{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T13:40:03Z","timestamp":1747921203436,"version":"3.41.0"},"publisher-location":"Cham","reference-count":44,"publisher":"Springer Nature Switzerland","isbn-type":[{"value":"9783031928048","type":"print"},{"value":"9783031928055","type":"electronic"}],"license":[{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"tdm","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"},{"start":{"date-parts":[[2025,1,1]],"date-time":"2025-01-01T00:00:00Z","timestamp":1735689600000},"content-version":"vor","delay-in-days":0,"URL":"https:\/\/www.springernature.com\/gp\/researchers\/text-and-data-mining"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2025]]},"DOI":"10.1007\/978-3-031-92805-5_17","type":"book-chapter","created":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T12:59:40Z","timestamp":1747918780000},"page":"259-275","update-policy":"https:\/\/doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":0,"title":["DIE-VIS: An\u00a0Automated Visual Inspection System for\u00a0Cardboard Box Manufacturing"],"prefix":"10.1007","author":[{"ORCID":"https:\/\/orcid.org\/0000-0003-3349-7861","authenticated-orcid":false,"given":"Flavia","family":"Monti","sequence":"first","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0009-0008-9110-0555","authenticated-orcid":false,"given":"Matteo","family":"Marinacci","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0001-9216-8502","authenticated-orcid":false,"given":"Francesco","family":"Leotta","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]},{"ORCID":"https:\/\/orcid.org\/0000-0002-9730-8882","authenticated-orcid":false,"given":"Massimo","family":"Mecella","sequence":"additional","affiliation":[],"role":[{"role":"author","vocabulary":"crossref"}]}],"member":"297","published-online":{"date-parts":[[2025,5,12]]},"reference":[{"key":"17_CR1","doi-asserted-by":"crossref","unstructured":"Alharbi, O.: Industry 4.0 operators: core knowledge and skills. Adv. Sci. Technol. Eng. Syst. J. (2020)","DOI":"10.25046\/aj050421"},{"key":"17_CR2","doi-asserted-by":"crossref","unstructured":"Balestrino, A., Landi, A., Pacini, L.: Vision system for monitoring the production of corrugated cardboard. In: IEEE ICCAD, pp. 626\u2013631. IEEE (2006)","DOI":"10.1109\/CCA.2006.285942"},{"key":"17_CR3","doi-asserted-by":"publisher","first-page":"119790","DOI":"10.1016\/j.techfore.2019.119790","volume":"150","author":"G B\u00fcchi","year":"2020","unstructured":"B\u00fcchi, G., Cugno, M., Castagnoli, R.: Smart factory performance and Industry 4.0. Technol. Forecast. Soc. Change 150, 119790 (2020)","journal-title":"Technol. Forecast. Soc. Change"},{"key":"17_CR4","doi-asserted-by":"publisher","first-page":"679","DOI":"10.1109\/TPAMI.1986.4767851","volume":"6","author":"J Canny","year":"1986","unstructured":"Canny, J.: A computational approach to edge detection. IEEE Trans. Pattern Anal. Mach. Intell. 6, 679\u2013698 (1986)","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"key":"17_CR5","unstructured":"cardspace: cardboard_testset_ dataset (2024). https:\/\/universe.roboflow.com\/cardspace\/cardboard_testset_"},{"key":"17_CR6","unstructured":"cardspace: hole_fold dataset (2024). https:\/\/universe.roboflow.com\/cardspace\/hole_fold"},{"issue":"2","key":"17_CR7","doi-asserted-by":"publisher","first-page":"453","DOI":"10.1007\/s10845-018-1458-z","volume":"31","author":"H Chen","year":"2020","unstructured":"Chen, H., Pang, Y., Hu, Q., Liu, K.: Solar cell surface defect inspection based on multispectral convolutional neural network. J. Intell. Manuf. 31(2), 453\u2013468 (2020)","journal-title":"J. Intell. Manuf."},{"key":"17_CR8","doi-asserted-by":"publisher","first-page":"33","DOI":"10.1007\/s00170-015-7514-3","volume":"83","author":"A Chondronasios","year":"2016","unstructured":"Chondronasios, A., Popov, I., Jordanov, I.: Feature selection for surface defect classification of extruded aluminum profiles. Int. J. Adv. Manuf. Technol. 