1_2_10_138_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201902575"},{"key":"e_1_2_10_139_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2022.109289"},{"key":"e_1_2_10_140_1","doi-asserted-by":"publisher","DOI":"10.1039\/D1TA00143D"},{"key":"e_1_2_10_141_1","doi-asserted-by":"publisher","DOI":"10.1039\/D3TA05636H"},{"key":"e_1_2_10_142_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.8B12075\/SUPPL_FILE\/AM8B12075_SI_003.AVI"},{"key":"e_1_2_10_143_1","doi-asserted-by":"publisher","DOI":"10.1177\/0954008320922593\/ASSET\/1B04CE91\u201038FC\u20104DCC\u2010A28D\u2010E3B3463B15F5\/ASSETS\/IMAGES\/LARGE\/10.1177_0954008320922593\u2010FIG8.JPG"},{"key":"e_1_2_10_144_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2022.109769"},{"key":"e_1_2_10_145_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAPM.3C00958\/ASSET\/IMAGES\/LARGE\/AP3C00958_0009.JPEG"},{"key":"e_1_2_10_146_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.6B08404\/ASSET\/IMAGES\/LARGE\/AM\u20102016\u2010084043_0009.JPEG"},{"key":"e_1_2_10_147_1","doi-asserted-by":"publisher","DOI":"10.1111\/JACE.19219"},{"key":"e_1_2_10_148_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.cej.2023.143874"},{"key":"e_1_2_10_149_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.ijthermalsci.2019.106259"},{"key":"e_1_2_10_150_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM.2012.6231541"},{"key":"e_1_2_10_151_1","doi-asserted-by":"publisher","DOI":"10.1109\/n\u2010ssc.2006.4785860"},{"key":"e_1_2_10_152_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.47.14850"},{"key":"e_1_2_10_153_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevB.91.085206"},{"key":"e_1_2_10_154_1","doi-asserted-by":"publisher","DOI":"10.1002\/ADEM.202500703"},{"key":"e_1_2_10_155_1","doi-asserted-by":"publisher","DOI":"10.1116\/6.0004912"},{"key":"e_1_2_10_156_1","volume-title":"Tuning Polymer Nanocomposites for Mechanical Performance of Thermal Interface Materials","author":"Pokhrel G."},{"key":"e_1_2_10_157_1","doi-asserted-by":"publisher","DOI":"10.1109\/ITHERM55375.2024.10709599"},{"key":"e_1_2_10_158_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAPM.4C03181\/ASSET\/IMAGES\/LARGE\/AP4C03181_0005.JPEG"},{"key":"e_1_2_10_159_1","doi-asserted-by":"crossref","unstructured":"Y.Guo Y.Zhou andY.Xu \u201cEngineering Polymers With Metal\u2010Like Thermal Conductivity'Present Status and Future Perspectives \u201d (2021) 10.","DOI":"10.1016\/j.polymer.2021.124168"},{"key":"e_1_2_10_160_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41467\u2010019\u201009697\u20107"},{"key":"e_1_2_10_161_1","doi-asserted-by":"publisher","DOI":"10.1021\/acsapm.9b00900"},{"key":"e_1_2_10_162_1","doi-asserted-by":"publisher","DOI":"10.1002\/smtd.202502424"},{"key":"e_1_2_10_163_1","doi-asserted-by":"publisher","DOI":"10.1007\/S10854\u2010019\u201002421\u20107"},{"key":"e_1_2_10_164_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPOSITESB.2024.111219"},{"key":"e_1_2_10_165_1","doi-asserted-by":"publisher","DOI":"10.1016\/S1359\u2010835X(01)00023\u20109"},{"key":"e_1_2_10_166_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPOSITESB.2013.03.002"},{"key":"e_1_2_10_167_1","doi-asserted-by":"publisher","DOI":"10.1002\/APP.35016"},{"key":"e_1_2_10_168_1","doi-asserted-by":"publisher","DOI":"10.1002\/PEN.21336;CSUBTYPE:STRING:SPECIAL;PAGE:STRING:ARTICLE\/CHAPTER"},{"key":"e_1_2_10_169_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.POLYMERTESTING.2004.03.005"},{"key":"e_1_2_10_170_1","doi-asserted-by":"publisher","DOI":"10.1039\/D3TA04770A"},{"key":"e_1_2_10_171_1","doi-asserted-by":"publisher","DOI":"10.1007\/S10570\u2010019\u201002694\u20105\/FIGURES\/8"},{"key":"e_1_2_10_172_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICD.2018.8514630"},{"key":"e_1_2_10_173_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2020.107746"},{"key":"e_1_2_10_174_1","doi-asserted-by":"publisher","DOI":"10.1109\/ICD46958.2020.9341910"},{"key":"e_1_2_10_175_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSOMEGA.2C06013\/ASSET\/IMAGES\/LARGE\/AO2C06013_0009.JPEG"},{"key":"e_1_2_10_176_1","doi-asserted-by":"publisher","DOI":"10.1002\/PSSA.201533010"},{"key":"e_1_2_10_177_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.COMPSCITECH.2023.110419"},{"key":"e_1_2_10_178_1","doi-asserted-by":"publisher","DOI":"10.1021\/NN500134M\/SUPPL_FILE\/NN500134M_SI_001.PDF"},{"key":"e_1_2_10_179_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSNANO.0C09915"},{"key":"e_1_2_10_180_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.0C03978"},{"key":"e_1_2_10_181_1","unstructured":"A.Rohatgi \u201cWebPlotDigitizer \u2010 Extract Data From Plots Images and Maps \u201d Open\u2010Source Software ."},{"key":"e_1_2_10_182_1","doi-asserted-by":"publisher","DOI":"10.1007\/S40097\u2010020\u201000347\u20109"},{"key":"e_1_2_10_183_1","unstructured":"A. D149\u201009 \u201cStandard Test Method for Dielectric Breakdown Voltage and Dielectric Strength of Solid Electrical Insulating Materials at Commercial Power Frequencies \u201d (ASTM International 2013)."},{"key":"e_1_2_10_184_1","article-title":"D150\u201011 Standard Test Methods for AC Loss Characteristics and Permittivity (Dielectric Constant) of Solid Electrical Insulation","author":"ASTM A.","year":"2011","journal-title":"ASTM International"},{"key":"e_1_2_10_185_1","article-title":"Standard Test Methods for DC Resistance or Conductance of Insulating Materials","author":"S. A. D257\u201014","year":"2014","journal-title":"ASTM International"},{"key":"e_1_2_10_186_1","doi-asserted-by":"publisher","DOI":"10.1109\/EEIC.1989.208243"},{"key":"e_1_2_10_187_1","unstructured":"3M \u201c3M CeQUINBORD CGA Inorganic Insulating Board \u201d Technical report 3M (2012)."},{"key":"e_1_2_10_188_1","unstructured":"Qnity \u201cKapton HN Polyimide Film \u201d Technical report Qnity (2026)."},{"key":"e_1_2_10_189_1","unstructured":"DuPontTM \u201cDuPont Kapton MT+ Thermally Conductive Polyimide Film \u201d Technical report DuPontTM(2025)."},{"key":"e_1_2_10_190_1","unstructured":"Qnity \u201cKapton FN Polyimide Film \u201d Technical report Qnity (2026a)."},{"key":"e_1_2_10_191_1","unstructured":"Qnity \u201cKapton EN Polyimide Film \u201d Technical report Qnity (2026b)."},{"key":"e_1_2_10_192_1","unstructured":"Qnity \u201cKapton MT Polyimide Film \u201d Technical report Qnity (2026c)."},{"key":"e_1_2_10_193_1","unstructured":"3M \u201c3M ThermaVolt 10 mil Calendered Inorganic Insulating Paper \u201d Technical report 3M (2013)."},{"key":"e_1_2_10_194_1","unstructured":"3M \u201c3M Flame Barrier FRB\u2010NT Series Data Sheet \u201d Technical report 3M (2012)."},{"key":"e_1_2_10_195_1","doi-asserted-by":"publisher","DOI":"10.1016\/J.CERAMINT.2023.07.224"},{"key":"e_1_2_10_196_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAELM.1C00469"},{"key":"e_1_2_10_197_1","doi-asserted-by":"publisher","DOI":"10.1021\/ACSAMI.4C05971\/ASSET\/IMAGES\/LARGE\/AM4C05971_0006.JPEG"},{"key":"e_1_2_10_198_1","volume-title":"Broadband Dielectric Spectroscopy","author":"Kremer F.","year":"2002"}],"container-title":["Small Methods"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/smtd.71012","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/full-xml\/10.1002\/smtd.71012","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/smtd.71012","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,10,8]],"date-time":"2026-10-08T09:05:35Z","timestamp":1791450335000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1002\/smtd.71012"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2026,9,24]]},"references-count":197,"alternative-id":["10.1002\/smtd.71012"],"URL":"https:\/\/doi.org\/10.1002\/smtd.71012","archive":["Portico"],"relation":{},"ISSN":["2366-9608","2366-9608"],"issn-type":[{"value":"2366-9608","type":"print"},{"value":"2366-9608","type":"electronic"}],"subject":[],"published":{"date-parts":[[2026,9,24]]},"assertion":[{"value":"2026-04-25","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-08-25","order":2,"name":"accepted","label":"Accepted","group":{"name":"publication_history","label":"Publication History"}},{"value":"2026-09-24","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"e71012"}}