{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,28]],"date-time":"2025-03-28T04:07:33Z","timestamp":1743134853210,"version":"3.40.3"},"publisher-location":"Cham","reference-count":27,"publisher":"Springer Nature Switzerland","isbn-type":[{"type":"print","value":"9783031314445"},{"type":"electronic","value":"9783031314452"}],"license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023]]},"DOI":"10.1007\/978-3-031-31445-2_11","type":"book-chapter","created":{"date-parts":[[2023,5,10]],"date-time":"2023-05-10T23:30:02Z","timestamp":1683761402000},"page":"157-167","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["How Can Compilers Help the\u00a0Additive Manufacturing of\u00a0Electronics?"],"prefix":"10.1007","author":[{"given":"Xiaoming","family":"Li","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2023,5,10]]},"reference":[{"key":"11_CR1","unstructured":"Hyrel 3d system 30m. https:\/\/www.hyrel3d.com\/portfolio\/system-30m\/"},{"key":"11_CR2","unstructured":"nscrypt superscrypt. https:\/\/www.nscrypt.com\/"},{"key":"11_CR3","doi-asserted-by":"publisher","unstructured":"Behrmann, G., Hidler, J., Mirotznik, M.: Fiber optic micro sensor for the measurement of tendon forces. Biomed. Eng. Online 11(77) (2012). https:\/\/doi.org\/10.1186\/1475-925X-11-77","DOI":"10.1186\/1475-925X-11-77"},{"key":"11_CR4","doi-asserted-by":"publisher","unstructured":"Biswas, S., et al.: Realization of modified luneburg lens antenna using quasi-conformal transformation optics and additive manufacturing. Microwave Opt. Technol. Lett. 61(4), 1022\u20131029 (2019) https:\/\/doi.org\/10.1002\/mop.31696, https:\/\/onlinelibrary.wiley.com\/doi\/abs\/10.1002\/mop.31696","DOI":"10.1002\/mop.31696"},{"key":"11_CR5","doi-asserted-by":"publisher","unstructured":"Biswas, S., Mirotznik, M.: Additively manufactured conformal load-bearing antenna structure (clas). IEEE Trans. Components Packaging Manufacturing Technol., 1 (2020). https:\/\/doi.org\/10.1109\/TCPMT.2020.3019220","DOI":"10.1109\/TCPMT.2020.3019220"},{"key":"11_CR6","doi-asserted-by":"publisher","unstructured":"Biswas, S., Mirotznik, M.: High gain, wide-angle qcto-enabled modified luneburg lens antenna with broadband anti-reflective layer. Nature Sci. Rep., 10 (07 2020). https:\/\/doi.org\/10.1038\/s41598-020-69631-6","DOI":"10.1038\/s41598-020-69631-6"},{"key":"11_CR7","doi-asserted-by":"crossref","unstructured":"Cav\u00e9, V., Zhao, J., Shirako, J., Sarkar, V.: Habanero-java: the new adventures of old x10. In: Proceedings of the 9th International Conference on Principles and Practice of Programming in Java, pp. 51\u201361 (2011)","DOI":"10.1145\/2093157.2093165"},{"key":"11_CR8","unstructured":"Chapman, B., Jost, G., Van Der Pas, R.: Using openmp (2007)"},{"key":"11_CR9","doi-asserted-by":"publisher","unstructured":"Culmone, C., Smit, G., Breedveld, P.: Additive manufacturing of medical instruments: A state-of-the-art review. Additive Manufacturing 27, 461\u2013473 (2019) https:\/\/doi.org\/10.1016\/j.addma.2019.03.015. https:\/\/www.sciencedirect.com\/science\/article\/pii\/S2214860418308911","DOI":"10.1016\/j.addma.2019.03.015"},{"issue":"11","key":"11_CR10","doi-asserted-by":"publisher","first-page":"20","DOI":"10.1109\/MAES.2019.2944050","volume":"34","author":"JC Deroba","year":"2019","unstructured":"Deroba, J.C., Sobczak, K.D., Good, A., Larimore, Z., Mirotznik, M.: Additively manufactured luneburg retroreflector. IEEE Aerosp. Electron. Syst. Mag. 34(11), 20\u201324 (2019). https:\/\/doi.org\/10.1109\/MAES.2019.2944050","journal-title":"IEEE Aerosp. Electron. Syst. Mag."},{"key":"11_CR11","doi-asserted-by":"publisher","first-page":"237","DOI":"10.1016\/j.protcy.2015.07.038","volume":"20","author":"I Gibson","year":"2015","unstructured":"Gibson, I., Srinath, A.: Simplifying medical additive manufacturing: Making the surgeon the designer. Procedia Technol. 20, 237\u2013242 (2015)","journal-title":"Procedia Technol."