{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,6]],"date-time":"2026-03-06T07:27:10Z","timestamp":1772782030666,"version":"3.50.1"},"publisher-location":"Cham","reference-count":17,"publisher":"Springer International Publishing","isbn-type":[{"value":"9783030375980","type":"print"},{"value":"9783030375997","type":"electronic"}],"license":[{"start":{"date-parts":[[2019,1,1]],"date-time":"2019-01-01T00:00:00Z","timestamp":1546300800000},"content-version":"tdm","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019]]},"DOI":"10.1007\/978-3-030-37599-7_59","type":"book-chapter","created":{"date-parts":[[2020,1,3]],"date-time":"2020-01-03T09:02:43Z","timestamp":1578042163000},"page":"711-724","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":7,"title":["Conditional Anomaly Detection for Quality and Productivity Improvement of Electronics Manufacturing Systems"],"prefix":"10.1007","author":[{"given":"Eva","family":"Jabbar","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Philippe","family":"Besse","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jean-Michel","family":"Loubes","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Christophe","family":"Merle","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2020,1,3]]},"reference":[{"key":"59_CR1","first-page":"06","volume":"29","author":"W Hao","year":"2017","unstructured":"Hao, W.: Solder joint defect classification based on ensemble learning. Solder. Surf. Mt. Technol. 29, 06 (2017)","journal-title":"Solder. Surf. Mt. Technol."},{"key":"59_CR2","doi-asserted-by":"publisher","first-page":"337","DOI":"10.5019\/j.ijcir.2006.71","volume":"2","author":"G Acciani","year":"2006","unstructured":"Acciani, G., Brunetti, G., Fornarelli, G.: A multiple neural network system to classify solder joints on integrated circuits. Int. J. Comput. Intell. Res. 2, 337\u2013348 (2006)","journal-title":"Int. J. Comput. Intell. Res."},{"issue":"20","key":"59_CR3","doi-asserted-by":"publisher","first-page":"4110","DOI":"10.1016\/j.ijleo.2012.12.030","volume":"124","author":"W Hao","year":"2013","unstructured":"Hao, W., Xianmin, Z., Yongcong, K., Gaofei, O., Hongwei, X.: Solder joint inspection based on neural network combined with genetic algorithm. Optik 124(20), 4110\u20134116 (2013)","journal-title":"Optik"},{"key":"59_CR4","doi-asserted-by":"publisher","first-page":"1303","DOI":"10.1007\/s00170-018-3022-6","volume":"101","author":"J-D Song","year":"2018","unstructured":"Song, J.-D., Kim, Y.-G., Park, T.-H.: SMT defect classification by feature extraction region optimization and machine learning. Int. J. Adv. Manuf. Technol. 101, 1303\u20131313 (2018)","journal-title":"Int. J. Adv. Manuf. Technol."},{"issue":"9","key":"59_CR5","doi-asserted-by":"publisher","first-page":"1536","DOI":"10.1109\/TCPMT.2012.2205149","volume":"2","author":"J Jiang","year":"2012","unstructured":"Jiang, J., Cheng, J., Tao, D.: Color biological features-based solder paste defects detection and classification on printed circuit boards. IEEE Trans. Componen. Packag. Manuf. Technol. 2(9), 1536\u20131544 (2012)","journal-title":"IEEE Trans. Componen. Packag. Manuf. Technol."},{"issue":"1","key":"59_CR6","doi-asserted-by":"publisher","first-page":"163","DOI":"10.1109\/TCPMT.2018.2873744","volume":"9","author":"D Tsai","year":"2019","unstructured":"Tsai, D., Huang, C.: Defect detection in electronic surfaces using template-based Fourier image reconstruction. IEEE Trans. Componen. Packag. Manuf. Technol. 9(1), 163\u2013172 (2019)","journal-title":"IEEE Trans. Componen. Packag. Manuf. Technol."},{"key":"59_CR7","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"254","DOI":"10.1007\/978-3-030-13709-0_21","volume-title":"Machine Learning, Optimization, and Data Science","author":"E Jabbar","year":"2019","unstructured":"Jabbar, E., Besse, P., Loubes, J.M., Roa, N.B., Merle, C., Dettai, R.: Supervised learning approach for surface-mount device production. In: Nicosia, G., Pardalos, P., Giuffrida, G., Umeton, R., Sciacca, V. (eds.) LOD 2018. LNCS, vol. 11331, pp. 254\u2013263. Springer, Cham (2019). \nhttps:\/\/doi.org\/10.1007\/978-3-030-13709-0_21"},{"issue":"2","key":"59_CR8","doi-asserted-by":"publisher","first-page":"155014771983280","DOI":"10.1177\/1550147719832802","volume":"15","author":"D Kim","year":"2019","unstructured":"Kim, D., Koo, J., Kim, H., Kang, S., Lee, S.H., Kang, J.T.: Rapid fault cause identification in surface mount technology processes based on factory-wide data analysis. Int. J. Distrib. Sens. Netw. 15(2), 1550147719832802 (2019)","journal-title":"Int. J. Distrib. Sens. Netw."