{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,20]],"date-time":"2026-03-20T13:42:41Z","timestamp":1774014161625,"version":"3.50.1"},"reference-count":37,"publisher":"Wiley","issue":"21","license":[{"start":{"date-parts":[[2024,8,29]],"date-time":"2024-08-29T00:00:00Z","timestamp":1724889600000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"},{"start":{"date-parts":[[2024,8,29]],"date-time":"2024-08-29T00:00:00Z","timestamp":1724889600000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/doi.wiley.com\/10.1002\/tdm_license_1.1"}],"funder":[{"DOI":"10.13039\/501100003451","name":"Euskal Herriko Unibertsitatea","doi-asserted-by":"publisher","award":["PIFI20\/04"],"award-info":[{"award-number":["PIFI20\/04"]}],"id":[{"id":"10.13039\/501100003451","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100005004","name":"Ekonomiaren Garapen eta Lehiakortasun Saila, Eusko Jaurlaritza","doi-asserted-by":"publisher","award":["Elkartek"],"award-info":[{"award-number":["Elkartek"]}],"id":[{"id":"10.13039\/501100005004","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/100004431","name":"Directorate-General for Research and Innovation","doi-asserted-by":"publisher","award":["PRTR\u2010C17.I1"],"award-info":[{"award-number":["PRTR\u2010C17.I1"]}],"id":[{"id":"10.13039\/100004431","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100003086","name":"Eusko Jaurlaritza","doi-asserted-by":"publisher","award":["IKUR Program"],"award-info":[{"award-number":["IKUR Program"]}],"id":[{"id":"10.13039\/501100003086","id-type":"DOI","asserted-by":"publisher"}]},{"DOI":"10.13039\/501100001871","name":"Funda\u00e7\u00e3o para a Ci\u00eancia e a Tecnologia","doi-asserted-by":"publisher","award":["UID\/FIS\/04650\/2020"],"award-info":[{"award-number":["UID\/FIS\/04650\/2020"]}],"id":[{"id":"10.13039\/501100001871","id-type":"DOI","asserted-by":"publisher"}]}],"content-domain":{"domain":["advanced.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Adv Eng Mater"],"published-print":{"date-parts":[[2024,11]]},"abstract":"<jats:p>\n                    With the constant increase of electronic waste globally, society is demanding and governments are boosting the development of electronics with less pollutant materials and reduced environmental impact. One way to achieve this is to implement materials that are functional and structural at the same time, reducing material use and assembling parts. Further, printing techniques, such as screen printing, reduce considerably costs and time compared with conventional electronics; combined with methods to conform printed electronics to a 3D shape, such as thermoforming, allow to obtain nonplanar surface electronics simply and efficiently. Herein, screen\u2010printable inks made of styrene\u2013ethylene\/butylene\u2013styrene and different aspect\u2010ratio carbon\u2010based materials for conformable electronics are reported. The inks are prepared with carbon black, carbon nanotubes, and reduced graphene oxide as conductive fillers, printed on a flexible substrate and thermoformed. Carbon black and carbon nanotube samples are functional after the process, with conductivities of 96 and 141\u2009S\u2009m\n                    <jats:sup>\u22121<\/jats:sup>\n                    for the best performing sample of each filler, respectively. Rheological, morphological, thermal, and electrical properties of the materials are also characterized. This study shows the influence of the filler's type and aspect ratio on the morphology and electrical conductivity of the printed materials before and after thermoforming.