},{"key":"11_CR12","doi-asserted-by":"crossref","unstructured":"Gokhale, M.B., Stone, J.M.: Napa c: Compiling for a hybrid risc\/fpga architecture. In: Proceedings of the IEEE Symposium on FPGAs for Custom Computing Machines (Cat. No. 98TB100251), pp. 126\u2013135. IEEE (1998)","DOI":"10.1109\/FPGA.1998.707890"},{"key":"11_CR13","doi-asserted-by":"publisher","unstructured":"Greenwood, T.E., Hatch, S.E., Colton, M.B., Thomson, S.L.: 3d printing low-stiffness silicone within a curable support matrix. Additive Manufacturing 37, 101681 (2021). https:\/\/doi.org\/10.1016\/j.addma.2020.101681, https:\/\/www.sciencedirect.com\/science\/article\/pii\/S2214860420310538","DOI":"10.1016\/j.addma.2020.101681"},{"key":"11_CR14","doi-asserted-by":"publisher","unstructured":"Gulati, G., Liang, M., Xin, H.: A conformal dual-polarized all-metal vivaldi array for feeding broadband luneburg lens. In: 2017 IEEE International Symposium on Antennas and Propagation USNC\/URSI National Radio Science Meeting, pp. 2243\u20132244 (2017). https:\/\/doi.org\/10.1109\/APUSNCURSINRSM.2017.8073164","DOI":"10.1109\/APUSNCURSINRSM.2017.8073164"},{"key":"11_CR15","doi-asserted-by":"crossref","unstructured":"Harris, J.M., Hirst, J.L., Mossinghoff, M.J.: Combinatorics and graph theory, vol. 2. Springer (2008)","DOI":"10.1007\/978-0-387-79711-3"},{"key":"11_CR16","doi-asserted-by":"crossref","unstructured":"Hierholzer, C., Wiener, C.: Ueber die M\u00f6glichkeit, einen Linienzug ohne Wiederholung und ohne Unterbrechung zu umfahren (March 1873)","DOI":"10.1007\/BF01442866"},{"key":"11_CR17","doi-asserted-by":"crossref","unstructured":"H\u00f6rber, J., Goth, C., Franke, J.: Aerosol-jet printing for functionalization of prototyping materials for electronic applications. In: International Symposium on Microelectronics, vol. 2012, pp. 000741\u2013000748. International Microelectronics Assembly and Packaging Society (2012)","DOI":"10.4071\/isom-2012-WA65"},{"issue":"4","key":"11_CR18","doi-asserted-by":"publisher","first-page":"411","DOI":"10.1016\/j.ajme.2017.09.003","volume":"54","author":"M Javaid","year":"2018","unstructured":"Javaid, M., Haleem, A.: Additive manufacturing applications in medical cases: a literature based review. Alexandria J. Med. 54(4), 411\u2013422 (2018)","journal-title":"Alexandria J. Med."},{"key":"11_CR19","unstructured":"Jungnickel, D., Jungnickel, D.: Graphs, networks and algorithms. Springer (2005)"},{"key":"11_CR20","unstructured":"Kennedy, K., Allen, J.R.: Optimizing compilers for modern architectures: a dependence-based approach. Morgan Kaufmann Publishers Inc. (2001)"},{"key":"11_CR21","doi-asserted-by":"publisher","unstructured":"Leal Junior, A., Diaz, C., Avellar, L., Pontes, M., Marques, C., Frizera, A.: Polymer optical fiber sensors in healthcare applications: a comprehensive review. Sensors 19, 3156 (2019). https:\/\/doi.org\/10.3390\/s19143156","DOI":"10.3390\/s19143156"},{"issue":"11","key":"11_CR22","doi-asserted-by":"publisher","first-page":"37","DOI":"10.1145\/2088456.1863529","volume":"45","author":"JP Magalhaes","year":"2010","unstructured":"Magalhaes, J.P., Dijkstra, A., Jeuring, J., L\u00f6h, A.: A generic deriving mechanism for haskell. ACM Sigplan Notices 45(11), 37\u201348 (2010)","journal-title":"ACM Sigplan Notices"},{"key":"11_CR23","doi-asserted-by":"publisher","unstructured":"Martelli, C., Cardozo da Silva, J., Kalinowski, A., Galv\u00e3o, J., Paes, T.: Biomechanical Sensors, pp. 193\u2013238 (10 2020). https:\/\/doi.org\/10.1002\/9781119534730.ch7","DOI":"10.1002\/9781119534730.ch7"},{"key":"11_CR24","doi-asserted-by":"publisher","unstructured":"Mohammed, M.G., Kramer, R.: All-printed flexible and stretchable electronics. Adv. Mater. 