{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,2,24]],"date-time":"2026-02-24T07:00:57Z","timestamp":1771916457679,"version":"3.50.1"},"publisher-location":"Cham","reference-count":19,"publisher":"Springer Nature Switzerland","isbn-type":[{"value":"9783031430848","type":"print"},{"value":"9783031430855","type":"electronic"}],"license":[{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2023,1,1]],"date-time":"2023-01-01T00:00:00Z","timestamp":1672531200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2023]]},"DOI":"10.1007\/978-3-031-43085-5_18","type":"book-chapter","created":{"date-parts":[[2023,9,29]],"date-time":"2023-09-29T11:02:15Z","timestamp":1695985335000},"page":"221-233","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":2,"title":["Fine-Tuned SqueezeNet Lightweight Model for\u00a0Classifying Surface Defects in\u00a0Hot-Rolled Steel"],"prefix":"10.1007","author":[{"given":"Francisco","family":"L\u00f3pez de la Rosa","sequence":"first","affiliation":[]},{"given":"Jos\u00e9 Luis","family":"G\u00f3mez-Sirvent","sequence":"additional","affiliation":[]},{"given":"Lidia Mar\u00eda","family":"Belmonte","sequence":"additional","affiliation":[]},{"given":"Rafael","family":"Morales","sequence":"additional","affiliation":[]},{"given":"Antonio","family":"Fern\u00e1ndez-Caballero","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2023,9,30]]},"reference":[{"issue":"8","key":"18_CR1","doi-asserted-by":"publisher","first-page":"5031","DOI":"10.1109\/TII.2022.3146552","volume":"18","author":"I Ahmed","year":"2022","unstructured":"Ahmed, I., Jeon, G., Piccialli, F.: From artificial intelligence to explainable artificial intelligence in industry 4.0: a survey on what, how, and where. IEEE Trans. Industr. Inf. 18(8), 5031\u20135042 (2022). https:\/\/doi.org\/10.1109\/TII.2022.3146552","journal-title":"IEEE Trans. Industr. Inf."},{"issue":"1","key":"18_CR2","doi-asserted-by":"publisher","first-page":"544","DOI":"10.3390\/s23010544","volume":"23","author":"KR Ahmed","year":"2023","unstructured":"Ahmed, K.R.: DSTEELNET: a real-time parallel dilated CNN with atrous spatial pyramid pooling for detecting and classifying defects in surface steel strips. Sensors 23(1), 544 (2023). https:\/\/doi.org\/10.3390\/s23010544","journal-title":"Sensors"},{"key":"18_CR3","doi-asserted-by":"publisher","first-page":"397","DOI":"10.1016\/j.optlaseng.2019.05.005","volume":"121","author":"G Fu","year":"2019","unstructured":"Fu, G., et al.: A deep-learning-based approach for fast and robust steel surface defects classification. Opt. Lasers Eng. 121, 397\u2013405 (2019). https:\/\/doi.org\/10.1016\/j.optlaseng.2019.05.005","journal-title":"Opt. Lasers Eng."},{"key":"18_CR4","doi-asserted-by":"publisher","unstructured":"G\u00f3mez-Sirvent, J.L., L\u00f3pez de la Rosa, F., S\u00e1nchez-Reolid, R., Morales, R., Fern\u00e1ndez-Caballero, A.: Defect classification on semiconductor wafers using fisher vector and visual vocabularies coding. Measurement 202, 111872 (2022). https:\/\/doi.org\/10.1016\/j.measurement.2022.111872","DOI":"10.1016\/j.measurement.2022.111872"},{"issue":"2","key":"18_CR5","doi-asserted-by":"publisher","first-page":"324","DOI":"10.1109\/TSM.2022.3146849","volume":"35","author":"JL G\u00f3mez-Sirvent","year":"2022","unstructured":"G\u00f3mez-Sirvent, J.L., de la Rosa, F.L., S\u00e1nchez-Reolid, R., Fern\u00e1ndez-Caballero, A., Morales, R.: Optimal feature selection for defect classification in semiconductor wafers. IEEE Trans. Semicond. Manuf. 35(2), 324\u2013331 (2022). https:\/\/doi.org\/10.1109\/TSM.2022.3146849","journal-title":"IEEE Trans. Semicond. Manuf."