\n                  <\/jats:p>","DOI":"10.1002\/adem.202400354","type":"journal-article","created":{"date-parts":[[2024,8,29]],"date-time":"2024-08-29T04:39:26Z","timestamp":1724906366000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":6,"title":["Stretchable Conductive Inks with Carbon\u2010Based Fillers for Conformable Printed Electronics"],"prefix":"10.1002","volume":"26","author":[{"ORCID":"https:\/\/orcid.org\/0000-0001-6393-4423","authenticated-orcid":false,"given":"Lia","family":"Campos\u2010Arias","sequence":"first","affiliation":[{"name":"BCMaterials, Basque Center for Materials, Applications and Nanostructures UPV\/EHU Science Park  48940 Leioa Spain"},{"name":"Grupo de Qu\u00edmica Macromolecular (LABQUIMAC) Dpto. Qu\u00edmica\u2010F\u00edsica, Facultad de Ciencia y Tecnolog\u00eda Universidad del Pa\u00eds Vasco (UPV\/EHU)  48940 Leioa Bizkaia Spain"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-1768-4528","authenticated-orcid":false,"given":"Nikola","family":"Pe\u0159inka","sequence":"additional","affiliation":[{"name":"BCMaterials, Basque Center for Materials, Applications and Nanostructures UPV\/EHU Science Park  48940 Leioa Spain"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9887-0925","authenticated-orcid":false,"given":"Pedro","family":"Costa","sequence":"additional","affiliation":[{"name":"Physics Centre of Minho and Porto, Universities (CF\u2010UM\u2010UP) and LaPMET \u2010 Laboratory of Physics for Materials and Emergent Technologies University of Minho  4710\u2010057 Braga Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-0188-4579","authenticated-orcid":false,"given":"Jos\u00e9 Luis","family":"Vilas\u2010Vilela","sequence":"additional","affiliation":[{"name":"BCMaterials, Basque Center for Materials, Applications and Nanostructures UPV\/EHU Science Park  48940 Leioa Spain"},{"name":"Grupo de Qu\u00edmica Macromolecular (LABQUIMAC) Dpto. Qu\u00edmica\u2010F\u00edsica, Facultad de Ciencia y Tecnolog\u00eda Universidad del Pa\u00eds Vasco (UPV\/EHU)  48940 Leioa Bizkaia Spain"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-6791-7620","authenticated-orcid":false,"given":"Senentxu","family":"Lanceros\u2010M\u00e9ndez","sequence":"additional","affiliation":[{"name":"BCMaterials, Basque Center for Materials, Applications and Nanostructures UPV\/EHU Science Park  48940 Leioa Spain"},{"name":"Physics Centre of Minho and Porto, Universities (CF\u2010UM\u2010UP) and LaPMET \u2010 Laboratory of Physics for Materials and Emergent Technologies University of Minho  4710\u2010057 Braga Portugal"},{"name":"IKERBASQUE Basque Foundation for Science  48009 Bilbao Spain"}]}],"member":"311","published-online":{"date-parts":[[2024,8,29]]},"reference":[{"key":"e_1_2_9_2_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2020.105881"},{"key":"e_1_2_9_3_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmst.2022.10.047"},{"key":"e_1_2_9_4_1","volume-title":"The Global E\u2010Waste Monitor 2020: Quantities, Flows and the Circular Economy Potential","author":"Forti V.","year":"2020"},{"key":"e_1_2_9_5_1","doi-asserted-by":"crossref","unstructured":"T.Loher M.Seckel J.Haberland J.Marques M.von Krshiwoblozki C.Kallmayer A.Ostmann in2019 IEEE CPMT Symp. Japan (ICSJ) IEEE Kyoto2019 pp.113\u2013117.","DOI":"10.1109\/ICSJ47124.2019.8998743"},{"key":"e_1_2_9_6_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.polymer.2022.124804"},{"key":"e_1_2_9_7_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201004692"},{"key":"e_1_2_9_8_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-023-00242-7"},{"key":"e_1_2_9_9_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.indcrop.2023.116842"},{"key":"e_1_2_9_10_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41528-023-00258-z"},{"key":"e_1_2_9_11_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.mtsust.2022.100292"},{"key":"e_1_2_9_12_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202213744"},{"key":"e_1_2_9_13_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.orgel.2022.106612"},{"key":"e_1_2_9_14_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.sna.2022.113821"},{"key":"e_1_2_9_15_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jechem.2021.08.011"},{"key":"e_1_2_9_16_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.icheatmasstransfer.2010.01.005"},{"key":"e_1_2_9_17_1","doi-asserted-by":"publisher","DOI":"10.1002\/pen.25918"},{"key":"e_1_2_9_18_1","doi-asserted-by":"crossref","unstructured":"P.Lall