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Conventional LM composites use metallic powders and elastomeric binders to enable coating and printing, but rely on scarce, expensive metals, require sintering, exhibit reduced conductivity, and are difficult to recycle due to strong binding among components. A room temperature, sinter\u2010free, and binder\u2010free printable EGaIn\u2013Carbon Black (CB) composite is introduced to address these limitations. The composite avoids intermetallic formation, enhancing recyclability. Although phase separation typically hinders stability, a tailored carbon activation process enables uniform dispersion. Incorporating only 1.5\u00a0wt.% CB imparts high viscosity (120\u00a0Pa\u00a0s at 10\u00a0s\n                    <jats:sup>\u22121<\/jats:sup>\n                    , 25\u00b0C), shear\u2010thinning behavior, and excellent printability without requiring binders. The composite achieves \u223c60% of bulk EGaIn conductivity, while dynamic conductive bridge reformation enables mechanical stretchability and strain\u2010resilient performance. It also exhibits high thermal conductivity and strong electromagnetic interference (EMI) shielding (\u223c35\u00a0dB in the X\u2010band), which increases to \u223c70\u00a0dB under 100% strain due to network densification. As thermal interface materials, the composite reduces device temperature from \u223c80\u00b0C to \u223c32\u00b0C within 20\u00a0min\u2014outperforming commercial silicone pastes\u2014owing to its high thermal conductivity, surface conformity, and stable interfacial contact.\n                  <\/jats:p>","DOI":"10.1002\/admt.202502405","type":"journal-article","created":{"date-parts":[[2025,12,13]],"date-time":"2025-12-13T02:24:16Z","timestamp":1765592656000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Recyclable and Binder\u2010Free EGaIn\u2013Carbon Liquid Metal Composite: A Sustainable Approach for High\u2010Performance Stretchable Electronics, Thermal\u2010Interfacing and EMI\u2010Shielding"],"prefix":"10.1002","volume":"11","author":[{"given":"Elahe","family":"Parvini","sequence":"first","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Eng. University of Coimbra Coimbra  Portugal"}]},{"given":"Abdollah","family":"Hajalilou","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Eng. University of Coimbra Coimbra  Portugal"}]},{"given":"Pedro A.","family":"Lopes","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Eng. University of Coimbra Coimbra  Portugal"}]},{"given":"Tiago A.","family":"Morgado","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Eng. University of Coimbra Coimbra  Portugal"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-8365-5381","authenticated-orcid":false,"given":"Mahmoud","family":"Tavakoli","sequence":"additional","affiliation":[{"name":"Soft and Printed Microelectronics Lab Department of Electrical Eng. 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