{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,27]],"date-time":"2025-03-27T22:44:11Z","timestamp":1743115451909,"version":"3.40.3"},"publisher-location":"Cham","reference-count":24,"publisher":"Springer Nature Switzerland","isbn-type":[{"type":"print","value":"9783031783760"},{"type":"electronic","value":"9783031783777"}],"license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025]]},"DOI":"10.1007\/978-3-031-78377-7_2","type":"book-chapter","created":{"date-parts":[[2025,1,27]],"date-time":"2025-01-27T15:59:30Z","timestamp":1737993570000},"page":"18-33","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["Experimental Assessment and\u00a0Biaffine Modeling of\u00a0the\u00a0Impact of\u00a0Ambient Temperature on\u00a0SoC Power Requirements"],"prefix":"10.1007","author":[{"given":"Kameswar Rao","family":"Vaddina","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Florian","family":"Brandner","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"G\u00e9rard","family":"Memmi","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"given":"Pierre","family":"Jouvelot","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2025,1,28]]},"reference":[{"key":"2_CR1","doi-asserted-by":"publisher","unstructured":"Bhat, G., Singla, G., Unver, A.K., Ogras, U.Y.: Algorithmic optimization of thermal and power management for heterogeneous mobile platforms. IEEE Trans. Very Large Scale Integr. Syst. 26(3), 544\u2013557 (2018). https:\/\/doi.org\/10.1109\/TVLSI.2017.2770163","DOI":"10.1109\/TVLSI.2017.2770163"},{"key":"2_CR2","doi-asserted-by":"publisher","unstructured":"Chandrakasan, A., Yang, I., Vieri, C., Antoniadis, D.: Design considerations and tools for low-voltage digital system design. In: Proceedings of the 33rd Annual Design Automation Conference, (DAC 1996), pp. 113\u2013118. Association for Computing Machinery (1996). https:\/\/doi.org\/10.1145\/240518.240540","DOI":"10.1145\/240518.240540"},{"key":"2_CR3","unstructured":"CTS Electronic Components 2006. Cooling Critical Components. CTS Electronic Components. Application Note \u2013 AN1010 (2006)"},{"key":"2_CR4","doi-asserted-by":"publisher","unstructured":"De Vogeleer, K., Memmi, G., Jouvelot, P., Coelho, F.: The energy\/frequency convexity rule: modeling and experimental validation on mobile devices. In: Wyrzykowski, R., Dongarra, J., Karczewski, K., Wa\u015bniewski, J. (eds.) Parallel Processing and Applied Mathematics, pp. 793\u2013803. Springer, Heidelberg (2014a). https:\/\/doi.org\/10.1007\/978-3-642-55224-3_74","DOI":"10.1007\/978-3-642-55224-3_74"},{"key":"2_CR5","doi-asserted-by":"publisher","unstructured":"De\u00a0Vogeleer, K., Memmi, G., Jouvelot, P., Coelho, F.: Modeling the temperature bias of power consumption for nanometer-scale CPUs in application processors. In: 2014 International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation (SAMOS XIV), pp. 172\u2013180 (2014). https:\/\/doi.org\/10.1109\/SAMOS.2014.6893209","DOI":"10.1109\/SAMOS.2014.6893209"},{"key":"2_CR6","doi-asserted-by":"publisher","unstructured":"El-Sayed, N., Stefanovici, I.A., Amvrosiadis, G., Hwang, A.A., Schroeder, B.: Temperature management in data centers: why some (might) like it hot. In: Proceedings of the 12th ACM SIGMETRICS\/PERFORMANCE Joint International Conference on Measurement and Modeling of Computer Systems (SIGMETRICS 2012). Association for Computing Machinery, New York, NY, USA, pp. 163\u2013174 (2012). https:\/\/doi.org\/10.1145\/2254756.2254778","DOI":"10.1145\/2254756.2254778"},{"key":"2_CR7","doi-asserted-by":"publisher","unstructured":"Guermouche, A., Orgerie, A.-C.: Thermal design power and vectorized instructions behavior. Concurr. Comput. Pract. Exp. 34, 2 (2022). https:\/\/doi.org\/10.1002\/cpe.6261","DOI":"10.1002\/cpe.6261"},{"issue":"2021","key":"2_CR8","doi-asserted-by":"publisher","first-page":"117050","DOI":"10.1016\/j.apenergy.2021.117050","volume":"299","author":"R Gupta","year":"2021","unstructured":"Gupta, R., Asgari, S., Moazamigoodarzi, H., Down, D.G., Puri, I.K.: Energy, exergy and computing efficiency based data center workload and cooling management. Appl. Energy 299(2021), 117050 (2021). https:\/\/doi.org\/10.1016\/j.apenergy.2021.117050","journal-title":"Appl. Energy"},{"key":"2_CR9","doi-asserted-by":"publisher","unstructured":"Guthaus, M.R., Ringenberg, J.S., Ernst, D., Austin, T.M., Mudge, T., Brown, R.B.: MiBench: a free, commercially representative embedded benchmark suite. In: Proceedings of the Fourth Annual IEEE International Workshop on Workload Characterization. WWC-4 (Cat. No. 01EX538), pp. 3\u201314 (2001). https:\/\/doi.org\/10.1109\/WWC.2001.990739","DOI":"10.1109\/WWC.2001.990739"},{"key":"2_CR10","unstructured":"Xilinx Inc. Xilinx Power Estimator User Guide (2018)"},{"key":"2_CR11","unstructured":"Intel. Intel\u00ae FPGA Power and Thermal Calculator User Guide (2020)"},{"key":"2_CR12","doi-asserted-by":"crossref","unstructured":"Liu, Y., Dick, R.P., Shang, L., Yang, H.: Accurate temperature-dependent