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Existing approaches, including anisotropically conductive adhesives and transfer printing, rely on non\u2010patternable or particle\u2010based interconnects, thick bonding layers, or complex processing, constraining interconnect density, scalability, and compatibility with mechanical transformations such as bending, rolling, or folding. Here, we present a patterned solid\u2013liquid interdiffusion (SLID) bonding approach enabling deterministic, fine\u2010pitch heterogeneous integration on ultrathin polymer substrates compatible with standard microfabrication. Electroplated Cu\/Sn pillar bumps fabricated on 5\u00a0\u00b5m polyimide are systematically characterized to define geometric, electrical, and mechanical process window for reliable SLID bonding. The resulting interconnects exhibit controlled solder reflow, low electrical resistance, high mechanical robustness, and minimum inter\u2010pillar spacings of 10\u00a0\u00b5m without adhesives or conductive particles. Microscale light\u2010emitting diodes bonded by SLID remain functional during self\u2010rolling, bending and folding\u2010driven three\u2010dimensional assembly with integrated silicon microchips. This work provides a scalable framework for mechanically reconfigurable microrobotic and flexible microsystems.<\/jats:p>","DOI":"10.1002\/smtd.71031","type":"journal-article","created":{"date-parts":[[2026,10,6]],"date-time":"2026-10-06T12:58:12Z","timestamp":1791291492000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Solid\u2010Liquid Interdiffusion Bonding Enabling Heterogeneous Integration on Flexible and Shapeable Polymer Platforms"],"prefix":"10.1002","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-5235-5370","authenticated-orcid":false,"given":"Yeji","family":"Lee","sequence":"first","affiliation":[{"name":"Material Systems for Nanoelectronics Chemnitz University of Technology  Chemnitz Germany"},{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-2962-5226","authenticated-orcid":false,"given":"Vineeth Kumar","family":"Bandari","sequence":"additional","affiliation":[{"name":"Material Systems for Nanoelectronics Chemnitz University of Technology  Chemnitz Germany"},{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-3127-1527","authenticated-orcid":false,"given":"Daniil","family":"Karnaushenko","sequence":"additional","affiliation":[{"name":"Material Systems for Nanoelectronics Chemnitz University of Technology  Chemnitz Germany"},{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Dmitriy D.","family":"Karnaushenko","sequence":"additional","affiliation":[{"name":"Material Systems for Nanoelectronics Chemnitz University of Technology  Chemnitz Germany"},{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Thomas","family":"Blaudeck","sequence":"additional","affiliation":[{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Chongxian","family":"Wang","sequence":"additional","affiliation":[{"name":"Material Systems for Nanoelectronics Chemnitz University of Technology  Chemnitz Germany"},{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Uwe","family":"Zschenderlein","sequence":"additional","affiliation":[{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"},{"name":"Material and Reliability of Micro Systems Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Nathanael","family":"J\u00f6hrmann","sequence":"additional","affiliation":[{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"},{"name":"Material and Reliability of Micro Systems Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9675-4365","authenticated-orcid":false,"given":"Bernhard","family":"Wunderle","sequence":"additional","affiliation":[{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz Germany"},{"name":"Material and Reliability of Micro Systems Chemnitz University of Technology  Chemnitz Germany"}],"role":[{"vocabulary":"crossref","role":"author"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9503-8367","authenticated-orcid":false,"given":"Oliver G.","family":"Schmidt","sequence":"additional","affiliation":[{"name":"Material Systems for Nanoelectronics Chemnitz University of Technology  Chemnitz Germany"},{"name":"Research Center for Materials, Architectures and Integration of Nanomembranes (MAIN) Chemnitz University of Technology  Chemnitz 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