{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,5]],"date-time":"2024-09-05T16:49:10Z","timestamp":1725554950605},"publisher-location":"Berlin, Heidelberg","reference-count":5,"publisher":"Springer Berlin Heidelberg","isbn-type":[{"type":"print","value":"9783540344827"},{"type":"electronic","value":"9783540344834"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2006]]},"DOI":"10.1007\/11760191_143","type":"book-chapter","created":{"date-parts":[[2006,5,11]],"date-time":"2006-05-11T14:00:36Z","timestamp":1147356036000},"page":"976-981","source":"Crossref","is-referenced-by-count":1,"title":["Modeling of Micro Spring Tension Force for Vertical Type Probe Card Fabrication"],"prefix":"10.1007","author":[{"given":"Chul Hong","family":"Min","sequence":"first","affiliation":[]},{"given":"Tae Seon","family":"Kim","sequence":"additional","affiliation":[]}],"member":"297","reference":[{"key":"143_CR1","unstructured":"http:\/\/www.jem-net.co.jp\/en\/products\/pro_han_kpc.html"},{"key":"143_CR2","doi-asserted-by":"crossref","unstructured":"Iwai, H., Nakayama, A., Itoga, N., Omata, K.: Cantilever type probe card for at-speed memory test on wafer. In: VLSI Test Symposium IEEE. May 2005, pp. 85\u201389 (2005)","DOI":"10.1109\/VTS.2005.34"},{"key":"143_CR3","doi-asserted-by":"publisher","first-page":"433","DOI":"10.4218\/etrij.05.0104.0080","volume":"8","author":"Y.M. Kim","year":"2005","unstructured":"Kim, Y.M., Yoon, H.C., Lee, J.H.: Silicon Micro-probe Card Using Porous Silicon Micromachining Technology. ETRI Journal\u00a08, 433\u2013438 (2005)","journal-title":"ETRI Journal"},{"key":"143_CR4","doi-asserted-by":"crossref","unstructured":"Itoh, T., Kawamura, S., Kataoka, K., Suga, T.: Contact Properties of Micromachined Ni Probes. In: Proceedings of the Forty-Ninth IEEE Holm Conf., pp. 223\u2013227 (2003)","DOI":"10.1109\/HOLM.2003.1246502"},{"key":"143_CR5","doi-asserted-by":"crossref","unstructured":"Tracy, N.L., Rothenberger, R., Copper, C., Corman, N., Biddle, G., Matthews, A., McCarthy, S.: Array sockets and connectors using MicroSpringTM technology. In: Twenty-Sixth IEEE\/CPMT International Symposium on Electronics Manufacturing Technology, pp. 129\u2013140 (2000)","DOI":"10.1109\/IEMT.2000.910721"}],"container-title":["Lecture Notes in Computer Science","Advances in Neural Networks - ISNN 2006"],"original-title":[],"link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/11760191_143.pdf","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2021,4,27]],"date-time":"2021-04-27T07:09:04Z","timestamp":1619507344000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/11760191_143"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2006]]},"ISBN":["9783540344827","9783540344834"],"references-count":5,"URL":"https:\/\/doi.org\/10.1007\/11760191_143","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"type":"print","value":"0302-9743"},{"type":"electronic","value":"1611-3349"}],"subject":[],"published":{"date-parts":[[2006]]}}}