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However, the gradients of stress across the thickness of individual films or the stress mismatch in composite structural layers can be exploited to obtain highly complex 3D structures via self\u2010assembly, self\u2010bending, self\u2010positioning, or self\u2010rolling processes. Herein, the thin\u2010film residual stresses of amorphous silicon, TiW, AlSiCu, Cr, Au, and SiO<jats:sub>2<\/jats:sub> are assessed using polymer substrates and tuned. Then, a stress\u2010mismatched bi\u2010layer of amorphous silicon (tensile) and TiW (compressive) is used in the fabrication of complex 3D self\u2010rolling micro electromechanical systems (MEMS) structures. The freestanding regions of the fabricated MEMS have a characteristic radius of curvature of \u2248100\u2009\u03bcm. Current\u2010induced thermal actuation of a suspended plate is demonstrated. The microfabrication process and materials used are compatible with standard cleanroom processing and with a variety of substrates. 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