{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,3,21]],"date-time":"2026-03-21T04:04:47Z","timestamp":1774065887204,"version":"3.50.1"},"publisher-location":"Cham","reference-count":38,"publisher":"Springer Nature Switzerland","isbn-type":[{"value":"9783031251818","type":"print"},{"value":"9783031251825","type":"electronic"}],"license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023]]},"DOI":"10.1007\/978-3-031-25182-5_61","type":"book-chapter","created":{"date-parts":[[2023,1,31]],"date-time":"2023-01-31T12:13:51Z","timestamp":1675167231000},"page":"630-640","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":6,"title":["Improving the Sustainability of Manufactured Products: Literature Review and Challenges for Digitalization of Disassembly and Dismantling Processes"],"prefix":"10.1007","author":[{"given":"Chorouk","family":"Mouflih","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Raoudha","family":"Gaha","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Magali","family":"Bosch","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Alexandre","family":"Durupt","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2023,2,1]]},"reference":[{"key":"61_CR1","doi-asserted-by":"publisher","first-page":"651","DOI":"10.1016\/S0007-8506(07)62530-X","volume":"42","author":"F Jovane","year":"1993","unstructured":"Jovane, F., et al.: A key issue in product life cycle: disassembly. CIRP Ann. Manuf. Technol. 42, 651\u2013658 (1993). https:\/\/doi.org\/10.1016\/S0007-8506(07)62530-X","journal-title":"CIRP Ann. Manuf. Technol."},{"key":"61_CR2","doi-asserted-by":"publisher","first-page":"31","DOI":"10.1016\/j.cirp.2013.03.037","volume":"62","author":"S Vongbunyong","year":"2013","unstructured":"Vongbunyong, S., Kara, S., Pagnucco, M.: Application of cognitive robotics in disassembly of products. CIRP Ann. Manuf. Technol. 62, 31\u201334 (2013). https:\/\/doi.org\/10.1016\/j.cirp.2013.03.037","journal-title":"CIRP Ann. Manuf. Technol."},{"key":"61_CR3","doi-asserted-by":"publisher","first-page":"583","DOI":"10.1016\/j.cirp.2008.09.009","volume":"57","author":"JR Duflou","year":"2008","unstructured":"Duflou, J.R., Seliger, G., Kara, S., Umeda, Y., Ometto, A., Willems, B.: Efficiency and feasibility of product disassembly: a case-based study. CIRP Ann. Manuf. Technol. 57, 583\u2013600 (2008). https:\/\/doi.org\/10.1016\/j.cirp.2008.09.009","journal-title":"CIRP Ann. Manuf. Technol."},{"key":"61_CR4","doi-asserted-by":"publisher","first-page":"4027","DOI":"10.1080\/00207543.2019.1578906","volume":"57","author":"Q Liu","year":"2019","unstructured":"Liu, Q., Liu, Z., Xu, W., Tang, Q., Zhou, Z., Pham, D.T.: Human-robot collaboration in disassembly for sustainable manufacturing. Int. J. Prod. Res. 57, 4027\u20134044 (2019). https:\/\/doi.org\/10.1080\/00207543.2019.1578906","journal-title":"Int. J. Prod. Res."},{"key":"61_CR5","doi-asserted-by":"publisher","first-page":"7220","DOI":"10.1080\/00207543.2017.1418987","volume":"56","author":"ML Bentaha","year":"2018","unstructured":"Bentaha, M.L., Dolgui, A., Batta\u00efa, O., Riggs, R.J., Hu, J.: Profit-oriented partial disassembly line design: dealing with hazardous parts and task processing times uncertainty. Int. J. Prod. Res. 56, 7220\u20137242 (2018). https:\/\/doi.org\/10.1080\/00207543.2017.1418987","journal-title":"Int. J. Prod. Res."},{"key":"61_CR6","doi-asserted-by":"publisher","first-page":"932","DOI":"10.1016\/j.procir.2017.12.007","volume":"69","author":"B Li","year":"2018","unstructured":"Li, B., Ding, L., Hu, D., Zheng, S.: Backtracking algorithm-based disassembly sequence planning. Procedia CIRP 69, 932\u2013937 (2018). https:\/\/doi.org\/10.1016\/j.procir.2017.12.007","journal-title":"Procedia CIRP"},{"key":"61_CR7","doi-asserted-by":"publisher","first-page":"112","DOI":"10.1016\/j.rcim.2012.05.001","volume":"29","author":"HD Wan","year":"2013","unstructured":"Wan, H.D., Gonnuru, V.K.: Disassembly planning and sequencing for end-of-life products with RFID enriched information. Robot. Comput.-Integr. Manuf. 