{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,7,7]],"date-time":"2025-07-07T09:08:00Z","timestamp":1751879280285},"publisher-location":"Cham","reference-count":20,"publisher":"Springer International Publishing","isbn-type":[{"type":"print","value":"9783319930817"},{"type":"electronic","value":"9783319930824"}],"license":[{"start":{"date-parts":[[2018,7,13]],"date-time":"2018-07-13T00:00:00Z","timestamp":1531440000000},"content-version":"unspecified","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":["link.springer.com"],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2019]]},"DOI":"10.1007\/978-3-319-93082-4_11","type":"book-chapter","created":{"date-parts":[[2018,7,12]],"date-time":"2018-07-12T10:42:06Z","timestamp":1531392126000},"page":"81-87","update-policy":"http:\/\/dx.doi.org\/10.1007\/springer_crossmark_policy","source":"Crossref","is-referenced-by-count":12,"title":["Model-Order Reduction Procedure for Fast Dynamic Electrothermal Simulation of Power Converters"],"prefix":"10.1007","author":[{"given":"A. P.","family":"Catalano","sequence":"first","affiliation":[]},{"given":"M.","family":"Riccio","sequence":"additional","affiliation":[]},{"given":"L.","family":"Codecasa","sequence":"additional","affiliation":[]},{"given":"A.","family":"Magnani","sequence":"additional","affiliation":[]},{"given":"G.","family":"Romano","sequence":"additional","affiliation":[]},{"given":"V.","family":"d\u2019Alessandro","sequence":"additional","affiliation":[]},{"given":"L.","family":"Maresca","sequence":"additional","affiliation":[]},{"given":"N.","family":"Rinaldi","sequence":"additional","affiliation":[]},{"given":"G.","family":"Breglio","sequence":"additional","affiliation":[]},{"given":"A.","family":"Irace","sequence":"additional","affiliation":[]}],"member":"297","published-online":{"date-parts":[[2018,7,13]]},"reference":[{"issue":"2","key":"11_CR1","doi-asserted-by":"publisher","first-page":"563","DOI":"10.1109\/TED.2012.2226177","volume":"60","author":"G Breglio","year":"2013","unstructured":"Breglio, G., et al.: Experimental detection and numerical validation of different failure mechanisms in IGBTs during unclamped inductive switching. IEEE Trans. Electron Devices 60(2), 563\u2013570 (2013)","journal-title":"IEEE Trans. Electron Devices"},{"issue":"9","key":"11_CR2","doi-asserted-by":"publisher","first-page":"1713","DOI":"10.1016\/j.microrel.2013.07.083","volume":"53","author":"V d\u2019Alessandro","year":"2013","unstructured":"d\u2019Alessandro, V., et al.: Analysis of the UIS behavior of power devices by means of SPICE-based electrothermal simulations. Microelectron. Reliab. 53(9), 1713\u20131718 (2013)","journal-title":"Microelectron. Reliab."},{"issue":"3","key":"11_CR3","doi-asserted-by":"publisher","first-page":"1441","DOI":"10.1109\/TIA.2011.2124436","volume":"47","author":"S Yang","year":"2011","unstructured":"Yang, S., et al.: An industry-based survey of reliability in power electronic converters. IEEE Trans. Ind. Appl. 47(3), 1441\u20131451 (2011)","journal-title":"IEEE Trans. Ind. Appl."},{"issue":"3","key":"11_CR4","doi-asserted-by":"publisher","first-page":"255","DOI":"10.1561\/1000000007","volume":"2","author":"Y Zhan","year":"2007","unstructured":"Zhan, Y., Kumar, S.V., Sapatnekar, S.S.: Thermally aware design. Found. Trends Electron. Design Autom. 2(3), 255\u2013370 (2007)","journal-title":"Found. Trends Electron. Design Autom."},{"issue":"3","key":"11_CR5","doi-asserted-by":"publisher","first-page":"355","DOI":"10.1109\/TCPMT.2015.2392625","volume":"5","author":"C Batard","year":"2015","unstructured":"Batard, C., Ginot, N., Antonios, J.: Lumped dynamic electrothermal model of IGBT module of inverters. IEEE Trans. Compon. Packag. Manuf. Technol. 5(3), 355\u2013364 (2015)","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"issue":"7","key":"11_CR6","doi-asserted-by":"publisher","first-page":"1237","DOI":"10.1109\/TCPMT.2013.2253609","volume":"3","author":"V d\u2019Alessandro","year":"2013","unstructured":"d\u2019Alessandro, V., et al.: Dynamic electrothermal macromodeling: an application to signal integrity analysis in highly integrated electronic systems. IEEE Trans. Compon. Packag. Manuf. Technol. 3(7), 1237\u20131243 (2013)","journal-title":"IEEE Trans. Compon. Packag. Manuf. Technol."},{"key":"11_CR7","unstructured":"Comsol Multiphysics, User\u2019s Guide, release 5.2a, COMSOL AB. Stockholm, Sweden (2016)"},{"issue":"1","key":"11_CR8","doi-asserted-by":"publisher","first-page":"186","DOI":"10.1109\/TCAPT.2002.808005","volume":"26","author":"L Codecasa","year":"2003","unstructured":"Codecasa, L., D\u2019Amore, D., Maffezzoni, P.: An Arnoldi based thermal network reduction method for electro-thermal analysis. IEEE Trans. Compon. Packag. Technol. 