integrated circuit leakage power estimation is easy. In: Proceedings of the Conference on Design, Automation and Test in Europe, (DATE 2007). EDA Consortium, pp. 1526\u20131531 (2007)","DOI":"10.1109\/DATE.2007.364517"},{"key":"2_CR13","doi-asserted-by":"publisher","unstructured":"Liu, Z., Kursun, V.: PMOS-only sleep switch dual-threshold voltage domino logic in Sub-65-Nm CMOS technologies. IEEE Trans. Very Large Scale Integr. Syst. 15(12), 1311\u20131319 (2007). https:\/\/doi.org\/10.1109\/TVLSI.2007.903947","DOI":"10.1109\/TVLSI.2007.903947"},{"key":"2_CR14","unstructured":"Lucian, S.: Leakage Power - it\u2019s worse than you think (2011). https:\/\/www.eetimes.com\/leakage-power-its-worse-than-you-think\/"},{"key":"2_CR15","unstructured":"Narendra, S.G., Chandrakasan, A.P. (eds.): Leakage in Nanometer CMOS Technologies. Springer, Heidelberg (2006)"},{"key":"2_CR16","doi-asserted-by":"publisher","unstructured":"Prakash, A., Wang, S., Mitra, T.: Mobile application processors: techniques for software power-performance optimization. IEEE Consum. Electron. Mag. 9(4), 67\u201376 (2020). https:\/\/doi.org\/10.1109\/MCE.2020.2969171","DOI":"10.1109\/MCE.2020.2969171"},{"key":"2_CR17","doi-asserted-by":"publisher","unstructured":"Singh, A.K., Dey, S., McDonald-Maier, K., Basireddy, K.R., Merrett, G.V., Al-Hashimi, B.M.: Dynamic energy and thermal management of multi-core mobile platforms: a survey. IEEE Des. Test 37(5), 25\u201333 (2020). https:\/\/doi.org\/10.1109\/MDAT.2020.2982629","DOI":"10.1109\/MDAT.2020.2982629"},{"key":"2_CR18","doi-asserted-by":"crossref","unstructured":"Singla, G., Kaur, G., Unver, A.K., Ogras, U.Y.: Predictive dynamic thermal and power management for heterogeneous mobile platforms. In: Proceedings of the 2015 Design, Automation & Test in Europe Conference & Exhibition, (DATE 2015). EDA Consortium, pp. 960\u2013965 (2015)","DOI":"10.7873\/DATE.2015.1036"},{"key":"2_CR19","doi-asserted-by":"publisher","unstructured":"Skadron, K., Stan, M.R., Huang, W., Velusamy, S., Sankaranarayanan, K., Tarjan, D.: Temperature-aware microarchitecture. In: Proceedings of the 30th Annual International Symposium on Computer Architecture, (ISCA 2003), pp. 2\u201313. Association for Computing Machinery (2003). https:\/\/doi.org\/10.1145\/859618.859620","DOI":"10.1145\/859618.859620"},{"key":"2_CR20","unstructured":"TI Inc. Understanding Thermal Dissipation and Design of a Heatsink. TI Inc. Application Report \u2013 SLVA462 (2011)"},{"key":"2_CR21","unstructured":"TI Inc. Thermal Design Guide for DSP and ARM Application Processors. TI Inc. Application Report \u2013 SPRABI3B (2017)"},{"key":"2_CR22","unstructured":"TI Inc. AM572x Thermal Considerations. TI Inc. Application Report \u2013 SPRAC53A (2018)"},{"key":"2_CR23","doi-asserted-by":"crossref","unstructured":"Vaddina, K.R., Brandner, F., Memmi, G., Jouvelot, P.: Experimental energy profiling of energy-critical embedded applications. In: 25th International Conference on Software SoftCOM, pp. 1\u20136 (2017). https:\/\/minesparis-psl.hal.science\/hal-01625409v2\/file\/A-666-v2.pdf","DOI":"10.23919\/SOFTCOM.2017.8115536"},{"key":"2_CR24","doi-asserted-by":"crossref","unstructured":"Vaddina, K.R., Lefevre, L., Orgerie, A.C.: Experimental workflow for energy and temperature profiling on HPC systems. In: 2021 IEEE Symposium on Computers and Communications (ISCC), pp. 1\u20137. IEEE (2021)","DOI":"10.1109\/ISCC53001.2021.9631413"}],"container-title":["Lecture Notes in Computer Science","Embedded Computer Systems: Architectures, Modeling, and Simulation"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-78377-7_2","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,1,27]],"date-time":"2025-01-27T15:59:38Z","timestamp":1737993578000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-78377-7_2"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"ISBN":["9783031783760","9783031783777"],"references-count":24,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-78377-7_2","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"type":"print","value":"0302-9743"},{"type":"electronic","value":"1611-3349"}],"subject":[],"published":{"date-parts":[[2025]]},"assertion":[{"value":"28 January 2025","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"SAMOS","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"International Conference on Embedded Computer Systems: Architectures, Modeling, and Simulation","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Samos","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Greece","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2024","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"30 June 2024","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"5 July 2024","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"24","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"samos2024","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/samos-conference.com\/wp\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}}]}}