{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,8,15]],"date-time":"2025-08-15T01:57:17Z","timestamp":1755223037603,"version":"3.43.0"},"reference-count":17,"publisher":"Wiley","issue":"5","license":[{"start":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T00:00:00Z","timestamp":1747785600000},"content-version":"vor","delay-in-days":20,"URL":"http:\/\/onlinelibrary.wiley.com\/termsAndConditions#vor"}],"content-domain":{"domain":["onlinelibrary.wiley.com"],"crossmark-restriction":true},"short-container-title":["Materialwissenschaft Werkst"],"published-print":{"date-parts":[[2025,5]]},"abstract":"<jats:title>Abstract<\/jats:title><jats:p>The replacement of glass fibres by cellulose\u2010based fibres in printed circuit board (PCB) is motivated by environmental reasons since the use of biodegradable components from renewable sources will have a significative impact in the life\u2010cycle assessment and sustainability evaluation of these materials. To study the potential of replacement of glass fibres by natural fibres in printed circuit board manufacturing we have used a finite element method (FEM) computational simulation methodology to evaluate the influence of key structural parameters on their thermomechanical properties, with the goal of predicting and quantifying its warpage at soldering process temperatures. In our work some printed circuit board (PCB) configurations have been selected and modelled using different natural fibres and compared with conventional printed circuit board systems, designated by flame retardant epoxy (FR4), that are made from glass fibres, epoxide resin and copper foils. The simulation results indicate that the printed circuit board assembly process, namely the number of layers, has a major influence on the key thermomechanical properties that were studied. Some optimized printed circuit board configurations were selected, based on the simulation studies, and the natural fibres were classified according to their potential to be used in the development of sustainable printed circuit board materials.<\/jats:p>","DOI":"10.1002\/mawe.202400028","type":"journal-article","created":{"date-parts":[[2025,5,21]],"date-time":"2025-05-21T09:17:26Z","timestamp":1747819046000},"page":"715-725","update-policy":"https:\/\/doi.org\/10.1002\/crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Simulation studies of printed circuit board using finite element method to evaluate the potential of cellulose fibres to replace glass fibres"],"prefix":"10.1002","volume":"56","author":[{"given":"J. C.","family":"Velosa","sequence":"first","affiliation":[{"name":"Fiber Materials and Environmental Technologies Research Unit (FibEnTech-UBI) Universidade da Beira Interior  Rua Marqu\u00eas de D'\u00c1vila e Bolama 6201-001 Covilh\u00e3 Portugal"}]},{"given":"J. M. R.","family":"Curto","sequence":"additional","affiliation":[{"name":"Fiber Materials and Environmental Technologies Research Unit (FibEnTech-UBI) Universidade da Beira Interior  Rua Marqu\u00eas de D'\u00c1vila e Bolama 6201-001 Covilh\u00e3 Portugal"},{"name":"Departamento de Qu\u00edmica Universidade da Beira Interior  Rua Marqu\u00eas de D'\u00c1vila e Bolama 6201-001 Covilh\u00e3 Portugal"}]}],"member":"311","published-online":{"date-parts":[[2025,5,21]]},"reference":[{"key":"e_1_2_9_1_1","unstructured":"D. Mateus S. Teixeira N. Rodrigues V. Carvalho D. Santos J. Velosa D. Soares J. Teixeira ASME International Mechanical Engineering Congress and Exposition Proceedings (IMECE) 2021 2\u2005A."},{"key":"e_1_2_9_2_1","unstructured":"N. Rodrigues I. Teixeira C. Carvalho D. Santosm J.\u2005C. Velosa A. Ferreira D. Soares. J. Teixeira S. TeixeiraASME International Mechanical Engineering Congress and Exposition Proceedings (IMECE) 2023 2-B."},{"key":"e_1_2_9_3_1","first-page":"2169","author":"Mohamed Sunar M. S.","year":"2022","journal-title":"J Phys Conf Ser"},{"key":"e_1_2_9_4_1","doi-asserted-by":"publisher","DOI":"10.1177\/0731684411431354"},{"key":"e_1_2_9_5_1","unstructured":"S.\u2005R. Patinha J. C: Velosa A. Alves S. Rana R. Fangueiro presented atICNF2013 \u2013 1st Internacional Conference on Natural Fibres Guimar\u00e3es Portugal June 9 \u2013 June11 2013 pp. 103\u2013104."},{"key":"e_1_2_9_6_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.commatsci.2022.111389"},{"key":"e_1_2_9_7_1","doi-asserted-by":"crossref","unstructured":"T. Liu M. Devarajan 72nd Electronic Components and Technology Conference (ECTC) 2022 pp. 2244\u20132248.","DOI":"10.1109\/ECTC51906.2022.00354"},{"key":"e_1_2_9_8_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1523635"},{"key":"e_1_2_9_9_1","unstructured":"P. Hutapea J.\u2005L. Grenestedt Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes Properties and Interfaces 2004 230."},{"key":"e_1_2_9_10_1","doi-asserted-by":"publisher","DOI":"10.1063\/1.1523635"},{"key":"e_1_2_9_11_1","unstructured":"J. Clyde F. Coombs Printed Circuits Handbook Sixth Edit. New York\/USA: McGraw-Hill 2008."},{"key":"e_1_2_9_12_1","unstructured":"S.\u2005P. Timoshenko J.\u2005N. Good Theory of Elasticity Third Edition McGraw-Hill 1970."},{"journal-title":"Micromechanics of Composite Materials.","year":"2013","author":"Aboudi J.","key":"e_1_2_9_13_1"},{"key":"e_1_2_9_14_1","volume":"164","author":"Nakagawa Y.","year":"2012","journal-title":"Materials & Design"},{"key":"e_1_2_9_15_1","volume":"172","author":"Weiss B.","year":"2002","journal-title":"Sensors and Actuators: A Physical"},{"key":"e_1_2_9_16_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.asoc.2012.03.066"},{"key":"e_1_2_9_17_1","doi-asserted-by":"publisher","DOI":"10.1016\/j.asoc.2012.03.066"}],"container-title":["Materialwissenschaft und Werkstofftechnik"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/pdf\/10.1002\/mawe.202400028","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,8,11]],"date-time":"2025-08-11T10:17:12Z","timestamp":1754907432000},"score":1,"resource":{"primary":{"URL":"https:\/\/onlinelibrary.wiley.com\/doi\/10.1002\/mawe.202400028"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025,5]]},"references-count":17,"journal-issue":{"issue":"5","published-print":{"date-parts":[[2025,5]]}},"alternative-id":["10.1002\/mawe.202400028"],"URL":"https:\/\/doi.org\/10.1002\/mawe.202400028","archive":["Portico"],"relation":{},"ISSN":["0933-5137","1521-4052"],"issn-type":[{"type":"print","value":"0933-5137"},{"type":"electronic","value":"1521-4052"}],"subject":[],"published":{"date-parts":[[2025,5]]},"assertion":[{"value":"2025-05-21","order":3,"name":"published","label":"Published","group":{"name":"publication_history","label":"Publication History"}}]}}