26(1), 186\u2013192 (2003)","journal-title":"IEEE Trans. Compon. Packag. Technol."},{"issue":"4","key":"11_CR9","doi-asserted-by":"publisher","first-page":"465","DOI":"10.1109\/TCSI.2003.811422","volume":"50","author":"L Codecasa","year":"2003","unstructured":"Codecasa, L., D\u2019Amore, D., Maffezzoni, P.: Compact modeling of electrical devices for electrothermal analysis. IEEE Trans. Circuits Syst. I 50(4), 465\u2013476 (2003)","journal-title":"IEEE Trans. Circuits Syst. I"},{"key":"11_CR10","doi-asserted-by":"crossref","unstructured":"Codecasa, L., et al.: FAst Novel Thermal Analysis Simulation Tool for Integrated Circuits (FANTASTIC). In: Proceedings of IEEE THERMINIC (2014)","DOI":"10.1109\/THERMINIC.2014.6972507"},{"key":"11_CR11","doi-asserted-by":"crossref","unstructured":"Magnani, A., et al.: Analysis of the influence of layout and technology parameters on the thermal impedance of GaAs HBT\/BiFET using a highly-efficient tool. In: Proceedings of IEEE CSICS (2014)","DOI":"10.1109\/CSICS.2014.6978543"},{"key":"11_CR12","doi-asserted-by":"crossref","unstructured":"d\u2019Alessandro, V., et al.: Dynamic electrothermal simulation of photovoltaic plants. In: Proceedings of IEEE ICCEP, pp. 682\u2013688 (2015)","DOI":"10.1109\/ICCEP.2015.7177565"},{"key":"11_CR13","unstructured":"Mohan, N., Undeland, T.M.: Power Electronics: Converters, Applications, and Design. Wiley (2007)"},{"issue":"1","key":"11_CR14","doi-asserted-by":"publisher","first-page":"12","DOI":"10.1109\/63.554165","volume":"12","author":"AGM Strollo","year":"1997","unstructured":"Strollo, A.G.M.: A new SPICE model of power P-I-N diode based on asymptotic waveform evaluation. IEEE Trans. Power Electron. 12(1), 12\u201320 (1997)","journal-title":"IEEE Trans. Power Electron."},{"issue":"12","key":"11_CR15","doi-asserted-by":"publisher","first-page":"1899","DOI":"10.1016\/S0026-2714(98)00156-5","volume":"38","author":"AGM Strollo","year":"1998","unstructured":"Strollo, A.G.M., Napoli, E.: Power rectifier model including self-heating effects. Microelectron. Reliab. 38(12), 1899\u20131906 (1998)","journal-title":"Microelectron. Reliab."},{"key":"11_CR16","doi-asserted-by":"crossref","unstructured":"Kraus, R., Turkes, P., Sigg, J.: Physics-based models of power semiconductor devices for the circuit simulator SPICE. In: Proceedings of IEEE PESC, pp. 1726\u20131731 (1998)","DOI":"10.1109\/PESC.1998.703414"},{"issue":"3","key":"11_CR17","doi-asserted-by":"publisher","first-page":"710","DOI":"10.1109\/TIA.2004.827456","volume":"40","author":"R Azar","year":"2004","unstructured":"Azar, R., et al.: Advanced SPICE modeling of large power IGBT modules. IEEE Trans. Ind. Appl. 40(3), 710\u2013716 (2004)","journal-title":"IEEE Trans. Ind. Appl."},{"key":"11_CR18","doi-asserted-by":"crossref","unstructured":"Riccio, M., et al.: Compact electro-thermal modeling and simulation of large area multicellular Trench-IGBT. In: Proceedings of IEEE MIEL, pp. 379\u2013382 (2010)","DOI":"10.1109\/MIEL.2010.5490459"},{"issue":"9","key":"11_CR19","doi-asserted-by":"publisher","first-page":"1971","DOI":"10.1016\/j.microrel.2015.06.086","volume":"55","author":"D Cavaiuolo","year":"2015","unstructured":"Cavaiuolo, D., et al.: A robust electro-thermal IGBT SPICE model: application to short-circuit protection circuit design. Microelectron. Reliab. 55(9), 1971\u20131975 (2015)","journal-title":"Microelectron. Reliab."},{"issue":"4","key":"11_CR20","doi-asserted-by":"publisher","first-page":"3088","DOI":"10.1109\/TPEL.2016.2578363","volume":"32","author":"M Riccio","year":"2017","unstructured":"Riccio, M., et al.: Accurate SPICE modeling of reverse-conducting IGBTs including self-heating effects. IEEE Trans. Power Electron. 32(4), 3088\u20133098 (2017)","journal-title":"IEEE Trans. Power Electron."}],"container-title":["Lecture Notes in Electrical Engineering","Applications in Electronics Pervading Industry, Environment and Society"],"original-title":[],"link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-319-93082-4_11","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,10,20]],"date-time":"2019-10-20T14:09:13Z","timestamp":1571580553000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-319-93082-4_11"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2018,7,13]]},"ISBN":["9783319930817","9783319930824"],"references-count":20,"URL":"https:\/\/doi.org\/10.1007\/978-3-319-93082-4_11","relation":{},"ISSN":["1876-1100","1876-1119"],"issn-type":[{"type":"print","value":"1876-1100"},{"type":"electronic","value":"1876-1119"}],"subject":[],"published":{"date-parts":[[2018,7,13]]}}}