},{"key":"18_CR6","doi-asserted-by":"publisher","unstructured":"Iandola, F.N., Han, S., Moskewicz, M.W., Ashraf, K., Dally, W.J., Keutzer, K.: SqueezeNet: AlexNet-level accuracy with 50x fewer parameters and$$<$$0.5 MB model size. arXiv:1602.07360 (2016). https:\/\/doi.org\/10.48550\/arXiv.1602.07360","DOI":"10.48550\/arXiv.1602.07360"},{"key":"18_CR7","doi-asserted-by":"publisher","unstructured":"Kingma, D.P., Ba, J.: Adam: a method for stochastic optimization. arXiv:1412.6980 (2014). https:\/\/doi.org\/10.48550\/arXiv.1412.6980","DOI":"10.48550\/arXiv.1412.6980"},{"issue":"6","key":"18_CR8","doi-asserted-by":"publisher","first-page":"84","DOI":"10.1145\/3065386","volume":"60","author":"A Krizhevsky","year":"2017","unstructured":"Krizhevsky, A., Sutskever, I., Hinton, G.E.: ImageNet classification with deep convolutional neural networks. Commun. ACM 60(6), 84\u201390 (2017). https:\/\/doi.org\/10.1145\/3065386","journal-title":"Commun. ACM"},{"issue":"8","key":"18_CR9","doi-asserted-by":"publisher","first-page":"1200","DOI":"10.3390\/electronics11081200","volume":"11","author":"S Li","year":"2022","unstructured":"Li, S., Wu, C., Xiong, N.: Hybrid architecture based on CNN and Transformer for strip steel surface defect classification. Electronics 11(8), 1200 (2022). https:\/\/doi.org\/10.3390\/electronics11081200","journal-title":"Electronics"},{"key":"18_CR10","doi-asserted-by":"publisher","unstructured":"Liashchynskyi, P., Liashchynskyi, P.: Grid search, random search, genetic algorithm: a big comparison for NAS. ArXiv:1912.06059 (2019). https:\/\/doi.org\/10.48550\/arXiv.1912.06059","DOI":"10.48550\/arXiv.1912.06059"},{"issue":"6","key":"18_CR11","doi-asserted-by":"publisher","first-page":"1562","DOI":"10.3390\/s20061562","volume":"20","author":"X Lv","year":"2020","unstructured":"Lv, X., Duan, F., Jiang, J.J., Fu, X., Gan, L.: Deep metallic surface defect detection: the new benchmark and detection network. Sensors 20(6), 1562 (2020). https:\/\/doi.org\/10.3390\/s20061562","journal-title":"Sensors"},{"key":"18_CR12","doi-asserted-by":"publisher","unstructured":"L\u00f3pez de la Rosa, F., G\u00f3mez-Sirvent, J.L., Morales, R., S\u00e1nchez-Reolid, R., Fern\u00e1ndez-Caballero, A.: A deep residual neural network for semiconductor defect classification in imbalanced scanning electron microscope datasets. Appl. Soft Comput. 131, 109743 (2022). https:\/\/doi.org\/10.1016\/j.asoc.2022.109743","DOI":"10.1016\/j.asoc.2022.109743"},{"key":"18_CR13","doi-asserted-by":"publisher","unstructured":"L\u00f3pez de la Rosa, F., G\u00f3mez-Sirvent, J.L., S\u00e1nchez-Reolid, R., Morales, R., Fern\u00e1ndez-Caballero, A.: Geometric transformation-based data augmentation on defect classification of segmented images of semiconductor materials using a resnet50 convolutional neural network. Expert Syst. Appl. 206, 117731 (2022). https:\/\/doi.org\/10.1016\/j.eswa.2022.117731","DOI":"10.1016\/j.eswa.2022.117731"},{"key":"18_CR14","doi-asserted-by":"publisher","unstructured":"Psarommatis, F., Prouvost, S., May, G., Kiritsis, D.: Product quality improvement policies in industry 4.0: characteristics, enabling factors, barriers, and evolution toward zero defect manufacturing. Front. Comput. Sci. 2 (2020). https:\/\/doi.org\/10.3389\/fcomp.2020.00026","DOI":"10.3389\/fcomp.2020.00026"},{"key":"18_CR15","doi-asserted-by":"publisher","unstructured":"Robbins, H., Monro, S.: A stochastic approximation method. Ann. Math. Stat. 400\u2013407 (1951). https:\/\/doi.org\/10.1214\/aoms\/1177729586","DOI":"10.1214\/aoms\/1177729586"},{"key":"18_CR16","doi-asserted-by":"publisher","unstructured":"L\u00f3pez de la Rosa, F., G\u00f3mez-Sirvent, J.L., Kofler, C., Morales, R., Fern\u00e1ndez-Caballero, A.: Detection of unknown defects in semiconductor materials from a hybrid deep and machine learning approach. In: Ferr\u00e1ndez Vicente, J.M., \u00c1lvarez-S\u00e1nchez, J.R., de la Paz L\u00f3pez, F., Adeli, H. (eds.) IWINAC 2022, vol. 13259. pp. 356\u2013365. Springer, Cham (2022). https:\/\/doi.org\/10.1007\/978-3-031-06527-9_35","DOI":"10.1007\/978-3-031-06527-9_35"},{"key":"18_CR17","doi-asserted-by":"publisher","first-page":"858","DOI":"10.1016\/j.apsusc.2013.09.002","volume":"285","author":"K Song","year":"2013","unstructured":"Song, K., Yan, Y.: A noise robust method based on completed local binary patterns for hot-rolled steel strip surface defects. Appl. Surf. Sci. 285, 858\u2013864 (2013). https:\/\/doi.org\/10.1016\/j.apsusc.2013.09.002","journal-title":"Appl. Surf. Sci."