{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,4,10]],"date-time":"2026-04-10T18:26:26Z","timestamp":1775845586336,"version":"3.50.1"},"publisher-location":"Cham","reference-count":20,"publisher":"Springer Nature Switzerland","isbn-type":[{"value":"9783031500749","type":"print"},{"value":"9783031500756","type":"electronic"}],"license":[{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2024,1,1]],"date-time":"2024-01-01T00:00:00Z","timestamp":1704067200000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2024]]},"DOI":"10.1007\/978-3-031-50075-6_24","type":"book-chapter","created":{"date-parts":[[2024,1,21]],"date-time":"2024-01-21T06:01:39Z","timestamp":1705816899000},"page":"309-320","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":1,"title":["A Novel Approach to\u00a0Curved Layer Slicing and\u00a0Path Planning for\u00a0Multi-degree-of-Freedom 3D Printing"],"prefix":"10.1007","author":[{"given":"Yuqin","family":"Zeng","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Zhen","family":"Chen","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Weihao","family":"Zhang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Jiapeng","family":"Wang","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0003-0155-4956","authenticated-orcid":false,"given":"Shuqian","family":"Fan","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2024,1,22]]},"reference":[{"issue":"5","key":"24_CR1","doi-asserted-by":"publisher","first-page":"2774","DOI":"10.1109\/TSMC.2019.2916896","volume":"51","author":"K Aouaidjia","year":"2019","unstructured":"Aouaidjia, K., Sheng, B., Li, P., Kim, J., Feng, D.D.: Efficient body motion quantification and similarity evaluation using 3-D joints skeleton coordinates. IEEE Trans. Syst. Man Cybern. Syst. 51(5), 2774\u20132788 (2019)","journal-title":"IEEE Trans. Syst. Man Cybern. Syst."},{"key":"24_CR2","doi-asserted-by":"publisher","unstructured":"Bhatt, P.M., Malhan, R.K., Shembekar, A.V., Yoon, Y.J., Gupta, S.K.: Expanding capabilities of additive manufacturing through use of robotics technologies: a survey. Addit. Manuf. 31, 100933 (2020). https:\/\/doi.org\/10.1016\/j.addma.2019.100933","DOI":"10.1016\/j.addma.2019.100933"},{"key":"24_CR3","doi-asserted-by":"crossref","unstructured":"Botsch, M., Kobbelt, L.: A remeshing approach to multiresolution modeling. In: Proceedings of the 2004 Eurographics\/ACM SIGGRAPH Symposium on Geometry Processing, pp. 185\u2013192 (2004)","DOI":"10.1145\/1057432.1057457"},{"issue":"2","key":"24_CR4","doi-asserted-by":"publisher","first-page":"235","DOI":"10.1016\/j.cad.2007.10.014","volume":"40","author":"D Chakraborty","year":"2008","unstructured":"Chakraborty, D., Reddy, B.A., Choudhury, A.R.: Extruder path generation for curved layer fused deposition modeling. Comput. Aided Des. 40(2), 235\u2013243 (2008). https:\/\/doi.org\/10.1016\/j.cad.2007.10.014","journal-title":"Comput. Aided Des."},{"issue":"11","key":"24_CR5","doi-asserted-by":"publisher","first-page":"90","DOI":"10.1145\/3131280","volume":"60","author":"K Crane","year":"2017","unstructured":"Crane, K., Weischedel, C., Wardetzky, M.: The heat method for distance computation. Commun. ACM 60(11), 90\u201399 (2017). https:\/\/doi.org\/10.1145\/3131280","journal-title":"Commun. ACM"},{"issue":"4","key":"24_CR6","doi-asserted-by":"publisher","first-page":"1711","DOI":"10.1109\/tase.2020.2974771","volume":"17","author":"CK Dai","year":"2020","unstructured":"Dai, C.K., Lefebvre, S., Yu, K.M., Geraedts, J.M.P., Wang, C.C.L.: Planning jerk-optimized trajectory with discrete time constraints for redundant robots. IEEE Trans. Autom. Sci. Eng. 17(4), 1711\u20131724 (2020). https:\/\/doi.org\/10.1109\/tase.2020.2974771","journal-title":"IEEE Trans. Autom. Sci. Eng."},{"issue":"4","key":"24_CR7","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1145\/3197517.3201342","volume":"37","author":"CK Dai","year":"2018","unstructured":"Dai, C.K., Wang, C.C.L., Wu, C.M., Lefebvre, S., Fang, G.X., Liu, Y.J.: Support-free volume printing by multi-axis motion. ACM Trans. Graph. 