{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,25]],"date-time":"2025-03-25T14:38:17Z","timestamp":1742913497068,"version":"3.40.3"},"publisher-location":"Cham","reference-count":17,"publisher":"Springer International Publishing","isbn-type":[{"type":"print","value":"9783319676296"},{"type":"electronic","value":"9783319676302"}],"license":[{"start":{"date-parts":[[2017,1,1]],"date-time":"2017-01-01T00:00:00Z","timestamp":1483228800000},"content-version":"unspecified","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2017]]},"DOI":"10.1007\/978-3-319-67630-2_7","type":"book-chapter","created":{"date-parts":[[2017,10,19]],"date-time":"2017-10-19T04:33:17Z","timestamp":1508387597000},"page":"89-97","source":"Crossref","is-referenced-by-count":3,"title":["Reconfigurable Silicon Photonic Interconnect for Many-Core Architecture"],"prefix":"10.1007","author":[{"given":"Hang","family":"Guan","sequence":"first","affiliation":[]},{"given":"S\u00e9bastien","family":"Rumley","sequence":"additional","affiliation":[]},{"given":"Ke","family":"Wen","sequence":"additional","affiliation":[]},{"given":"David","family":"Donofrio","sequence":"additional","affiliation":[]},{"given":"John","family":"Shalf","sequence":"additional","affiliation":[]},{"given":"Keren","family":"Bergman","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2017,10,20]]},"reference":[{"key":"7_CR1","unstructured":"Wen, K., Rumley, S., Samadi, P., Chen, C.P., Bergman, K.: Silicon photonics in post Moore\u2019s Law era: technological and architectural implications. In: Post-Moore\u2019s Era Supercomputing (PMES) Workshop, Salt Lake City. IEEE (2016)"},{"issue":"3","key":"7_CR2","doi-asserted-by":"crossref","first-page":"129","DOI":"10.1145\/1816038.1815978","volume":"38","author":"S Beamer","year":"2010","unstructured":"Beamer, S., Sun, C., Kwon, Y.J., Joshi, A., Batten, C., Stojanovi\u0107, V., Asanovi\u0107, K.: Re-architecting DRAM memory systems with monolithically integrated silicon photonics. ACM SIGARCH Comput. Architect. News 38(3), 129\u2013140 (2010)","journal-title":"ACM SIGARCH Comput. Architect. News"},{"key":"7_CR3","doi-asserted-by":"crossref","unstructured":"Loh, G.H.: 3D-stacked memory architectures for multi-core processors. In: 35th International Symposium on Computer Architecture (ISCA), pp. 453\u2013464. IEEE (2008)","DOI":"10.1109\/ISCA.2008.15"},{"issue":"7583","key":"7_CR4","doi-asserted-by":"crossref","first-page":"534","DOI":"10.1038\/nature16454","volume":"528","author":"C Sun","year":"2015","unstructured":"Sun, C., Wade, M.T., Lee, Y., Orcutt, J.S., Alloatti, L., Georgas, M.S., Waterman, A.S., Shainline, J.M., Avizienis, R.R., Lin, S., Moss, B.R.: Single-chip microprocessor that communicates directly using light. Nature 528(7583), 534\u2013538 (2015)","journal-title":"Nature"},{"key":"7_CR5","doi-asserted-by":"crossref","unstructured":"Wen, K., Guan, H., Calhoun, D.M., Donofrio, D., Shalf, J., Bergman, K.: Silicon photonic memory interconnect for many-core architectures. In: High Performance Extreme Computing Conference (HPEC), Waltham, pp. 1\u20137. IEEE, September 2016","DOI":"10.1109\/HPEC.2016.7761609"},{"issue":"4","key":"7_CR6","doi-asserted-by":"crossref","first-page":"828","DOI":"10.1109\/JSSC.2014.2382101","volume":"50","author":"C Sun","year":"2015","unstructured":"Sun, C., Georgas, M., Orcutt, J., Moss, B., Chen, Y.H., Shainline, J., Wade, M., Mehta, K., Nammari, K., Timurdogan, E., Miller, D.: A monolithically-integrated chip-to-chip optical link in bulk CMOS. IEEE J. Solid-State Circ. 50(4), 828\u2013844 (2015)","journal-title":"IEEE J. Solid-State Circ."},{"issue":"3","key":"7_CR7","doi-asserted-by":"crossref","first-page":"72","DOI":"10.1109\/MCOM.2013.6476868","volume":"51","author":"Y Arakawa","year":"2013","unstructured":"Arakawa, Y., Nakamura, T., Urino, Y., Fujita, T.: Silicon photonics for next generation system integration platform. IEEE Commun. Mag. 51(3), 72\u201377 (2013)","journal-title":"IEEE Commun. Mag."},{"issue":"3","key":"7_CR8","doi-asserted-by":"crossref","first-page":"498","DOI":"10.1109\/JSTQE.2010.2071855","volume":"17","author":"C Kopp","year":"2011","unstructured":"Kopp, C., Bernabe, S., Bakir, B.B., Fedeli, J.M., Orobtchouk, R., Schrank, F., Porte, H., Zimmermann, L., Tekin, T.: Silicon photonic circuits: on-CMOS integration, fiber optical coupling, and packaging. IEEE J. Sel. Top. Quantum Electron. 