{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,20]],"date-time":"2026-04-20T16:57:38Z","timestamp":1776704258268,"version":"3.51.2"},"reference-count":65,"publisher":"Wiley","issue":"26","license":[{"start":{"date-parts":[[2023,7,12]],"date-time":"2023-07-12T00:00:00Z","timestamp":1689120000000},"content-version":"vor","delay-in-days":0,"URL":"http:\/\/creativecommons.org\/licenses\/by\/4.0\/"}],"content-domain":{"domain":["advanced.onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Advanced Science"],"published-print":{"date-parts":[[2023,9]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>Despite advances in soft, sticker\u2010like electronics, few efforts have dealt with the challenge of electronic waste. Here, this is addressed by introducing an eco\u2010friendly conductive ink for thin\u2010film circuitry composed of silver flakes and a water\u2010based polyurethane dispersion. This ink uniquely combines high electrical conductivity (1.6\u00a0\u00d7\u00a010<jats:sup>5<\/jats:sup> S m<jats:sup>\u22121<\/jats:sup>), high resolution digital printability, robust adhesion for microchip integration, mechanical resilience, and recyclability.\u00a0 Recycling is achieved with an ecologically\u2010friendly processing method to decompose the circuits into constituent elements and recover the conductive ink with a decrease of only 2.4% in conductivity. Moreover, adding liquid metal enables stretchability of up to 200% strain, although this introduces the need for more complex recycling steps. Finally, on\u2010skin electrophysiological monitoring biostickers along with a recyclable smart package with integrated sensors for monitoring safe storage of perishable foods are demonstrated.<\/jats:p>","DOI":"10.1002\/advs.202301673","type":"journal-article","created":{"date-parts":[[2023,7,12]],"date-time":"2023-07-12T09:11:31Z","timestamp":1689153091000},"update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":47,"title":["Recyclable Thin\u2010Film Soft Electronics for Smart Packaging and E\u2010Skins"],"prefix":"10.1002","volume":"10","author":[{"ORCID":"https:\/\/orcid.org\/0000-0002-3669-3457","authenticated-orcid":false,"given":"Manuel","family":"Reis Carneiro","sequence":"first","affiliation":[{"name":"Soft Machines Lab Department of Mechanical Engineering Carnegie Mellon University Pittsburgh PA 15213 USA"},{"name":"Institute of Systems and Robotics Department of Electrical and Computer Engineering University of Coimbra Coimbra 3030\u2010290 Portugal"}]},{"given":"An\u00edbal T.","family":"de Almeida","sequence":"additional","affiliation":[{"name":"Institute of Systems and Robotics Department of Electrical and Computer Engineering University of Coimbra Coimbra 3030\u2010290 Portugal"}]},{"given":"Mahmoud","family":"Tavakoli","sequence":"additional","affiliation":[{"name":"Institute of Systems and Robotics Department of Electrical and Computer Engineering University of Coimbra Coimbra 3030\u2010290 Portugal"}]},{"given":"Carmel","family":"Majidi","sequence":"additional","affiliation":[{"name":"Soft Machines Lab Department of Mechanical Engineering Carnegie Mellon University Pittsburgh PA 15213 USA"}]}],"member":"311","published-online":{"date-parts":[[2023,7,12]]},"reference":[{"key":"e_1_2_8_1_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.resconrec.2017.01.018"},{"key":"e_1_2_8_2_1","doi-asserted-by":"publisher","DOI":"10.1016\/S2214-109X(13)70101-3"},{"key":"e_1_2_8_3_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.201801852"},{"key":"e_1_2_8_4_1","doi-asserted-by":"publisher","DOI":"10.1039\/C5TC00330J"},{"key":"e_1_2_8_5_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201203589"},{"key":"e_1_2_8_6_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