},{"key":"18_CR18","doi-asserted-by":"publisher","unstructured":"S\u00e1nchez-Reolid, R., et al.: Artificial neural networks to assess emotional states from brain-computer interface. Electronics 7(12) (2018). https:\/\/doi.org\/10.3390\/electronics7120384","DOI":"10.3390\/electronics7120384"},{"key":"18_CR19","doi-asserted-by":"publisher","unstructured":"Yi, L., Li, G., Jiang, M.: An end-to-end steel strip surface defects recognition system based on convolutional neural networks. Steel Res. Int. 88(2), 1600068 (2017). https:\/\/doi.org\/10.1002\/srin.201600068","DOI":"10.1002\/srin.201600068"}],"container-title":["Lecture Notes in Computer Science","Advances in Computational Intelligence"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-43085-5_18","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2023,9,29]],"date-time":"2023-09-29T11:04:38Z","timestamp":1695985478000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-43085-5_18"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2023]]},"ISBN":["9783031430848","9783031430855"],"references-count":19,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-43085-5_18","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"value":"0302-9743","type":"print"},{"value":"1611-3349","type":"electronic"}],"subject":[],"published":{"date-parts":[[2023]]},"assertion":[{"value":"30 September 2023","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"IWANN","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Work-Conference on Artificial Neural Networks","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Ponta Delgada","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Portugal","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2023","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"19 June 2023","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"21 June 2023","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"17","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"iwann2023","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"http:\/\/iwann.uma.es\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Single-blind","order":1,"name":"type","label":"Type","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"easychair","order":2,"name":"conference_management_system","label":"Conference Management System","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"149","order":3,"name":"number_of_submissions_sent_for_review","label":"Number of Submissions Sent for Review","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"108","order":4,"name":"number_of_full_papers_accepted","label":"Number of Full Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"0","order":5,"name":"number_of_short_papers_accepted","label":"Number of Short Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"72% - The value is computed by the equation \"Number of Full Papers Accepted \/ Number of Submissions Sent for Review * 100\" and then rounded to a whole number.","order":6,"name":"acceptance_rate_of_full_papers","label":"Acceptance Rate of Full Papers","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"2,7","order":7,"name":"average_number_of_reviews_per_paper","label":"Average Number of Reviews per Paper","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"2","order":8,"name":"average_number_of_papers_per_reviewer","label":"Average Number of Papers per Reviewer","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"Yes","order":9,"name":"external_reviewers_involved","label":"External Reviewers Involved","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}}]}}