29, 112\u2013118 (2013). https:\/\/doi.org\/10.1016\/j.rcim.2012.05.001","journal-title":"Robot. Comput.-Integr. Manuf."},{"key":"61_CR8","doi-asserted-by":"publisher","first-page":"2416","DOI":"10.1177\/0954405416629104","volume":"231","author":"H Andriankaja","year":"2017","unstructured":"Andriankaja, H., Le Duigou, J., Danjou, C., Eynard, B.: Sustainable machining approach for CAD\/CAM\/CNC systems based on a dynamic environmental assessment. Proc. Inst. Mech. Eng. Part B: J. Eng. Manuf. 231, 2416\u20132429 (2017). https:\/\/doi.org\/10.1177\/0954405416629104","journal-title":"Proc. Inst. Mech. Eng. Part B: J. Eng. Manuf."},{"key":"61_CR9","doi-asserted-by":"publisher","first-page":"2391","DOI":"10.1080\/002075431000087265","volume":"41","author":"TA Abdullah","year":"2003","unstructured":"Abdullah, T.A., Popplewell, K., Page, C.J.: A review of the support tools for the process of assembly method selection and assembly planning. Int. J. Prod. Res. 41, 2391\u20132410 (2003). https:\/\/doi.org\/10.1080\/002075431000087265","journal-title":"Int. J. Prod. Res."},{"key":"61_CR10","doi-asserted-by":"publisher","first-page":"161","DOI":"10.1016\/j.rcim.2012.05.001","volume":"35","author":"A Gungor","year":"1998","unstructured":"Gungor, A., Gupta, S.M.: Disassembly sequence planning for products with defective parts in product recovery. Comput. Ind. Eng. 35, 161\u2013164 (1998). https:\/\/doi.org\/10.1016\/j.rcim.2012.05.001","journal-title":"Comput. Ind. Eng."},{"key":"61_CR11","doi-asserted-by":"publisher","unstructured":"Mok, S.M., Wu, C.H., Lee, D.T.: A hierarchical workcell model for intelligent assembly and disassembly. In: Proceedings - 1999 IEEE International Symposium on Computational Intelligence in Robotics and Automation, CIRA 1999, pp. 125\u2013130. Institute of Electrical and Electronics Engineers Inc. (1999). https:\/\/doi.org\/10.1109\/3468.925662","DOI":"10.1109\/3468.925662"},{"key":"61_CR12","doi-asserted-by":"publisher","first-page":"59","DOI":"10.1007\/978-3-319-32156-1_5","volume-title":"Mechatronic Futures","author":"S Boschert","year":"2016","unstructured":"Boschert, S., Rosen, R.: Digital twin\u2014the simulation aspect. In: Hehenberger, P., Bradley, D. (eds.) Mechatronic Futures, pp. 59\u201374. Springer, Cham (2016). https:\/\/doi.org\/10.1007\/978-3-319-32156-1_5"},{"key":"61_CR13","doi-asserted-by":"publisher","first-page":"85","DOI":"10.1007\/978-3-319-38756-7_4","volume-title":"Transdisciplinary Perspectives on Complex Systems","author":"M Grieves","year":"2017","unstructured":"Grieves, M., Vickers, J.: Digital twin: mitigating unpredictable, undesirable emergent behavior in complex systems. In: Kahlen, F.-J., Flumerfelt, S., Alves, A. (eds.) Transdisciplinary Perspectives on Complex Systems, pp. 85\u2013113. Springer, Cham (2017). https:\/\/doi.org\/10.1007\/978-3-319-38756-7_4"},{"key":"61_CR14","doi-asserted-by":"publisher","first-page":"1082","DOI":"10.1016\/J.PROCIR.2019.04.305","volume":"84","author":"S Haag","year":"2019","unstructured":"Haag, S., Anderl, R.: Automated Generation of as-manufactured geometric representations for digital twins using STEP. Procedia CIRP 84, 1082\u20131087 (2019). https:\/\/doi.org\/10.1016\/J.PROCIR.2019.04.305","journal-title":"Procedia CIRP"},{"key":"61_CR15","doi-asserted-by":"publisher","first-page":"216","DOI":"10.1016\/j.promfg.2021.07.033","volume":"54","author":"R Gaha","year":"2020","unstructured":"Gaha, R., Durupt, A., Eynard, B.: Towards the implementation of the digital twin in CMM inspection process: opportunities, challenges and proposals. Procedia Manuf. 54, 216\u2013221 (2020). https:\/\/doi.org\/10.1016\/j.promfg.2021.07.033","journal-title":"Procedia Manuf."},{"key":"61_CR16","doi-asserted-by":"publisher","unstructured":"Dantas, T.E.T., de Souza, E.D., Destro, I.R., Hammes, G., Rodriguez, C.M.T., Soares, S.R.: How the combination of circular economy and industry 4.0 can contribute towards achieving the sustainable development goals. Sustain. Prod. Consum. 