83, 33\u201341 (2016)","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"17_CR9","doi-asserted-by":"publisher","first-page":"140","DOI":"10.1016\/j.chemolab.2017.10.020","volume":"171","author":"M Chu","year":"2017","unstructured":"Chu, M., Gong, R., Gao, S., Zhao, J.: Steel surface defects recognition based on multi-type statistical features and enhanced twin support vector machine. Chemom. Intell. Lab. Syst. 171, 140\u2013150 (2017)","journal-title":"Chemom. Intell. Lab. Syst."},{"key":"17_CR10","first-page":"1","volume":"2010","author":"M Cristani","year":"2010","unstructured":"Cristani, M., Farenzena, M., Bloisi, D., Murino, V.: Background subtraction for automated multisensor surveillance: a comprehensive review. EURASIP J. Adv. Sig. Process. 2010, 1\u201324 (2010)","journal-title":"EURASIP J. Adv. Sig. Process."},{"key":"17_CR11","doi-asserted-by":"crossref","unstructured":"Deng, J., Dong, W., Socher, R., Li, L.J., Li, K., Fei-Fei, L.: ImageNET: a large-scale hierarchical image database. In: 2009 IEEE Conference on Computer Vision and Pattern Recognition, pp. 248\u2013255. IEEE (2009)","DOI":"10.1109\/CVPR.2009.5206848"},{"key":"17_CR12","doi-asserted-by":"crossref","unstructured":"Ding, C., Pang, G., Shen, C.: Catching both gray and black swans: open-set supervised anomaly detection. In: 2022 IEEE\/CVF Conference on Computer Vision and Pattern Recognition (CVPR), pp. 7378\u20137388 (2022)","DOI":"10.1109\/CVPR52688.2022.00724"},{"key":"17_CR13","doi-asserted-by":"publisher","first-page":"753","DOI":"10.1016\/j.jmsy.2021.05.008","volume":"62","author":"Y Gao","year":"2022","unstructured":"Gao, Y., Li, X., Wang, X.V., Wang, L., Gao, L.: A review on recent advances in vision-based defect recognition towards industrial intelligence. J. Manuf. Syst. 62, 753\u2013766 (2022)","journal-title":"J. Manuf. Syst."},{"issue":"2","key":"17_CR14","doi-asserted-by":"publisher","first-page":"445","DOI":"10.1007\/s40745-022-00437-1","volume":"11","author":"MW Hridoy","year":"2024","unstructured":"Hridoy, M.W., Rahman, M.M., Sakib, S.: A framework for industrial inspection system using deep learning. Ann. Data Sci. 11(2), 445\u2013478 (2024)","journal-title":"Ann. Data Sci."},{"issue":"2","key":"17_CR15","doi-asserted-by":"publisher","first-page":"179","DOI":"10.1109\/TIT.1962.1057692","volume":"8","author":"MK Hu","year":"1962","unstructured":"Hu, M.K.: Visual pattern recognition by moment invariants. IRE Trans. Inf. Theory 8(2), 179\u2013187 (1962)","journal-title":"IRE Trans. Inf. Theory"},{"key":"17_CR16","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1016\/j.compind.2014.10.006","volume":"66","author":"SH Huang","year":"2015","unstructured":"Huang, S.H., Pan, Y.C.: Automated visual inspection in the semiconductor industry: a survey. Comput. Ind. 66, 1\u201310 (2015)","journal-title":"Comput. Ind."},{"issue":"4","key":"17_CR17","doi-asserted-by":"publisher","first-page":"540","DOI":"10.1016\/j.autcon.2005.08.001","volume":"15","author":"S Lee","year":"2006","unstructured":"Lee, S., Chang, L.M., Skibniewski, M.: Automated recognition of surface defects using digital color image processing. Autom. Constr. 15(4), 540\u2013549 (2006)","journal-title":"Autom. Constr."},{"key":"17_CR18","doi-asserted-by":"crossref","unstructured":"Lee, X.Y., et al.: XDNet: a few-shot meta-learning approach for cross-domain visual inspection. In: Proceedings of the IEEE\/CVF Conference on Computer Vision and Pattern Recognition, pp. 4375\u20134384 (2023)","DOI":"10.1109\/CVPRW59228.2023.00460"},{"issue":"2","key":"17_CR19","doi-asserted-by":"publisher","first-page":"742","DOI":"10.1016\/j.patcog.2011.07.025","volume":"45","author":"WC Li","year":"2012","unstructured":"Li, W.C., Tsai, D.M.: Wavelet-based defect detection in solar wafer images with inhomogeneous texture. Pattern Recogn. 