41598-020-62097-6"},{"key":"e_1_2_8_7_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202113232"},{"key":"e_1_2_8_8_1","doi-asserted-by":"publisher","DOI":"10.1109\/JSEN.2021.3126159"},{"key":"e_1_2_8_9_1","doi-asserted-by":"publisher","DOI":"10.1002\/aelm.201600356"},{"key":"e_1_2_8_10_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41563-021-00921-8"},{"key":"e_1_2_8_11_1","doi-asserted-by":"publisher","DOI":"10.1126\/science.1206157"},{"key":"e_1_2_8_12_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-022-00723-z"},{"key":"e_1_2_8_13_1","doi-asserted-by":"publisher","DOI":"10.1002\/admt.202000070"},{"key":"e_1_2_8_14_1","doi-asserted-by":"publisher","DOI":"10.1021\/acssensors.1c02606"},{"key":"e_1_2_8_15_1","doi-asserted-by":"publisher","DOI":"10.1109\/JPROC.2019.2908433"},{"key":"e_1_2_8_16_1","doi-asserted-by":"publisher","DOI":"10.1039\/C7NR01604B"},{"key":"e_1_2_8_17_1","doi-asserted-by":"publisher","DOI":"10.1039\/C8TC04753G"},{"key":"e_1_2_8_18_1","doi-asserted-by":"publisher","DOI":"10.1002\/smll.202107298"},{"key":"e_1_2_8_19_1","first-page":"89","volume":"5","author":"Wiklund J.","year":"2021","journal-title":"J. Manuf. Mater. Process."},{"key":"e_1_2_8_20_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jclepro.2015.02.024"},{"key":"e_1_2_8_21_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-020-00510-8"},{"key":"e_1_2_8_22_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41467-022-28027-y"},{"key":"e_1_2_8_23_1","doi-asserted-by":"publisher","DOI":"10.1002\/adsu.202100035"},{"key":"e_1_2_8_24_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41746-017-0009-x"},{"key":"e_1_2_8_25_1","doi-asserted-by":"publisher","DOI":"10.1126\/sciadv.1601314"},{"key":"e_1_2_8_26_1","doi-asserted-by":"publisher","DOI":"10.1039\/C9TC04246F"},{"key":"e_1_2_8_27_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-021-00545-5"},{"key":"e_1_2_8_28_1","doi-asserted-by":"publisher","DOI":"10.1038\/s41928-018-0116-y"},{"key":"e_1_2_8_29_1","doi-asserted-by":"publisher","DOI":"10.1002\/smll.201903753"},{"key":"e_1_2_8_30_1","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.5b08125"},{"key":"e_1_2_8_31_1","doi-asserted-by":"publisher","DOI":"10.1021\/acsami.0c22206"},{"key":"e_1_2_8_32_1","doi-asserted-by":"publisher","DOI":"10.1002\/admt.202200534"},{"key":"e_1_2_8_33_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jmatprotec.2014.08.002"},{"key":"e_1_2_8_34_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jtice.2018.01.046"},{"key":"e_1_2_8_35_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.jsamd.2021.09.002"},{"key":"e_1_2_8_36_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.201202249"},{"key":"e_1_2_8_37_1","unstructured":"P.Lall J.Narangaparambil S.Miller inProc. ASME 2021 Int. Tech. Conf. Exhib. Packag. Integr. Electron. Photonic Microsystems InterPACK 2021 ASME New York2021 https:\/\/doi.org\/10.1115\/IPACK2021\u201074086."},{"key":"e_1_2_8_38_1","doi-asserted-by":"crossref","unstructured":"P.Lall K.Goyal K.Schulze S.Miller inIntersoc. Conf. Therm. Thermomechanical Phenom. Electron. Syst. ITHERM IEEE 2021 pp.807\u2013817.","DOI":"10.1109\/ITherm51669.2021.9503235"},{"key":"e_1_2_8_39_1","doi-asserted-by":"crossref","unstructured":"H.Wu C.Yang J.Liu X.Cui B.Xie Z.Zhang inProc. Electron. Packag. Technol. Conf. EPTC IEEE 2014 pp.1544\u20131546 https:\/\/doi.org\/10.1109\/ICEPT.2014.6922948.","DOI":"10.1109\/ICEPT.2014.6922948"},{"key":"e_1_2_8_40_1","doi-asserted-by":"crossref","unstructured":"J.Lee J.Sjoberg D. T.Rooney D. A.Geiger D.Shangguan inProc. IEEE\/CPMT Int. Electron. Manuf. Technol. Symp IEEE 2008 