{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2024,9,4]],"date-time":"2024-09-04T22:19:38Z","timestamp":1725488378103},"publisher-location":"Berlin, Heidelberg","reference-count":14,"publisher":"Springer Berlin Heidelberg","isbn-type":[{"type":"print","value":"9783540441434"},{"type":"electronic","value":"9783540457169"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2002]]},"DOI":"10.1007\/3-540-45716-x_20","type":"book-chapter","created":{"date-parts":[[2007,8,2]],"date-time":"2007-08-02T11:57:08Z","timestamp":1186055828000},"page":"198-208","source":"Crossref","is-referenced-by-count":2,"title":["Clock Distribution Network Optimization under Self-Heating and Timing Constraints"],"prefix":"10.1007","author":[{"given":"M. R.","family":"Casu","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Graziano","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Masera","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G.","family":"Piccinini","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M. M.","family":"Prono","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"M.","family":"Zamboni","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2002,8,27]]},"reference":[{"key":"20_CR1","doi-asserted-by":"crossref","unstructured":"A. H. Ajami, M. Pedram, and K. Banerjee. Effects on non-uniform substrate temperature on the clock signal integrity in high performance designs. IEEE 2001 Custom Integrated Circuits Conference, 2001.","DOI":"10.1109\/CICC.2001.929762"},{"key":"20_CR2","unstructured":"S. I. Assoc. International Technology Roadmap for Semiconductors. Technical report, 2001."},{"key":"20_CR3","doi-asserted-by":"crossref","unstructured":"R. M. Averill et al. Chip integration methodology for the IBM S\/390 G5 and G6 customm icroprocessors. IBM J. Res. Develop., 43(5\/6), 1999.","DOI":"10.1147\/rd.435.0681"},{"key":"20_CR4","unstructured":"M. Casu, M. Graziano, G. Masera, G. Piccinini, and M. Zamboni. Power supply bus sizing considering self-heating in bulk-to-soi migrated designs. PATMOS\u2014 Power And Timing Modeling, Optimization and Simulation, 2001."},{"key":"20_CR5","doi-asserted-by":"crossref","unstructured":"D. Chen, E. Li, E. Rosenbaum, and S.-M. Kang. Interconnect thermal modeling for accurate simulation of circuit timing and reliability. IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems, 19(2), 2000.","DOI":"10.1109\/43.828548"},{"key":"20_CR6","doi-asserted-by":"crossref","unstructured":"J. Cong, A. B. Kahng, D. Noice, N. Shirali, and S. H.-C. Yen. Analysis and justification of a simple, practical 2 1\/2-D capacitance extraction methodology. Design Automation Conference, 1997.","DOI":"10.1145\/266021.266303"},{"key":"20_CR7","doi-asserted-by":"crossref","DOI":"10.1007\/978-1-4615-1685-9","volume-title":"On-chip inductance in high speed integrated circuits","author":"Y. Ismail","year":"2001","unstructured":"Y. Ismail and E. Friedman. On-chip inductance in high speed integrated circuits. Kluwer Academic Publishers, Massachusetts, 2001."},{"key":"20_CR8","doi-asserted-by":"crossref","unstructured":"M. Kamon, M. J. Tsuk, and J. K. White. FastHenry: A multiple accelerated 3-D inductance extraction program. IEEE Transactions on Microwave Theory and Techniques, 42(9), 1994.","DOI":"10.1109\/22.310584"},{"issue":"5","key":"20_CR9","doi-asserted-by":"crossref","first-page":"729","DOI":"10.1109\/5.929651","volume":"89","author":"W. H. Kao","year":"2001","unstructured":"W. H. Kao, C.-Y. Lo, M. Basel, and R. Singh. Parasitic extraction: Current state of the art and future trends. Proceedings of the IEEE, 89(5):729\u2013739, 2001.","journal-title":"Proceedings of the IEEE"},{"issue":"2","key":"20_CR10","first-page":"85","volume":"137","author":"J. L. Maksiejewski","year":"1990","unstructured":"J. L. Maksiejewski. Evaluation of thermal characteristics of conductors under surge currents taking the skin effect into account. IEE Proc., 137(2):85\u201391, 1990.","journal-title":"IEE Proc."},{"key":"20_CR11","doi-asserted-by":"crossref","unstructured":"K. Nabors and J. White. FastCap: A multiple accelerated 3-D capacitance extraction program. IEEE Transactions on Computer-Aided Design, 10(11), 1991.","DOI":"10.1109\/43.97624"},{"key":"20_CR12","unstructured":"M. M. Prono. Techniques for high speed interconnect design. Master thesis, University of Illinois at Chicago, 2001."},{"key":"20_CR13","unstructured":"S. D. Systems. Thunder user\u2019s manual. Technical report, 1993."},{"key":"20_CR14","doi-asserted-by":"crossref","unstructured":"C.-C. Teng, Y.-K. Cheng, E. Rosenbaum, and S.-M. Kang. iTEM: A temperaturedependent electromigration reliability diagnosis tool. IEEE Transactions on Computer Aided Design of Integrated Circuits and Systems, 16(8), 1997.","DOI":"10.1109\/43.644613"}],"container-title":["Lecture Notes in Computer Science","Integrated Circuit Design. Power and Timing Modeling, Optimization and Simulation"],"original-title":[],"link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/3-540-45716-X_20","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,1]],"date-time":"2019-05-01T14:08:31Z","timestamp":1556719711000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/3-540-45716-X_20"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2002]]},"ISBN":["9783540441434","9783540457169"],"references-count":14,"URL":"https:\/\/doi.org\/10.1007\/3-540-45716-x_20","relation":{},"ISSN":["0302-9743"],"issn-type":[{"type":"print","value":"0302-9743"}],"subject":[],"published":{"date-parts":[[2002]]}}}