26, 213\u2013227 (2021). https:\/\/doi.org\/10.1016\/j.spc.2020.10.005","DOI":"10.1016\/j.spc.2020.10.005"},{"key":"61_CR17","doi-asserted-by":"publisher","unstructured":"Bamodu, O., Ye, X.: Virtual reality and virtual reality system components. Presented at the (2013). https:\/\/doi.org\/10.2991\/icsem.2013.192","DOI":"10.2991\/icsem.2013.192"},{"key":"61_CR18","doi-asserted-by":"publisher","first-page":"536","DOI":"10.1016\/j.procir.2016.01.129","volume":"40","author":"T Stock","year":"2016","unstructured":"Stock, T., Seliger, G.: Opportunities of sustainable manufacturing in industry 4.0. Procedia CIRP 40, 536\u2013541 (2016). https:\/\/doi.org\/10.1016\/j.procir.2016.01.129","journal-title":"Procedia CIRP"},{"key":"61_CR19","doi-asserted-by":"publisher","first-page":"107189","DOI":"10.1016\/j.cie.2021.107189","volume":"155","author":"J Huang","year":"2021","unstructured":"Huang, J., et al.: An experimental human-robot collaborative disassembly cell. Comput. Ind. Eng. 155, 107189 (2021). https:\/\/doi.org\/10.1016\/j.cie.2021.107189","journal-title":"Comput. Ind. Eng."},{"key":"61_CR20","doi-asserted-by":"publisher","first-page":"47","DOI":"10.46763\/joe205.20047t","volume":"5","author":"R Temjanovski","year":"2020","unstructured":"Temjanovski, R.: How IT can add Value to logistic sector: Bar code systems and RFID (radio frequency identification) in logistics services. J. Econ. 5, 47\u201356 (2020). https:\/\/doi.org\/10.46763\/joe205.20047t","journal-title":"J. Econ."},{"key":"61_CR21","doi-asserted-by":"publisher","first-page":"223","DOI":"10.1109\/3468.925662","volume":"31","author":"SM Mok","year":"2001","unstructured":"Mok, S.M., Wu, C.H., Lee, D.T.: Modeling automatic assembly and disassembly operations for virtual manufacturing. IEEE Trans. Syst. Man Cybern. Part A Syst. Hum. 31, 223\u2013232 (2001). https:\/\/doi.org\/10.1109\/3468.925662","journal-title":"IEEE Trans. Syst. Man Cybern. Part A Syst. Hum."},{"issue":"9-12","key":"61_CR22","doi-asserted-by":"publisher","first-page":"2355","DOI":"10.1007\/s00170-013-5207-3","volume":"69","author":"S Qiu","year":"2013","unstructured":"Qiu, S., Fan, X., Wu, D., He, Q., Zhou, D.: Virtual human modeling for interactive assembly and disassembly operation in virtual reality environment. Int. J. Adv. Manuf. Technol. 69(9\u201312), 2355\u20132372 (2013). https:\/\/doi.org\/10.1007\/s00170-013-5207-3","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"61_CR23","doi-asserted-by":"publisher","first-page":"299","DOI":"10.1016\/j.procir.2016.11.194","volume":"61","author":"MML Chang","year":"2017","unstructured":"Chang, M.M.L., Ong, S.K., Nee, A.Y.C.: AR-guided product disassembly for maintenance and remanufacturing. Procedia CIRP 61, 299\u2013304 (2017). https:\/\/doi.org\/10.1016\/j.procir.2016.11.194","journal-title":"Procedia CIRP"},{"key":"61_CR24","doi-asserted-by":"publisher","first-page":"3673","DOI":"10.1016\/j.procir.2016.11.194","volume":"176","author":"L Yuan","year":"2020","unstructured":"Yuan, L., Cui, J., Zhang, X., Liu, J.: Framework and enabling technologies of cloud robotic disassembly. Procedia Comput. Sci. 176, 3673\u20133681 (2020). https:\/\/doi.org\/10.1016\/j.procir.2016.11.194","journal-title":"Procedia Comput. Sci."},{"key":"61_CR25","doi-asserted-by":"publisher","first-page":"62","DOI":"10.1108\/01445151111104182","volume":"31","author":"D Vukelic","year":"2011","unstructured":"Vukelic, D., et al.: Machining fixture assembly\/disassembly in RFID environment. Assem. Autom. 31, 62\u201368 (2011). https:\/\/doi.org\/10.1108\/01445151111104182","journal-title":"Assem. Autom."},{"key":"61_CR26","doi-asserted-by":"publisher","first-page":"719","DOI":"10.1109\/TII.2011.2166767","volume":"8","author":"O Ondemir","year":"2012","unstructured":"Ondemir, O., Ilgin, M.A., Gupta, S.M.: Optimal end-of-life management in closed-loop supply chains using RFID and sensors. IEEE Trans. Industr. Inf. 8, 719\u2013728 (2012). https:\/\/doi.org\/10.1109\/TII.2011.2166767","journal-title":"IEEE Trans. Industr. Inf."