https:\/\/doi.org\/10.1109\/IEMT.2008.5507852.","DOI":"10.1109\/IEMT.2008.5507852"},{"key":"e_1_2_8_41_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.resconrec.2022.106757"},{"key":"e_1_2_8_42_1","doi-asserted-by":"publisher","DOI":"10.3390\/ma15030957"},{"key":"e_1_2_8_43_1","doi-asserted-by":"publisher","DOI":"10.1021\/acsnano.2c07723"},{"key":"e_1_2_8_44_1","doi-asserted-by":"crossref","unstructured":"V.Arroyos M. L. K.Viitaniemi N.Keehn V.Oruganti W.Saunders K.Strauss V.Iyer B. H.Nguyen inConf. Hum. Factors Comput. Syst. \u2013 Proc ACM. 2022 https:\/\/doi.org\/10.1145\/3491101.3519823.","DOI":"10.1145\/3491101.3519823"},{"key":"e_1_2_8_45_1","doi-asserted-by":"publisher","DOI":"10.1002\/csr.1722"},{"key":"e_1_2_8_46_1","doi-asserted-by":"publisher","DOI":"10.1002\/admt.202201557"},{"key":"e_1_2_8_47_1","doi-asserted-by":"publisher","DOI":"10.1039\/C6NR03054H"},{"key":"e_1_2_8_48_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202002695"},{"key":"e_1_2_8_49_1","doi-asserted-by":"crossref","unstructured":"R.Sliz M.Karzarjeddi H.Liimatainen T.Fabritius inProc. 2021 IEEE 11th Int. Conf. ''Nanomaterials Appl. Prop. N. 2021 IEEE Piscataway NJ2021 https:\/\/doi.org\/10.1109\/NAP51885.2021.9568541.","DOI":"10.1109\/NAP51885.2021.9568541"},{"key":"e_1_2_8_50_1","doi-asserted-by":"publisher","DOI":"10.1007\/s00170-008-1660-9"},{"key":"e_1_2_8_51_1","doi-asserted-by":"publisher","DOI":"10.1002\/adem.202100953"},{"key":"e_1_2_8_52_1","doi-asserted-by":"publisher","DOI":"10.1007\/s40820-021-00592-9"},{"key":"e_1_2_8_53_1","doi-asserted-by":"publisher","DOI":"10.1002\/app.50561"},{"key":"e_1_2_8_54_1","doi-asserted-by":"publisher","DOI":"10.1021\/acssuschemeng.0c04701"},{"key":"e_1_2_8_55_1","doi-asserted-by":"publisher","DOI":"10.1002\/adma.202203266"},{"key":"e_1_2_8_56_1","first-page":"29","volume":"5","author":"Deac L. M.","year":"2020","journal-title":"J. Clin. Rev. Case Rep."},{"key":"e_1_2_8_57_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.eswa.2017.03.012"},{"key":"e_1_2_8_58_1","doi-asserted-by":"publisher","DOI":"10.1186\/1475-925X-12-73"},{"key":"e_1_2_8_59_1","volume-title":"Proceedings \u2013 IEEE International Symposium on Circuits and Systems","author":"Moin A.","year":"2018"},{"key":"e_1_2_8_60_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.clinph.2020.11.039"},{"key":"e_1_2_8_61_1","doi-asserted-by":"publisher","DOI":"10.13005\/bpj\/2136"},{"key":"e_1_2_8_62_1","doi-asserted-by":"publisher","DOI":"10.1134\/S0362119721020043"},{"key":"e_1_2_8_63_1","doi-asserted-by":"publisher","DOI":"10.3390\/diagnostics11071275"},{"key":"e_1_2_8_64_1","volume-title":"Introduction to ECG Interpretation","author":"Yanowitz F. G.","year":"2018"},{"key":"e_1_2_8_65_1","doi-asserted-by":"publisher","DOI":"10.1002\/adfm.202205956"}],"container-title":["Advanced Science"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/advs.202301673","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,10,6]],"date-time":"2025-10-06T17:34:09Z","timestamp":1759772049000},"score":1,"resource":{"primary":{"URL":"https:\/\/advanced.onlinelibrary.wiley.com\/doi\/10.1002\/advs.202301673"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023,7,12]]},"references-count":65,"journal-issue":{"issue":"26","published-print":{"date-parts":[[2023,9]]}},"alternative-id":["10.1002\/advs.202301673"],"URL":"https:\/\/doi.org\/10.1002\/advs.202301673","archive":["Portico"],"relation":{},"ISSN":["2198-3844","2198-3844"],"issn-type":[{"value":"2198-3844","type":"print"},{"value":"2198-3844","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023,7,12]]},"assertion":[{"value":"2023-03-17","order":0,"name":"received","label":"Received","group":{"name":"publication_history","label":"Publication History"}},{"value":"2023-07-12","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}],"article-number":"2301673"}}