17(3), 498\u2013509 (2011)","journal-title":"IEEE J. Sel. Top. Quantum Electron."},{"key":"7_CR9","doi-asserted-by":"crossref","unstructured":"Orcutt, J.S., Ram, R.J., Stojanovi\u0107, V.: Integration of Silicon Photonics into Electronic Processes, p. 86290F. Society of Photo-Optical Instrumentation Engineers (SPIE) (2013)","DOI":"10.1117\/12.2004811"},{"issue":"6","key":"7_CR10","doi-asserted-by":"crossref","first-page":"443","DOI":"10.1109\/JSTQE.2016.2553453","volume":"22","author":"X Luo","year":"2016","unstructured":"Luo, X., Cheng, Y., Song, J., Liow, T.Y., Wang, Q.J., Yu, M.: Wafer-scale dies-transfer bonding technology for hybrid III\/V-on-Silicon photonic integrated circuit application. IEEE J. Sel. Top. Quantum Electron. 22(6), 443\u2013454 (2016)","journal-title":"IEEE J. Sel. Top. Quantum Electron."},{"key":"7_CR11","doi-asserted-by":"crossref","unstructured":"Bahadori, M., Rumley, S., Polster, R., Gazman, A., Traverso, M., Webster, M., Patel, K., Bergman, K.: Energy-performance optimized design of silicon photonic interconnection networks for high-performance computing. In: Design, Automation & Test in Europe Conference & Exhibition (DATE), Lausanne, pp. 326\u2013331. IEEE (2017)","DOI":"10.23919\/DATE.2017.7927010"},{"issue":"12","key":"7_CR12","doi-asserted-by":"crossref","first-page":"2975","DOI":"10.1109\/JLT.2015.2503120","volume":"34","author":"M Bahadori","year":"2016","unstructured":"Bahadori, M., Rumley, S., Nikolova, D., Bergman, K.: Comprehensive design space exploration of silicon photonic interconnects. J. Lightwave Technol. 34(12), 2975\u20132987 (2016)","journal-title":"J. Lightwave Technol."},{"key":"7_CR13","doi-asserted-by":"crossref","unstructured":"Minkenberg, C., Rodriguez, G., Prisacari, B., Schares, L., Heidelberger, P., Chen, D., Stunkel, C.: Large-scale system partitioning using OCS. In: Photonics in Switching (PS), Florence. IEEE (2015)","DOI":"10.1109\/PS.2015.7329011"},{"key":"7_CR14","doi-asserted-by":"crossref","unstructured":"Wen, K., Samadi, P., Rumley, S., Chen, C.P., Shen, Y., Bahadori, M., Wilke, J., Begman, K.: Flexfly: enabling a reconfigurable dragonfly through silicon photonics. In: International Conference for High Performance Computing, Networking, Storage and Analysis (SC), Salt Lake City. IEEE (2016)","DOI":"10.1109\/SC.2016.14"},{"issue":"2","key":"7_CR15","doi-asserted-by":"crossref","first-page":"34","DOI":"10.1109\/MM.2016.25","volume":"36","author":"A Sodani","year":"2016","unstructured":"Sodani, A., Gramunt, R., Corbal, J., Kim, H.S., Vinod, K., Chinthamani, S., Hutsell, S., Agarwal, R., Liu, Y.C.: Knights landing: second-generation intel xeon phi product. IEEE Micro 36(2), 34\u201346 (2016)","journal-title":"IEEE Micro"},{"issue":"4","key":"7_CR16","doi-asserted-by":"crossref","first-page":"37","DOI":"10.1145\/1964218.1964225","volume":"38","author":"AF Rodrigues","year":"2011","unstructured":"Rodrigues, A.F., Hemmert, K.S., Barrett, B.W., Kersey, C., Oldfield, R., Weston, M., Risen, R., Cook, J., Rosenfeld, P., CooperBalls, E., Jacob, B.: The structural simulation toolkit. ACM SIGMETRICS Perform. Eval. Rev. 38(4), 37\u201342 (2011)","journal-title":"ACM SIGMETRICS Perform. Eval. Rev."},{"key":"7_CR17","doi-asserted-by":"crossref","unstructured":"Voskuilen, G.R., Frank, M.P., Hammond, S.D., Rodrigues, A.F.: Evaluating the Opportunities for Multi-Level Memory\u2013An ASC 2016 L2 Milestone. Sandia Report (2016)","DOI":"10.2172\/1562213"}],"container-title":["Lecture Notes in Computer Science","High Performance Computing"],"original-title":[],"link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-319-67630-2_7","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2020,10,20]],"date-time":"2020-10-20T03:40:56Z","timestamp":1603165256000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-319-67630-2_7"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2017]]},"ISBN":["9783319676296","9783319676302"],"references-count":17,"URL":"https:\/\/doi.org\/10.1007\/978-3-319-67630-2_7","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"type":"print","value":"0302-9743"},{"type":"electronic","value":"1611-3349"}],"subject":[],"published":{"date-parts":[[2017]]}}}