37(4), 1\u201314 (2018). https:\/\/doi.org\/10.1145\/3197517.3201342","journal-title":"ACM Trans. Graph."},{"issue":"5","key":"24_CR8","doi-asserted-by":"publisher","first-page":"528","DOI":"10.1108\/RPJ-09-2014-0117","volume":"21","author":"C Duran","year":"2015","unstructured":"Duran, C., Subbian, V., Giovanetti, M.T., Simkins, J.R., Beyette, F.R., Jr.: Experimental desktop 3D printing using dual extrusion and water-soluble polyvinyl alcohol. Rapid Prototyp. J. 21(5), 528\u2013534 (2015)","journal-title":"Rapid Prototyp. J."},{"issue":"4","key":"24_CR9","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1145\/3306346.3323022","volume":"38","author":"J Etienne","year":"2019","unstructured":"Etienne, J., et al.: Curvislicer: slightly curved slicing for 3-axis printers. ACM Trans. Graph. (TOG) 38(4), 1\u201311 (2019)","journal-title":"ACM Trans. Graph. (TOG)"},{"issue":"6","key":"24_CR10","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1145\/3414685.3417834","volume":"39","author":"G Fang","year":"2020","unstructured":"Fang, G., Zhang, T., Zhong, S., Chen, X., Zhong, Z., Wang, C.C.: Reinforced FDM: multi-axis filament alignment with controlled anisotropic strength. ACM Trans. Graph. (TOG) 39(6), 1\u201315 (2020)","journal-title":"ACM Trans. Graph. (TOG)"},{"key":"24_CR11","unstructured":"Li, Y., He, D., Wang, X., Tang, K.: Geodesic distance field-based curved layer volume decomposition for multi-axis support-free printing. arXiv preprint arXiv:2003.05938 (2020)"},{"key":"24_CR12","series-title":"LNCS","doi-asserted-by":"publisher","first-page":"497","DOI":"10.1007\/978-3-031-35696-4_36","volume-title":"HCII 2023","author":"M Liu","year":"2023","unstructured":"Liu, M., Yang, W.: Optimizing the design process of 3D printing services for personal customization. In: Marcus, A., Rosenzweig, E., Soares, M.M. (eds.) HCII 2023. LNCS, vol. 14031, pp. 497\u2013513. Springer, Cham (2023). https:\/\/doi.org\/10.1007\/978-3-031-35696-4_36"},{"issue":"5","key":"24_CR13","doi-asserted-by":"publisher","first-page":"274","DOI":"10.1108\/13552540310502185","volume":"9","author":"PM Pandey","year":"2003","unstructured":"Pandey, P.M., Reddy, N.V., Dhande, S.G.: Slicing procedures in layered manufacturing: a review. Rapid Prototyp. J. 9(5), 274\u2013288 (2003). https:\/\/doi.org\/10.1108\/13552540310502185","journal-title":"Rapid Prototyp. J."},{"issue":"1","key":"24_CR14","doi-asserted-by":"publisher","first-page":"83","DOI":"10.1137\/050627083","volume":"45","author":"JL Qian","year":"2007","unstructured":"Qian, J.L., Zhang, Y.T., Zhao, H.K.: Fast sweeping methods for eikonal equations on triangular meshes. SIAM J. Numer. Anal. 45(1), 83\u2013107 (2007). https:\/\/doi.org\/10.1137\/050627083","journal-title":"SIAM J. Numer. Anal."},{"key":"24_CR15","doi-asserted-by":"crossref","unstructured":"Qin, Y., Chi, X., Sheng, B., Lau, R.W.: Guiderender: large-scale scene navigation based on multi-modal view frustum movement prediction. Vis. Comput. 1\u201311 (2023)","DOI":"10.1007\/s00371-023-02922-x"},{"key":"24_CR16","doi-asserted-by":"publisher","first-page":"484","DOI":"10.1016\/j.promfg.2021.06.081","volume":"53","author":"Y Shan","year":"2021","unstructured":"Shan, Y., Gan, D., Mao, H.: Curved layer slicing based on isothermal surface. Procedia Manufact. 53, 484\u2013491 (2021)","journal-title":"Procedia Manufact."},{"key":"24_CR17","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"647","DOI":"10.1007\/978-3-030-77970-2_50","volume-title":"Computational Science \u2013 ICCS 2021","author":"T Szydlo","year":"2021","unstructured":"Szydlo, T., Sendorek, J., Windak, M., Brzoza-Woch, R.: Dataset for anomalies detection in 3D printing. In: Paszynski, M., Kranzlm\u00fcller, D., Krzhizhanovskaya, V.V., Dongarra, J.J., Sloot, P.M.A. (eds.) ICCS 2021. LNCS, vol. 12745, pp. 647\u2013653. Springer, Cham (2021). https:\/\/doi.org\/10.1007\/978-3-030-77970-2_50"},{"key":"24_CR18","doi-asserted-by":"publisher","first-page":"496","DOI":"10.1016\/j.rcim.2019.01.007","volume":"57","author":"MQ Wang","year":"2019","unstructured":"Wang, M.Q., Zhang, H.G., Hu, Q.X., Liu, D., Herfried, L.: Research and implementation of a non-supporting 3D printing method based on 5-axis dynamic slice algorithm. Robot. Comput.