},{"key":"59_CR9","unstructured":"Riddle, M.E.: Solder paste measurement: a yield improvement strategy that helps improve profits. SMT Express (2004)"},{"key":"59_CR10","unstructured":"Kingma, D.P., Welling, M.: Auto-encoding variational bayes. arXiv preprint \narXiv:1312.6114\n\n (2013)"},{"key":"59_CR11","doi-asserted-by":"crossref","unstructured":"Xu, H., et al.: Unsupervised anomaly detection via variational auto-encoder for seasonal KPIs in web applications. In: Champin, P.-A., Gandon, F.L., Lalmas, M., Ipeirotis, P.G., (eds.) WWW, pp. 187\u2013196. ACM (2018)","DOI":"10.1145\/3178876.3185996"},{"key":"59_CR12","unstructured":"Chollet, F., et al.: Keras (2015). \nhttps:\/\/keras.io"},{"key":"59_CR13","unstructured":"Abadi, M., et al.: TensorFlow: Large-scale machine learning on heterogeneous systems. Software available from \ntensorflow.org\n\n (2015)"},{"key":"59_CR14","unstructured":"Krizhevsky, A., Sutskever, I., Hinton, G.E.: ImageNet classification with deep convolutional neural networks. In: Advances in Neural Information Processing Systems, pp. 1097\u20131105 (2012)"},{"key":"59_CR15","unstructured":"Kingma, D.P., Ba, J.: Adam: a method for stochastic optimization. arXiv preprint \narXiv:1412.6980\n\n (2014)"},{"key":"59_CR16","unstructured":"Masters, D., Luschi, C.: Revisiting small batch training for deep neural networks. CoRR, abs\/1804.07612 (2018)"},{"key":"59_CR17","unstructured":"Avati, A.: Evaluation metrics, April 2019. \nhttp:\/\/cs229.stanford.edu\/section\/evaluation_metrics.pdf"}],"container-title":["Lecture Notes in Computer Science","Machine Learning, Optimization, and Data Science"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-030-37599-7_59","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,1,3]],"date-time":"2020-01-03T10:04:08Z","timestamp":1578045848000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-030-37599-7_59"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2019]]},"ISBN":["9783030375980","9783030375997"],"references-count":17,"URL":"https:\/\/doi.org\/10.1007\/978-3-030-37599-7_59","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"value":"0302-9743","type":"print"},{"value":"1611-3349","type":"electronic"}],"subject":[],"published":{"date-parts":[[2019]]},"assertion":[{"value":"3 January 2020","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"LOD","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Conference on Machine Learning, Optimization, and Data Science","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Siena","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Italy","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2019","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"10 September 2019","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"13 September 2019","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"5","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"mod2019","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/lod2019.icas.xyz\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Double-blind","order":1,"name":"type","label":"Type","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"Easychair","order":2,"name":"conference_management_system","label":"Conference Management System","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"158","order":3,"name":"number_of_submissions_sent_for_review","label":"Number of Submissions Sent for Review","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"64","order":4,"name":"number_of_full_papers_accepted","label":"Number of Full Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"0","order":5,"name":"number_of_short_papers_accepted","label":"Number of Short Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"41% - The value is computed by the equation \"Number of Full Papers Accepted \/ Number of Submissions Sent for Review * 100\" and then rounded to a whole number.","order":6,"name":"acceptance_rate_of_full_papers","label":"Acceptance Rate of Full Papers","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"5","order":7,"name":"average_number_of_reviews_per_paper","label":"Average Number of Reviews per Paper","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"3","order":8,"name":"average_number_of_papers_per_reviewer","label":"Average Number of Papers per Reviewer","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"No","order":9,"name":"external_reviewers_involved","label":"External Reviewers Involved","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}}]}}