V.Soni H.Jang F.Musa M. G.Sarwar S.Miller in2024 IEEE 74th Electron. Comp. Technol. Conf. (ECTC) Denver2024 pp.1198\u20131205.","DOI":"10.1109\/ECTC51529.2024.00193"},{"key":"e_1_2_9_19_1","doi-asserted-by":"publisher","DOI":"10.1002\/adem.202200730"},{"key":"e_1_2_9_20_1","doi-asserted-by":"crossref","unstructured":"C.Kallmayer F.Schaller T.Loher J.Haberland F.Kayatz A.Schult in2018 IEEE 13th Int. Congress Mold. Interconnect Dev. (MID) IEEE W\u00fcrzburg2018 pp.1\u20136.","DOI":"10.1109\/ICMID.2018.8526929"},{"key":"e_1_2_9_21_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-020-05377-9"},{"key":"e_1_2_9_22_1","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/acdfe0"},{"key":"e_1_2_9_23_1","unstructured":"O.Rusanen T.Simula P.Niskala V.Lindholm M.Heikkinen in2019 IEEE 22nd Eur. Microelectron. Packaging Conf. Exhib. (EMPC) IEEE Pisa2019 pp.1\u20137."},{"key":"e_1_2_9_24_1","unstructured":"A.Wimmer H.Reichel K.Schmidt in2018 IEEE 13th Int. Congress Mold. Interconnect Dev. (MID) IEEE W\u00fcrzburg2018 pp.1\u20135."},{"key":"e_1_2_9_25_1","doi-asserted-by":"publisher","DOI":"10.1088\/2058-8585\/acd129"},{"key":"e_1_2_9_26_1","doi-asserted-by":"publisher","DOI":"10.1021\/acsapm.3c01151"},{"key":"e_1_2_9_27_1","doi-asserted-by":"publisher","DOI":"10.3390\/coatings13091548"},{"key":"e_1_2_9_28_1","doi-asserted-by":"publisher","DOI":"10.1186\/s40510-021-00362-8"},{"key":"e_1_2_9_29_1","unstructured":"GTeek PETG Sheets Data https:\/\/www.gteek.com\/PETG\u2010sheets accessed: July 2024."},{"key":"e_1_2_9_30_1","doi-asserted-by":"publisher","DOI":"10.3390\/mi13101655"},{"key":"e_1_2_9_31_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.carbpol.2020.115855"},{"key":"e_1_2_9_32_1","doi-asserted-by":"publisher","DOI":"10.1016\/B978-0-323-52472-8.00009-5"},{"key":"e_1_2_9_33_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.eurpolymj.2019.109226"},{"key":"e_1_2_9_34_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesb.2015.09.001"},{"key":"e_1_2_9_35_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.compositesa.2013.01.004"},{"key":"e_1_2_9_36_1","doi-asserted-by":"publisher","DOI":"10.1103\/PhysRevLett.59.1305"},{"key":"e_1_2_9_37_1","unstructured":"M.Gill A.Gruner N.Ghalib M.Sussman S.Avuthu G.Wable J.Richstein inIPC APEX EXPO Proc. IPC St. Petersburg FL2018."},{"key":"e_1_2_9_38_1","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.202100194"}],"container-title":["Advanced Engineering Materials"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/adem.202400354","content-type":"application\/pdf","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/full-xml\/10.1002\/adem.202400354","content-type":"application\/xml","content-version":"vor","intended-application":"text-mining"},{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/adem.202400354","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2026,3,8]],"date-time":"2026-03-08T15:51:04Z","timestamp":1772985064000},"score":1,"resource":{"primary":{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/10.1002\/adem.202400354"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024,8,29]]},"references-count":37,"journal-issue":{"issue":"21","published-print":{"date-parts":[[2024,11]]}},"alternative-id":["10.1002\/adem.202400354"],"URL":"https:\/\/doi.org\/10.1002\/adem.202400354","archive":["Portico"],"relation":{},"ISSN":["1438-1656","1527-2648"],"issn-type":[{"value":"1438-1656","type":"print"},{"value":"1527-2648","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024,8,29]]},"assertion":[{"value":"2024-02-12","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2024-08-29","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"2400354"}}