29(19), 1604965 (2017). https:\/\/doi.org\/10.1002\/adma.201604965. https:\/\/onlinelibrary.wiley.com\/doi\/abs\/10.1002\/adma.201604965","DOI":"10.1002\/adma.201604965"},{"key":"11_CR25","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"131","DOI":"10.1007\/978-3-319-17473-0_9","volume-title":"Languages and Compilers for Parallel Computing","author":"M Norrish","year":"2015","unstructured":"Norrish, M., Strout, M.M.: An approach for proving the correctness of inspector\/executor transformations. In: Brodman, J., Tu, P. (eds.) LCPC 2014. LNCS, vol. 8967, pp. 131\u2013145. Springer, Cham (2015). https:\/\/doi.org\/10.1007\/978-3-319-17473-0_9"},{"issue":"1","key":"11_CR26","doi-asserted-by":"publisher","first-page":"217","DOI":"10.1016\/j.cirp.2019.04.115","volume":"68","author":"L Overmeyer","year":"2019","unstructured":"Overmeyer, L., Hohnholz, A., Suttmann, O., Kaierle, S.: Multi-material laser direct writing of aerosol jet layered polymers. CIRP Ann. 68(1), 217\u2013220 (2019)","journal-title":"CIRP Ann."},{"key":"11_CR27","doi-asserted-by":"publisher","unstructured":"Pa, P., McCauley, R., Larimore, Z., Mills, M., Yarlagadda, S., Mirotznik, M.: High frequency characterization of conductive inks embedded within a structural composite. Smart Mater. Struct. 24 (2015). https:\/\/doi.org\/10.1088\/0964-1726\/24\/6\/065010","DOI":"10.1088\/0964-1726\/24\/6\/065010"}],"container-title":["Lecture Notes in Computer Science","Languages and Compilers for Parallel Computing"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-31445-2_11","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,10,20]],"date-time":"2024-10-20T04:58:36Z","timestamp":1729400316000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-31445-2_11"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023]]},"ISBN":["9783031314445","9783031314452"],"references-count":27,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-31445-2_11","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"type":"print","value":"0302-9743"},{"type":"electronic","value":"1611-3349"}],"subject":[],"published":{"date-parts":[[2023]]},"assertion":[{"value":"10 May 2023","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"LCPC","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Workshop on Languages and Compilers for Parallel Computing","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Chicago, IL","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"USA","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2022","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"12 October 2022","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"14 October 2022","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"35","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"lcpc2022","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/publish.illinois.edu\/lcpc2022atillinois\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Double-blind","order":1,"name":"type","label":"Type","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"hotcrp","order":2,"name":"conference_management_system","label":"Conference Management System","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"12","order":3,"name":"number_of_submissions_sent_for_review","label":"Number of Submissions Sent for Review","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"9","order":4,"name":"number_of_full_papers_accepted","label":"Number of Full Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"0","order":5,"name":"number_of_short_papers_accepted","label":"Number of Short Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"75% - The value is computed by the equation \"Number of Full Papers Accepted \/ Number of Submissions Sent for Review * 100\" and then rounded to a whole number.","order":6,"name":"acceptance_rate_of_full_papers","label":"Acceptance Rate of Full Papers","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"2.5","order":7,"name":"average_number_of_reviews_per_paper","label":"Average Number of Reviews per Paper","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"2","order":8,"name":"average_number_of_papers_per_reviewer","label":"Average Number of Papers per Reviewer","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"No","order":9,"name":"external_reviewers_involved","label":"External Reviewers Involved","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}}]}}