},{"key":"61_CR27","doi-asserted-by":"publisher","first-page":"2695","DOI":"10.1016\/j.jclepro.2017.11.142","volume":"172","author":"P Nowakowski","year":"2018","unstructured":"Nowakowski, P.: A novel, cost efficient identification method for disassembly planning of waste electrical and electronic equipment. J. Clean. Prod. 172, 2695\u20132707 (2018). https:\/\/doi.org\/10.1016\/j.jclepro.2017.11.142","journal-title":"J. Clean. Prod."},{"key":"61_CR28","doi-asserted-by":"publisher","first-page":"4246","DOI":"10.1080\/00207543.2019.1651456","volume":"58","author":"Y Kazancoglu","year":"2020","unstructured":"Kazancoglu, Y., Ozkan-Ozen, Y.D.: Sustainable disassembly line balancing model based on triple bottom line. Int. J. Prod. Res. 58, 4246\u20134266 (2020). https:\/\/doi.org\/10.1080\/00207543.2019.1651456","journal-title":"Int. J. Prod. Res."},{"key":"61_CR29","doi-asserted-by":"publisher","unstructured":"Shan, H., Li, S., Huang, J., Gao, Z., Li, W.: Ant colony optimization algorithm-based disassembly sequence planning. In: Proceedings of the 2007 IEEE International Conference on Mechatronics and Automation, ICMA 2007, pp. 867\u2013872 (2007). https:\/\/doi.org\/10.1109\/ICMA.2007.4303659","DOI":"10.1109\/ICMA.2007.4303659"},{"issue":"5-8","key":"61_CR30","doi-asserted-by":"publisher","first-page":"1523","DOI":"10.1007\/s00170-016-8827-6","volume":"88","author":"J Chen","year":"2016","unstructured":"Chen, J., Mitrouchev, P., Coquillart, S., Quaine, F.: Disassembly task evaluation by muscle fatigue estimation in a virtual reality environment. Int. J. Adv. Manuf. Technol. 88(5\u20138), 1523\u20131533 (2016). https:\/\/doi.org\/10.1007\/s00170-016-8827-6","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"61_CR31","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"332","DOI":"10.1007\/978-3-319-22888-4_24","volume-title":"Augmented and Virtual Reality","author":"D Sportillo","year":"2015","unstructured":"Sportillo, D., Avveduto, G., Tecchia, F., Carrozzino, M.: Training in VR: a preliminary study on learning assembly\/disassembly sequences. In: De Paolis, L.T., Mongelli, A. (eds.) AVR 2015. LNCS, vol. 9254, pp. 332\u2013343. Springer, Cham (2015). https:\/\/doi.org\/10.1007\/978-3-319-22888-4_24"},{"key":"61_CR32","doi-asserted-by":"publisher","first-page":"1","DOI":"10.3390\/act9040102","volume":"9","author":"M Freddi","year":"2020","unstructured":"Freddi, M., Frizziero, L.: Design for disassembly and augmented reality applied to a tailstock. Actuators 9, 1\u201314 (2020). https:\/\/doi.org\/10.3390\/act9040102","journal-title":"Actuators"},{"key":"61_CR33","doi-asserted-by":"publisher","unstructured":"Chen, W.H., Wegener, K., Dietrich, F.: A robot assistant for unscrewing in hybrid human-robot disassembly. In: 2014 IEEE International Conference on Robotics and Biomimetics, IEEE ROBIO 2014, pp. 536\u2013541. Institute of Electrical and Electronics Engineers Inc. (2014). https:\/\/doi.org\/10.1109\/ROBIO.2014.7090386","DOI":"10.1109\/ROBIO.2014.7090386"},{"key":"61_CR34","doi-asserted-by":"publisher","first-page":"348","DOI":"10.1016\/j.procs.2015.12.257","volume":"75","author":"D Grajewski","year":"2015","unstructured":"Grajewski, D., et al.: Improving the skills and knowledge of future designers in the field of ecodesign using virtual reality technologies. Procedia Comput. Sci. 75, 348\u2013358 (2015). https:\/\/doi.org\/10.1016\/j.procs.2015.12.257","journal-title":"Procedia Comput. Sci."},{"key":"61_CR35","series-title":"Communications in Computer and Information Science","doi-asserted-by":"publisher","first-page":"582","DOI":"10.1007\/978-3-642-32692-9_73","volume-title":"Convergence and Hybrid Information Technology","author":"H-J Jung","year":"2012","unstructured":"Jung, H.-J., Park, D.-W.: A study of user-controlled robot simulation on augmented reality. In: Lee, G., Howard, D., \u015al\u0119zak, D., Hong, Y.S. (eds.) ICHIT 2012. CCIS, vol. 310, pp. 582\u2013587. Springer, Heidelberg (2012). https:\/\/doi.org\/10.1007\/978-3-642-32692-9_73"},{"key":"61_CR36","doi-asserted-by":"publisher","first-page":"731","DOI":"10.5937\/fmet1904731H","volume":"47","author":"J Huang","year":"2019","unstructured":"Huang, J., et al.: A strategy for human-robot collaboration in taking products apart for remanufacture. FME Trans. 