45(2), 742\u2013756 (2012)","journal-title":"Pattern Recogn."},{"key":"17_CR20","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"740","DOI":"10.1007\/978-3-319-10602-1_48","volume-title":"Computer Vision \u2013 ECCV 2014","author":"T-Y Lin","year":"2014","unstructured":"Lin, T.-Y., et al.: Microsoft COCO: common objects in context. In: Fleet, D., Pajdla, T., Schiele, B., Tuytelaars, T. (eds.) ECCV 2014. LNCS, vol. 8693, pp. 740\u2013755. Springer, Cham (2014). https:\/\/doi.org\/10.1007\/978-3-319-10602-1_48"},{"issue":"4","key":"17_CR21","doi-asserted-by":"publisher","first-page":"229","DOI":"10.1007\/s40430-023-04050-y","volume":"45","author":"RG Lins","year":"2023","unstructured":"Lins, R.G., Santos, R.E.D., Gaspar, R.: Vision-based measurement for quality control inspection in the context of Industry 4.0: a comprehensive review and design challenges. J. Braz. Soc. Mech. Sci. Eng. 45(4), 229 (2023)","journal-title":"J. Braz. Soc. Mech. Sci. Eng."},{"issue":"15","key":"17_CR22","doi-asserted-by":"publisher","first-page":"3127","DOI":"10.3390\/app9153127","volume":"9","author":"Y Liu","year":"2019","unstructured":"Liu, Y., Xu, K., Xu, J.: Periodic surface defect detection in steel plates based on deep learning. Appl. Sci. 9(15), 3127 (2019)","journal-title":"Appl. Sci."},{"issue":"8","key":"17_CR23","doi-asserted-by":"publisher","first-page":"2616","DOI":"10.1088\/0957-0233\/18\/8\/037","volume":"18","author":"H Louhichi","year":"2007","unstructured":"Louhichi, H., Fournel, T., Lavest, J., Aissia, H.B.: Self-calibration of Scheimpflug cameras: an easy protocol. Meas. Sci. Technol. 18(8), 2616 (2007)","journal-title":"Meas. Sci. Technol."},{"issue":"5","key":"17_CR24","doi-asserted-by":"publisher","first-page":"12792","DOI":"10.1016\/j.matpr.2018.02.263","volume":"5","author":"R Manish","year":"2018","unstructured":"Manish, R., Venkatesh, A., Ashok, S.D.: Machine vision based image processing techniques for surface finish and defect inspection in a grinding process. Mater. Today Proc. 5(5), 12792\u201312802 (2018)","journal-title":"Mater. Today Proc."},{"issue":"10","key":"17_CR25","doi-asserted-by":"publisher","first-page":"3241","DOI":"10.1007\/s00170-022-10683-5","volume":"124","author":"R Nascimento","year":"2023","unstructured":"Nascimento, R., Martins, I., Dutra, T.A., Moreira, L.: Computer vision based quality control for additive manufacturing parts. Int. J. Adv. Manuf. Technol. 124(10), 3241\u20133256 (2023)","journal-title":"Int. J. Adv. Manuf. Technol."},{"issue":"5","key":"17_CR26","doi-asserted-by":"publisher","first-page":"2455","DOI":"10.1007\/s00170-022-10722-1","volume":"125","author":"M Ojer","year":"2023","unstructured":"Ojer, M., Alvarez, H., Lajas, I., Larranaga, A., Amozarrain, L.: Automatic inspection of paperboard creases to improve the quality of the packaging process. Int. J. Adv. Manuf. Technol. 125(5), 2455\u20132466 (2023)","journal-title":"Int. J. Adv. Manuf. Technol."},{"key":"17_CR27","unstructured":"OpenCV: OpenCV: Template Matching. https:\/\/docs.opencv.org\/4.x\/d4\/dc6\/tutorial_py_template_matching.html. Accessed July 2024"},{"key":"17_CR28","doi-asserted-by":"publisher","first-page":"107476","DOI":"10.1016\/j.ijpe.2019.08.011","volume":"221","author":"P Osterrieder","year":"2020","unstructured":"Osterrieder, P., Budde, L., Friedli, T.: The smart factory as a key construct of industry 4.0: a systematic literature review. Int. J. Prod. Econ. 221, 107476 (2020)","journal-title":"Int. J. Prod. Econ."