{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,9,4]],"date-time":"2026-09-04T20:11:31Z","timestamp":1788552691120,"version":"build-2803163510"},"publisher-location":"Cham","reference-count":14,"publisher":"Springer Nature Switzerland","isbn-type":[{"value":"9783031481208","type":"print"},{"value":"9783031481215","type":"electronic"}],"license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024]]},"DOI":"10.1007\/978-3-031-48121-5_3","type":"book-chapter","created":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T08:02:49Z","timestamp":1705046569000},"page":"22-28","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["Wire Bonding: Limitations and Opportunities for High-Speed Serial Communications"],"prefix":"10.1007","author":[{"given":"Gabriele","family":"Ciarpi","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Marco","family":"Mestice","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Daniele","family":"Rossi","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Sergio","family":"Saponara","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","published-online":{"date-parts":[[2024,1,13]]},"reference":[{"key":"3_CR1","doi-asserted-by":"crossref","unstructured":"Sun L, et al (2022) SI\/PI co-simulation analysis of high-speed I\/O link. In: 2022 ICEPT, Dalian, China, pp 1\u20135","DOI":"10.1109\/ICEPT56209.2022.9872758"},{"issue":"16","key":"3_CR2","doi-asserted-by":"publisher","first-page":"4612","DOI":"10.3390\/s20164612","volume":"20","author":"D Monda","year":"2020","unstructured":"Monda D et al (2020) Analysis and comparison of rad-hard ring and LC-tank controlled oscillators in 65 nm for SpaceFibre applications. Sensors 20(16):4612","journal-title":"Sensors"},{"key":"3_CR3","doi-asserted-by":"crossref","unstructured":"Monda D, et al (2021) Design and verification of a 6.25 GHz LC-tank VCO integrated in 65 nm CMOS technology operating up to 1 Grad TID. IEEE TNS 68(10):2524\u20132532","DOI":"10.1109\/TNS.2021.3102481"},{"key":"3_CR4","doi-asserted-by":"crossref","unstructured":"Bo\u017eani\u00b4c M, et al (2019) Systems-level packaging for millimeter-wave transceivers. Springer, Vienna, Austria","DOI":"10.1007\/978-3-030-14690-0"},{"key":"3_CR5","doi-asserted-by":"crossref","unstructured":"Chang PH, et al (2021) Signal and power integrity analysis of a 0.38 pJ\/bit 12.8 Gb\/s parallel interface for die-to-die link applications. In: 2021 ECTC, CA, USA, pp 1264\u20131269","DOI":"10.1109\/ECTC32696.2021.00205"},{"key":"3_CR6","doi-asserted-by":"crossref","unstructured":"Ciarpi G et al (2022) Design and characterization of 10 Gb\/s and 1 Grad TID-tolerant optical modulator driver. In: IEEE TCAS-I, vol 69, no 8, pp 3177\u20133189","DOI":"10.1109\/TCSI.2022.3171827"},{"key":"3_CR7","doi-asserted-by":"crossref","unstructured":"Ciarpi G, et al (2019) Design, implementation, and experimental verification of 5 Gbps, 800 Mrad TID and SEU-tolerant optical modulators drivers. In: IEEE TCAS-I, vol 67, no 3, pp 829\u2013838","DOI":"10.1109\/TCSI.2019.2954755"},{"key":"3_CR8","doi-asserted-by":"publisher","first-page":"303","DOI":"10.1016\/j.nima.2018.07.066","volume":"936","author":"F Palla","year":"2019","unstructured":"Palla F et al (2019) Design of a high radiation-hard driver for Mach-Zehnder Modulators based high-speed links for hadron collider applications. Nucl Instrum Meth Phys Res, Sect A 936:303\u2013304","journal-title":"Nucl Instrum Meth Phys Res, Sect A"},{"key":"3_CR9","doi-asserted-by":"crossref","unstructured":"Mestice M, et al (2020) Analysis and design of integrated blocks for a 6.25 GHz spacefibre PLL. Sensors 20(14):4013","DOI":"10.3390\/s20144013"},{"key":"3_CR10","doi-asserted-by":"crossref","unstructured":"Ciarpi G, et al (2023) A 10 Gb\/s line driver in 65 nm CMOS technology for radiation-pervaded and high-temperature applications. IEEE Access","DOI":"10.1109\/ICECS58634.2023.10382786"},{"key":"3_CR11","doi-asserted-by":"crossref","unstructured":"Kim J (2009) Design optimization of on-chip inductive peaking structures for 0.13-\u03bcm CMOS 40-Gb\/s transmitter circuits. IEEE TCAS-I 56(12):2544\u20132555","DOI":"10.1109\/TCSI.2009.2023772"},{"key":"3_CR12","doi-asserted-by":"crossref","unstructured":"Mokhtari A, et al (2020) Stochastic Quasi-Newton methods. Proc IEEE 108(11):1906\u20131922","DOI":"10.1109\/JPROC.2020.3023660"},{"key":"3_CR13","doi-asserted-by":"crossref","unstructured":"Tao Z, et al (2017) High\u2010gain low\u2010cost broadband 60 GHz differential integrated patch array antennas with wire\u2010bonding packaging and on\u2010board compensation network. IET Microwaves Antennas Propag 11.7:971\u2013975","DOI":"10.1049\/iet-map.2016.0430"},{"key":"3_CR14","doi-asserted-by":"crossref","unstructured":"Voinigescu S (2013) High-frequency integrated circuits. Cambridge University Press","DOI":"10.1017\/CBO9781139021128"}],"container-title":["Lecture Notes in Electrical Engineering","Applications in Electronics Pervading Industry, Environment and Society"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-48121-5_3","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,12]],"date-time":"2024-01-12T08:03:09Z","timestamp":1705046589000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-48121-5_3"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"ISBN":["9783031481208","9783031481215"],"references-count":14,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-48121-5_3","relation":{},"ISSN":["1876-1100","1876-1119"],"issn-type":[{"value":"1876-1100","type":"print"},{"value":"1876-1119","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]},"assertion":[{"value":"13 January 2024","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"ApplePies","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Conference on Applications in Electronics Pervading Industry, Environment and Society","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Genoa","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Italy","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2023","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"28 September 2023","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"29 September 2023","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"applepies2023","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/applepies.eu\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}}]}}