47, 731\u2013738 (2019). https:\/\/doi.org\/10.5937\/fmet1904731H","journal-title":"FME Trans."},{"key":"61_CR37","doi-asserted-by":"publisher","first-page":"429","DOI":"10.1016\/j.jmsy.2021.07.009","volume":"60","author":"C Sassanelli","year":"2021","unstructured":"Sassanelli, C., Rosa, P., Terzi, S.: Supporting disassembly processes through simulation tools: a systematic literature review with a focus on printed circuit boards. J. Manuf. Syst. 60, 429\u2013448 (2021). https:\/\/doi.org\/10.1016\/j.jmsy.2021.07.009","journal-title":"J. Manuf. Syst."},{"key":"61_CR38","doi-asserted-by":"publisher","first-page":"1450","DOI":"10.1016\/j.rcim.2019.101860","volume":"233","author":"Z Zhou","year":"2019","unstructured":"Zhou, Z., et al.: Disassembly sequence planning: Recent developments and future trends. Proc. Inst. Mech. Eng. Part B: J. Eng. Manuf. 233, 1450\u20131471 (2019). https:\/\/doi.org\/10.1016\/j.rcim.2019.101860","journal-title":"Proc. Inst. Mech. Eng. Part B: J. Eng. Manuf."}],"container-title":["IFIP Advances in Information and Communication Technology","Product Lifecycle Management. PLM in Transition Times: The Place of Humans and Transformative Technologies"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-25182-5_61","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,3,20]],"date-time":"2023-03-20T10:10:54Z","timestamp":1679307054000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-25182-5_61"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023]]},"ISBN":["9783031251818","9783031251825"],"references-count":38,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-25182-5_61","relation":{},"ISSN":["1868-4238","1868-422X"],"issn-type":[{"value":"1868-4238","type":"print"},{"value":"1868-422X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023]]},"assertion":[{"value":"1 February 2023","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"PLM","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"IFIP International Conference on Product Lifecycle Management","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Grenoble","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"France","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2022","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"10 July 2022","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"13 July 2022","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"19","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"plm2022","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/www.plm-conference.org\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Single-blind","order":1,"name":"type","label":"Type","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"confy+","order":2,"name":"conference_management_system","label":"Conference Management System","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"94","order":3,"name":"number_of_submissions_sent_for_review","label":"Number of Submissions Sent for Review","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"67","order":4,"name":"number_of_full_papers_accepted","label":"Number of Full Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"0","order":5,"name":"number_of_short_papers_accepted","label":"Number of Short Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"71% - The value is computed by the equation \"Number of Full Papers Accepted \/ Number of Submissions Sent for Review * 100\" and then rounded to a whole number.","order":6,"name":"acceptance_rate_of_full_papers","label":"Acceptance Rate of Full Papers","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"2","order":7,"name":"average_number_of_reviews_per_paper","label":"Average Number of Reviews per Paper","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"1.96","order":8,"name":"average_number_of_papers_per_reviewer","label":"Average Number of Papers per Reviewer","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"Yes","order":9,"name":"external_reviewers_involved","label":"External Reviewers Involved","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}}]}}