},{"key":"17_CR29","doi-asserted-by":"crossref","unstructured":"Pellicciari, M., Andrisano, A.O., Leali, F., Vergnano, A.: Engineering method for adaptive manufacturing systems design. IJIDeM (2009)","DOI":"10.1007\/s12008-009-0065-9"},{"key":"17_CR30","doi-asserted-by":"crossref","unstructured":"Redmon, J., Divvala, S., Girshick, R., Farhadi, A.: You only look once: unified, real-time object detection. In: Proceedings of the IEEE Conference on Computer Vision and Pattern Recognition, pp. 779\u2013788 (2016)","DOI":"10.1109\/CVPR.2016.91"},{"issue":"4","key":"17_CR31","doi-asserted-by":"publisher","first-page":"1051","DOI":"10.3390\/s24041051","volume":"24","author":"M Rogalka","year":"2024","unstructured":"Rogalka, M., Grabski, J.K., Garbowski, T.: In-situ classification of highly deformed corrugated board using convolution neural networks. Sensors 24(4), 1051 (2024)","journal-title":"Sensors"},{"key":"17_CR32","doi-asserted-by":"publisher","first-page":"103442","DOI":"10.1016\/j.compind.2021.103442","volume":"129","author":"B Scheibel","year":"2021","unstructured":"Scheibel, B., Mangler, J., Rinderle-Ma, S.: Extraction of dimension requirements from engineering drawings for supporting quality control in production processes. Comput. Ind. 129, 103442 (2021)","journal-title":"Comput. Ind."},{"key":"17_CR33","doi-asserted-by":"crossref","unstructured":"Suppitaksakul, C., Rattakorn, M.: Machine vision system for counting the number of corrugated cardboard. In: 2014 International Electrical Engineering Congress (iEECON), pp.\u00a01\u20134. IEEE (2014)","DOI":"10.1109\/iEECON.2014.6925889"},{"issue":"1","key":"17_CR34","doi-asserted-by":"publisher","first-page":"32","DOI":"10.1016\/0734-189X(85)90016-7","volume":"30","author":"S Suzuki","year":"1985","unstructured":"Suzuki, S., et al.: Topological structural analysis of digitized binary images by border following. Comput. Vis. Graph. Image Process. 30(1), 32\u201346 (1985)","journal-title":"Comput. Vis. Graph. Image Process."},{"issue":"1","key":"17_CR35","doi-asserted-by":"publisher","first-page":"1","DOI":"10.1561\/0600000009","volume":"2","author":"R Szeliski","year":"2007","unstructured":"Szeliski, R., et al.: Image alignment and stitching: a tutorial. Found. Trends Comput. Graph. Vis. 2(1), 1\u2013104 (2007)","journal-title":"Found. Trends Comput. Graph. Vis."},{"issue":"3","key":"17_CR36","doi-asserted-by":"publisher","first-page":"759","DOI":"10.1007\/s10845-019-01476-x","volume":"31","author":"D Tabernik","year":"2020","unstructured":"Tabernik, D., \u0160ela, S., Skvar\u010d, J., Sko\u010daj, D.: Segmentation-based deep-learning approach for surface-defect detection. J. Intell. Manuf. 31(3), 759\u2013776 (2020)","journal-title":"J. Intell. Manuf."},{"issue":"4","key":"17_CR37","doi-asserted-by":"publisher","first-page":"1680","DOI":"10.3390\/make5040083","volume":"5","author":"J Terven","year":"2023","unstructured":"Terven, J., C\u00f3rdova-Esparza, D.M., Romero-Gonz\u00e1lez, J.A.: A comprehensive review of YOLO architectures in computer vision: from YOLOv1 to YOLOv8 and YOLO-NAS. Mach. Learn. Knowl. Extr. 5(4), 1680\u20131716 (2023)","journal-title":"Mach. Learn. Knowl. Extr."},{"key":"17_CR38","doi-asserted-by":"publisher","first-page":"144","DOI":"10.1016\/j.jmsy.2018.01.003","volume":"48","author":"J Wang","year":"2018","unstructured":"Wang, J., Ma, Y., Zhang, L., Gao, R.X., Wu, D.: Deep learning for smart manufacturing: methods and applications. J. Manuf. Syst. 48, 144\u2013156 (2018)","journal-title":"J. Manuf. Syst."},{"key":"17_CR39","doi-asserted-by":"publisher","first-page":"530","DOI":"10.1016\/j.jmsy.2021.10.006","volume":"61","author":"X Xu","year":"2021","unstructured":"Xu, X., Lu, Y., Vogel-Heuser, B., Wang, L.: Industry 4.0 and Industry 5.0-inception, conception and perception. J. Manuf. Syst. 61, 530\u2013535 (2021)","journal-title":"J. Manuf. Syst."},{"key":"17_CR40","doi-asserted-by":"crossref","unstructured":"Youkachen, S., Ruchanurucks, M., Phatrapomnant, T., Kaneko, H.: Defect segmentation of hot-rolled steel strip surface by using convolutional auto-encoder and conventional image processing. In: 2019 10th International Conference of Information and Communication Technology for Embedded Systems (IC-ICTES), pp.