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Herein, a PDMAA\u2010deep eutectic solvent (PDMAA\u2010DES) gel is fabricated by anchoring polymerizable DES onto the network backbone during in\u2010situ polymerization. The synergistic covalent and hydrogen bonding interactions between the solvent molecules and the polymeric matrix drastically boost the cohesive energy of the gel. In conjunction with dense polymer network and macromolecular crosslinking, it resolves the contradiction between high toughness and mechanical compliance (high toughness of 21.36\u00a0MJ\/m\n                    <jats:sup>3<\/jats:sup>\n                    and skin compatible low Young's modulus of 200.92\u00a0kPa). Combined with abundant surface groups, the gel realizes robust adhesive strength of 2.85\u00a0MPa on glass and 390\u00a0kPa on pigskin. Besides, doping with dimethyl diallyl ammonium chloride improves the gel's conductivity. This material also presents long\u2010term anti\u2010drying property and electrochemical stability after 10000 cycles. Coupled with its good biocompatibility, the gel is assembled into a wireless wearable sensor, which achieves high precision ECG\/EOG signal collection (SNR of 30.09\u00a0dB), and outstanding resistance to motion artifacts over commercial hydrogel electrodes. This work offers a facile strategy to construct advanced interfacial materials for wearable dynamic physiological signal monitoring.\n                  <\/jats:p>","DOI":"10.1002\/smtd.71027","type":"journal-article","created":{"date-parts":[[2026,9,8]],"date-time":"2026-09-08T06:54:31Z","timestamp":1788850471000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Anchor\u2010Reinforced Deep Eutectic Solvent Gel With Robust Skin Adhesion and Toughness for Stable Bio\u2010interface"],"prefix":"10.1002","volume":"10","author":[{"given":"Shuo","family":"Li","sequence":"first","affiliation":[{"name":"State Key Laboratory For Advanced Metals and Materials School of Materials Science and Engineering University of Science and Technology Beijing  Beijing P. R. 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