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A paradigm shift toward a more sustainable future through the development of soft material architectures that are robust and durable, but also degradable by external stimuli is proposed. Hydrogels, a class of soft polymers with exceptional properties, and high water content are rarely used as substrates, mainly due to lack of ink\u2010adhesion and rapid dehydration. Herein, photodegradable hydrogels are tailor\u2010made that are nondrying, robust, adhesive to ink, and permit triggerable degradation, making them suitable substrates for sustainable electronics. These hydrogels are prepared by reversible ionic crosslinking between sodium alginate and divalent cations (Ca<jats:sup>2+<\/jats:sup>) and light\u2010responsive crosslinking of poly(acrylamide) (PAAm) chains through synthesized ortho\u2010nitrobenzyl (ONB)\u2010based crosslinkers. By displacing the water molecules in the hydrogels by immersion in glycerol, the drying problem and printability of conductive ink are addressed. It is demonstrated that digital printing of a liquid metal (LM)\u2010based stretchable ink over the developed substrate, shows several body\u2010worn printed wearable sensors, and demonstrates their degradation and recycling of the expensive metals. This work lays the foundation for the use of hydrogels as promising substrates for the next generation of environmentally friendly electronics.<\/jats:p>","DOI":"10.1002\/admt.202301007","type":"journal-article","created":{"date-parts":[[2023,8,3]],"date-time":"2023-08-03T03:39:18Z","timestamp":1691033958000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":9,"title":["Photodegradable Non\u2010Drying Hydrogel Substrates for Liquid Metal Based Sustainable Soft\u2010Matter Electronics"],"prefix":"10.1002","volume":"8","author":[{"given":"Rita G.","family":"Fonseca","sequence":"first","affiliation":[{"name":"CEMMPRE \u2013 Department of Chemical Engineering University of Coimbra  Coimbra 3030\u2013790 Portugal"}]},{"given":"Abdollah","family":"Hajalilou","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Engineering University of Coimbra  Coimbra 3030\u2013194 Portugal"}]},{"given":"Marta","family":"Freitas","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Engineering University of Coimbra  Coimbra 3030\u2013194 Portugal"}]},{"given":"Aline","family":"Kuster","sequence":"additional","affiliation":[{"name":"CEMMPRE \u2013 Department of Chemical Engineering University of Coimbra  Coimbra 3030\u2013790 Portugal"}]},{"given":"Elahe","family":"Parvini","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Engineering University of Coimbra  Coimbra 3030\u2013194 Portugal"}]},{"given":"Arm\u00e9nio C.","family":"Serra","sequence":"additional","affiliation":[{"name":"CEMMPRE \u2013 Department of Chemical Engineering University of Coimbra  Coimbra 3030\u2013790 Portugal"}]},{"given":"Jorge F. J.","family":"Coelho","sequence":"additional","affiliation":[{"name":"CEMMPRE \u2013 Department of Chemical Engineering University of Coimbra  Coimbra 3030\u2013790 Portugal"}]},{"given":"Ana C.","family":"Fonseca","sequence":"additional","affiliation":[{"name":"CEMMPRE \u2013 Department of Chemical Engineering University of Coimbra  Coimbra 3030\u2013790 Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8365-5381","authenticated-orcid":false,"given":"Mahmoud","family":"Tavakoli","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Engineering University of Coimbra  Coimbra 3030\u2013194 Portugal"}]}],"member":"311","published-online":{"date-parts":[[2023,8,3]]},"reference":[{"key":"e_1_2_8_1_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202205956"},{"key":"e_1_2_8_2_1","doi-asserted-by":"publisher","DOI":"10.3390\/s20236835"},{"key":"e_1_2_8_3_1","doi-asserted-by":"crossref","unstructured":"M.Virone P.Lopes R. 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