{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2025,3,25]],"date-time":"2025-03-25T23:57:14Z","timestamp":1742947034437,"version":"3.40.3"},"publisher-location":"Berlin, Heidelberg","reference-count":11,"publisher":"Springer Berlin Heidelberg","isbn-type":[{"type":"print","value":"9783540723820"},{"type":"electronic","value":"9783540723837"}],"license":[{"start":{"date-parts":[[2007,1,1]],"date-time":"2007-01-01T00:00:00Z","timestamp":1167609600000},"content-version":"unspecified","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2007]]},"DOI":"10.1007\/978-3-540-72383-7_71","type":"book-chapter","created":{"date-parts":[[2007,7,16]],"date-time":"2007-07-16T14:47:40Z","timestamp":1184597260000},"page":"602-608","source":"Crossref","is-referenced-by-count":1,"title":["Adaptive Network-Based Fuzzy Inference Model of Plasma Enhanced Chemical Vapor Deposition Process"],"prefix":"10.1007","author":[{"given":"Byungwhan","family":"Kim","sequence":"first","affiliation":[]},{"given":"Seongjin","family":"Choi","sequence":"additional","affiliation":[]}],"member":"297","reference":[{"key":"71_CR1","doi-asserted-by":"publisher","first-page":"8","DOI":"10.1016\/S0040-6090(02)01114-8","volume":"426","author":"B. Kim","year":"2003","unstructured":"Kim, B., Kwon, K.H., Kwon, S.K., Park, J.M., Yoo, S.W., Park, K.S., You, I.K., Kim, B.W.: Modeling Etch and Uniformity of Oxide via Etching in a CHF3\/CF4 Plasma Using Neural Network. Thin Solid Films\u00a0426, 8\u201315 (2003)","journal-title":"Thin Solid Films"},{"key":"71_CR2","doi-asserted-by":"publisher","first-page":"123","DOI":"10.1016\/j.chemolab.2005.06.002","volume":"79","author":"B. Kim","year":"2005","unstructured":"Kim, B., Kim, S.: GA-optimized Backpropagation Neural Network with Multi-parameterized Gradients and Applications to Predicting Plasma Etch Data. Chemometr. Intell. Lab. Syst.\u00a079, 123\u2013128 (2005)","journal-title":"Chemometr. Intell. Lab. Syst."},{"issue":"2","key":"71_CR3","doi-asserted-by":"publisher","first-page":"231","DOI":"10.1016\/S0169-7439(02)00137-5","volume":"65","author":"B. Kim","year":"2003","unstructured":"Kim, B., Kim, S.: Plasma Diagnosis by Recognizing in-situ Data Using a Modular Backpropagation Network. Chemomemetr. Intell. Lab. Syst.\u00a065(2), 231\u2013240 (2003)","journal-title":"Chemomemetr. Intell. Lab. Syst."},{"issue":"5","key":"71_CR4","doi-asserted-by":"publisher","first-page":"2467","DOI":"10.1116\/1.1798851","volume":"22","author":"B. Kim","year":"2004","unstructured":"Kim, B., Kim, S., Lee, B.T.: Modeling SiC Surface Roughness Using Neural Network and Atomic Force Microscopy. J. Vac. Sci. Technolo. B\u00a022(5), 2467\u20132472 (2004)","journal-title":"J. Vac. Sci. Technolo. B"},{"issue":"1-4","key":"71_CR5","doi-asserted-by":"publisher","first-page":"17","DOI":"10.1016\/S0169-4332(03)00963-2","volume":"222","author":"B. Kim","year":"2004","unstructured":"Kim, B., Kim, K.: Prediction of Profile Surface Roughness in CHF3\/CF4 Plasma Using Neural Network. Applied Surface Science\u00a0222(1-4), 17\u201322 (2004)","journal-title":"Applied Surface Science"},{"issue":"6","key":"71_CR6","doi-asserted-by":"publisher","first-page":"2517","DOI":"10.1116\/1.1810169","volume":"22","author":"B. Kim","year":"2004","unstructured":"Kim, B., Lee, B.T.: Prediction of SiC Etching in a NF3\/CH4 Plasma Using Neural Network. Journal of Vaccum Science and Technology A\u00a022(6), 2517\u20132522 (2004)","journal-title":"Journal of Vaccum Science and Technology A"},{"key":"71_CR7","doi-asserted-by":"publisher","first-page":"46","DOI":"10.1109\/66.827339","volume":"13","author":"J.P. Geisler","year":"2000","unstructured":"Geisler, J.P., Lee, C.S.G., May, G.S.: Neurofuzzy Modeling of Chemical Vapor Deposition Processes. IEEE Trans. Semicond. Manufact.\u00a013, 46\u201359 (2000)","journal-title":"IEEE Trans. Semicond. Manufact."},{"issue":"2","key":"71_CR8","doi-asserted-by":"publisher","first-page":"673","DOI":"10.1109\/TPS.2002.1024269","volume":"30","author":"B. Kim","year":"2002","unstructured":"Kim, B., Park, J.H.: Qualitative Fuzzy Logic Model of Plasma Etch Process. IEEE Trans. Plasma Science\u00a030(2), 673\u2013678 (2002)","journal-title":"IEEE Trans. Plasma Science"},{"key":"71_CR9","series-title":"Lecture Notes in Computer Science","doi-asserted-by":"publisher","first-page":"1020","DOI":"10.1007\/11760191_149","volume-title":"Advances in Neural Networks - ISNN 2006","author":"B. Kim","year":"2006","unstructured":"Kim, B., Lee, D., Han, S.-S.: Prediction of plasma enhanced deposition process using GA-optimized GRNN. In: Wang, J., Yi, Z., \u017burada, J.M., Lu, B.-L., Yin, H. (eds.) ISNN 2006. LNCS, vol.\u00a03973, pp. 1020\u20131027. Springer, Heidelberg (2006)"},{"key":"71_CR10","volume-title":"Design and Analysis of Experiments","author":"D.C. Montgomery","year":"1991","unstructured":"Montgomery, D.C.: Design and Analysis of Experiments. John Wiley & Sons, Singapore (1991)"},{"issue":"3","key":"71_CR11","doi-asserted-by":"publisher","first-page":"665","DOI":"10.1109\/21.256541","volume":"23","author":"J.R. Jang","year":"1993","unstructured":"Jang, J.R.: ANFIS: Adaptive-network-based Fuzzy Inference System. IEEE Trans. Syst. Man. Cybern.\u00a023(3), 665\u2013685 (1993)","journal-title":"IEEE Trans. Syst. Man. Cybern."}],"container-title":["Lecture Notes in Computer Science","Advances in Neural Networks \u2013 ISNN 2007"],"original-title":[],"language":"en","link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-540-72383-7_71","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,21]],"date-time":"2019-05-21T19:52:35Z","timestamp":1558468355000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-540-72383-7_71"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2007]]},"ISBN":["9783540723820","9783540723837"],"references-count":11,"URL":"https:\/\/doi.org\/10.1007\/978-3-540-72383-7_71","relation":{},"ISSN":["0302-9743","1611-3349"],"issn-type":[{"type":"print","value":"0302-9743"},{"type":"electronic","value":"1611-3349"}],"subject":[],"published":{"date-parts":[[2007]]}}}