\u00a01\u20135. IEEE (2019)","DOI":"10.1109\/ICTEmSys.2019.8695928"},{"issue":"11","key":"17_CR41","doi-asserted-by":"publisher","first-page":"1330","DOI":"10.1109\/34.888718","volume":"22","author":"Z Zhang","year":"2000","unstructured":"Zhang, Z.: A flexible new technique for camera calibration. IEEE Trans. Pattern Anal. Mach. Intell. 22(11), 1330\u20131334 (2000)","journal-title":"IEEE Trans. Pattern Anal. Mach. Intell."},{"key":"17_CR42","doi-asserted-by":"crossref","unstructured":"Zhao, Y.: OmniAL: a unified CNN framework for unsupervised anomaly localization. In: 2023 IEEE\/CVF Conference on Computer Vision and Pattern Recognition (CVPR), pp. 3924\u20133933 (2023)","DOI":"10.1109\/CVPR52729.2023.00382"},{"key":"17_CR43","doi-asserted-by":"crossref","unstructured":"Zivkovic, Z.: Improved adaptive gaussian mixture model for background subtraction. In: Proceedings of the 17th International Conference on Pattern Recognition, 2004. ICPR 2004, vol.\u00a02, pp. 28\u201331. IEEE (2004)","DOI":"10.1109\/ICPR.2004.1333992"},{"issue":"7","key":"17_CR44","doi-asserted-by":"publisher","first-page":"773","DOI":"10.1016\/j.patrec.2005.11.005","volume":"27","author":"Z Zivkovic","year":"2006","unstructured":"Zivkovic, Z., Van Der Heijden, F.: Efficient adaptive density estimation per image pixel for the task of background subtraction. Pattern Recogn. Lett. 27(7), 773\u2013780 (2006)","journal-title":"Pattern Recogn. Lett."}],"container-title":["Lecture Notes in Computer Science","Computer Vision \u2013 ECCV 2024 Workshops"],"original-title":[],"language":"en","link":[{"URL":"https:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-031-92805-5_17","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2025,5,22]],"date-time":"2025-05-22T12:59:50Z","timestamp":1747918790000},"score":1,"resource":{"primary":{"URL":"https:\/\/link.springer.com\/10.1007\/978-3-031-92805-5_17"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2025]]},"ISBN":["9783031928048","9783031928055"],"references-count":44,"URL":"https:\/\/doi.org\/10.1007\/978-3-031-92805-5_17","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"value":"0302-9743","type":"print"},{"value":"1611-3349","type":"electronic"}],"subject":[],"published":{"date-parts":[[2025]]},"assertion":[{"value":"12 May 2025","order":1,"name":"first_online","label":"First Online","group":{"name":"ChapterHistory","label":"Chapter History"}},{"value":"ECCV","order":1,"name":"conference_acronym","label":"Conference Acronym","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"European Conference on Computer Vision","order":2,"name":"conference_name","label":"Conference Name","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Milan","order":3,"name":"conference_city","label":"Conference City","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"Italy","order":4,"name":"conference_country","label":"Conference Country","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"2024","order":5,"name":"conference_year","label":"Conference Year","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"29 September 2024","order":7,"name":"conference_start_date","label":"Conference Start Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"4 October 2024","order":8,"name":"conference_end_date","label":"Conference End Date","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"18","order":9,"name":"conference_number","label":"Conference Number","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"eccv2024","order":10,"name":"conference_id","label":"Conference ID","group":{"name":"ConferenceInfo","label":"Conference Information"}},{"value":"https:\/\/eccv2024.ecva.net\/","order":11,"name":"conference_url","label":"Conference URL","group":{"name":"ConferenceInfo","label":"Conference Information"}}]}}