-Integr. Manuf. 57, 496\u2013505 (2019). https:\/\/doi.org\/10.1016\/j.rcim.2019.01.007","journal-title":"Robot. Comput.-Integr. Manuf."},{"key":"24_CR19","doi-asserted-by":"publisher","first-page":"51","DOI":"10.1016\/j.cad.2019.05.007","volume":"114","author":"K Xu","year":"2019","unstructured":"Xu, K., Li, Y.G., Chen, L.F., Tang, K.: Curved layer based process planning for multi-axis volume printing of freeform parts. Comput.-Aided Des. 114, 51\u201363 (2019). https:\/\/doi.org\/10.1016\/j.cad.2019.05.007","journal-title":"Comput.-Aided Des."},{"issue":"6","key":"24_CR20","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1145\/3550454.3555469","volume":"41","author":"T Zhang","year":"2022","unstructured":"Zhang, T., et al.: S3-slicer: a general slicing framework for multi-axis 3D printing. ACM Trans. Graph. (TOG) 41(6), 1\u201315 (2022)","journal-title":"ACM Trans. Graph. (TOG)"}],"container-title":["Lecture Notes in Computer Science","Advances in Computer Graphics"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-50075-6_24","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2024,1,21]],"date-time":"2024-01-21T06:05:15Z","timestamp":1705817115000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-50075-6_24"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2024]]},"ISBN":["9783031500749","9783031500756"],"references-count":20,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-50075-6_24","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"value":"0302-9743","type":"print"},{"value":"1611-3349","type":"electronic"}],"subject":[],"published":{"date-parts":[[2024]]},"assertion":[{"value":"22 January 2024","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"CGI","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Computer Graphics International Conference","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Shanghai","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"China","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2023","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"28 August 2023","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"1 September 2023","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"cgi2023","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Double-blind","order":1,"name":"type","label":"Type","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"EasyChair","order":2,"name":"conference_management_system","label":"Conference Management System","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"385","order":3,"name":"number_of_submissions_sent_for_review","label":"Number of Submissions Sent for Review","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"149","order":4,"name":"number_of_full_papers_accepted","label":"Number of Full Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"0","order":5,"name":"number_of_short_papers_accepted","label":"Number of Short Papers Accepted","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"39% - The value is computed by the equation \"Number of Full Papers Accepted \/ Number of Submissions Sent for Review * 100\" and then rounded to a whole number.","order":6,"name":"acceptance_rate_of_full_papers","label":"Acceptance Rate of Full Papers","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"3","order":7,"name":"average_number_of_reviews_per_paper","label":"Average Number of Reviews per Paper","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"3","order":8,"name":"average_number_of_papers_per_reviewer","label":"Average Number of Papers per Reviewer","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}},{"value":"Yes","order":9,"name":"external_reviewers_involved","label":"External Reviewers Involved","group":{"name":"ConfEventPeerReviewInformation","label":"Peer Review Information (provided by the conference organizers)"}}]}}