{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T14:19:02Z","timestamp":1736518742280,"version":"3.32.0"},"publisher-location":"Boston","reference-count":14,"publisher":"Kluwer Academic Publishers","isbn-type":[{"type":"print","value":"0387312765"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"DOI":"10.1007\/0-387-31277-3_16","type":"book-chapter","created":{"date-parts":[[2006,8,16]],"date-time":"2006-08-16T16:55:14Z","timestamp":1155747314000},"page":"155-166","source":"Crossref","is-referenced-by-count":3,"title":["Tolerance Budgeting in a Novel Coarse-Fine Strategy for Micro-Assembly"],"prefix":"10.1007","author":[{"given":"Vincent","family":"Henneken","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Marcel","family":"Tichem","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","reference":[{"key":"16_CR1","unstructured":"M. Tichem and B. Karpuschewski, Structuring of micro-assembly methods, CD-ROM Proceedings of the 33rd Int. Symp. on Robotics, Stockholm (October 7\u201311, 2002)."},{"key":"16_CR2","doi-asserted-by":"publisher","first-page":"667","DOI":"10.1088\/0960-1317\/14\/5\/002","volume":"14","author":"R.R.A. Syms","year":"2004","unstructured":"R.R.A. Syms, H. Zou, and J. Stagg, Robust latching MEMS translation stages for micro-optical systems, J. Micromech. Microeng. 14, 667\u2013674 (2004).","journal-title":"J. Micromech. Microeng."},{"key":"16_CR3","unstructured":"V.A. Henneken, S.P.W. van den Bedem, M. Tichem, B. Karpuschewski, and P.M. Sarro, Design of in-package MST-based actuators for micro-assembly, CD-ROM Proceedings 7th SAFE workshop, Veldhoven, the Netherlands (November 25\u201326, 2004)."},{"key":"16_CR4","unstructured":"Q. Tan, Y.C. Lee, Soldering technology for optoelectronic packaging, Proceedings IEEE ECTC, pp. 26\u201336 (1996)."},{"key":"16_CR5","volume-title":"Optoelectronic Packaging","author":"A.R. Mickelson","year":"1997","unstructured":"A.R. Mickelson, N.R. Basavanhally, Y.C. Lee, Optoelectronic Packaging (John Wiley & Sons, New York, 1997)."},{"issue":"6","key":"16_CR6","doi-asserted-by":"crossref","first-page":"499","DOI":"10.1049\/el:19910314","volume":"27","author":"R.M. Edge","year":"1991","unstructured":"R.M. Edge, Flip-chip solder bond mounting of laser diodes, Electron. Lett. 27(6), 499\u2013501 (1991).","journal-title":"Electron. Lett."},{"issue":"4","key":"16_CR7","doi-asserted-by":"publisher","first-page":"569","DOI":"10.1109\/6040.982846","volume":"24","author":"J. Sasaki","year":"2001","unstructured":"J. Sasaki, M. Itoh, T. Tamanuki, et al., Multiple-chip precise self-aligned assembly for hybrid integrated optical modules using Au-Sn solder bumps, IEEE Trans. Adv. Pack. 24(4), 569\u2013575 (2001).","journal-title":"IEEE Trans. Adv. Pack."},{"key":"16_CR8","doi-asserted-by":"crossref","unstructured":"M. Itoh, Passive alignment on Si optical bench using Au-Sn solder bumps, Proceedings IEEE LEOS 10th Annual Meeting, pp. 126\u2013127 (1997).","DOI":"10.1109\/LEOS.1997.645300"},{"issue":"3","key":"16_CR9","doi-asserted-by":"publisher","first-page":"543","DOI":"10.1109\/96.404114","volume":"18","author":"W. Lin","year":"1995","unstructured":"W. Lin, S.K. Patra, Y.C. Lee, Design of solder joints for self-aligned optoelectronic assemblies, IEEE Trans. Comp. Pack. Manuf. B 18(3), 543\u2013551 (1995).","journal-title":"IEEE Trans. Comp. Pack. Manuf. B"},{"key":"16_CR10","doi-asserted-by":"crossref","unstructured":"W. Pittroff, J. Barnikow, A. Klein, P. Kurpas, et al., Flip chip mounting of laser diodes with Au\/Sn solder bumps: bumping, self-alignment and laser behavior, Proceedings IEEE ECTC, pp. 1235\u20131241 (1997).","DOI":"10.1109\/ECTC.1997.606333"},{"issue":"6","key":"16_CR11","doi-asserted-by":"publisher","first-page":"1072","DOI":"10.1109\/33.206933","volume":"15","author":"C.A. Armiento","year":"1992","unstructured":"C.A. Armiento, A.J. Negri, M.J. Tabaski, R.A. Boudreau, et al, Gigabit transmitter array modules on silicon waferboard, IEEE Trans. Comp, Hybr. Manuf. 15(6), 1072\u20131080 (1992).","journal-title":"IEEE Trans. Comp, Hybr. Manuf."},{"key":"16_CR12","doi-asserted-by":"publisher","first-page":"343","DOI":"10.1088\/0960-1317\/8\/4\/014","volume":"8","author":"R.M. Bostock","year":"1998","unstructured":"R.M. Bostock, J.D. Collier, R-J.E. Jansen, R. Jones, et al, Silicon nitride microclips for the kinematic location of optic fibres in silicon V-shaped grooves, J. Micromech. Microeng. 8, 343\u2013360 (1998).","journal-title":"J. Micromech. Microeng."},{"issue":"1","key":"16_CR13","doi-asserted-by":"publisher","first-page":"35","DOI":"10.1109\/84.557528","volume":"6","author":"C. Strandman","year":"1997","unstructured":"C. Strandman, Y. Backlund, Bulk silicon holding structures for mounting of optical fibers in V-grooves, J. Microelectromech. Syst. 6(1), 35\u201340 (1997).","journal-title":"J. Microelectromech. Syst."},{"key":"16_CR14","doi-asserted-by":"publisher","first-page":"39","DOI":"10.1088\/0960-1317\/8\/1\/007","volume":"8","author":"C. Strandman","year":"1998","unstructured":"C. Strandman, Y. Backlund, Passive and fixed alignment of devices using flexible silicon elements formed by selective etching, J. Micromech. Microeng. 8, 39\u201344 (1998).","journal-title":"J. Micromech. Microeng"}],"container-title":["IFIP International Federation for Information Processing","Precision Assembly Technologies for Mini and Micro Products"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/0-387-31277-3_16.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,10]],"date-time":"2025-01-10T13:22:45Z","timestamp":1736515365000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/0-387-31277-3_16"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[null]]},"ISBN":["0387312765"],"references-count":14,"URL":"https:\/\/doi.org\/10.1007\/0-387-31277-3_16","relation":{},"subject":[]}}