{"status":"ok","message-type":"work","message-version":"1.0.0","message":{"indexed":{"date-parts":[[2026,10,4]],"date-time":"2026-10-04T09:59:33Z","timestamp":1791107973025,"version":"4.1.0"},"publisher-location":"Berlin, Heidelberg","reference-count":12,"publisher":"Springer Berlin Heidelberg","isbn-type":[{"value":"9783642048494","type":"print"},{"value":"9783642048500","type":"electronic"}],"license":[{"start":{"date-parts":[[2009,1,1]],"date-time":"2009-01-01T00:00:00Z","timestamp":1230768000000},"content-version":"unspecified","delay-in-days":0,"URL":"http:\/\/www.springer.com\/tdm"}],"content-domain":{"domain":[],"crossmark-restriction":false},"short-container-title":[],"published-print":{"date-parts":[[2009]]},"DOI":"10.1007\/978-3-642-04850-0_14","type":"book-chapter","created":{"date-parts":[[2009,10,8]],"date-time":"2009-10-08T05:36:43Z","timestamp":1254980203000},"page":"90-98","source":"Crossref","is-referenced-by-count":18,"title":["Through Silicon Via-Based Grid for Thermal Control in 3D Chips"],"prefix":"10.1007","author":[{"given":"Jos\u00e9 L.","family":"Ayala","sequence":"first","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Arvind","family":"Sridhar","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Vinod","family":"Pangracious","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"David","family":"Atienza","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]},{"given":"Yusuf","family":"Leblebici","sequence":"additional","affiliation":[],"role":[{"vocabulary":"crossref","role":"author"}]}],"member":"297","reference":[{"key":"14_CR1","doi-asserted-by":"crossref","unstructured":"Das, S., Chandrakasan, A., Reif, R.: Design tools for 3-d integrated circuits. In: Proceedings of the 2003 Asia and South Pacific Design Automation Conference, pp. 53\u201356 (2003)","DOI":"10.1145\/1119772.1119783"},{"key":"14_CR2","doi-asserted-by":"crossref","first-page":"602","DOI":"10.1109\/5.929647","volume":"5","author":"K. Banerjee","year":"2001","unstructured":"Banerjee, K., Souri, S.J., Kapur, P., Saraswat, K.C.: 3-d ics: a novel chip design for improving deep-submicrometer interconnect performance and systems-on-chip integration. Proceedings of the IEEE\u00a05, 602\u2013633 (2001)","journal-title":"Proceedings of the IEEE"},{"issue":"-5","key":"14_CR3","first-page":"494","volume":"4","author":"A.W. Topol","year":"2006","unstructured":"Topol, A.W., et al.: Three-dimensional integrated circuits. IBM Journal of Research and Development (4-5), 494\u2013506 (2006)","journal-title":"IBM Journal of Research and Development"},{"key":"14_CR4","doi-asserted-by":"crossref","unstructured":"Cong, J., Zhang, Y.: Thermal via planning for 3-d ics. In: Proceedings of the 2005 IEEE\/ACM International conference on Computer-aided design, pp. 745\u2013752 (2005)","DOI":"10.1109\/ICCAD.2005.1560164"},{"issue":"4","key":"14_CR5","doi-asserted-by":"publisher","first-page":"692","DOI":"10.1109\/TCAD.2006.870069","volume":"25","author":"B. Goplen","year":"2006","unstructured":"Goplen, B., Sapatnekar, S.: Placement of thermal vias in 3-d ics using various thermal objectives. IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems\u00a025(4), 692\u2013709 (2006)","journal-title":"IEEE Transactions on Computer-Aided Design of Integrated Circuits and Systems"},{"key":"14_CR6","doi-asserted-by":"crossref","unstructured":"Jain, A., Jones, R., Chatterjee, R., Pozder, S., Huang, Z.: Thermal modeling and design of 3rd integrated circuits. In: Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (2008)","DOI":"10.1109\/ITHERM.2008.4544389"},{"key":"14_CR7","unstructured":"Natarajan, V., Deshpande, A., Solanki, S., Chandrasekhar, A.: Thermal and power challenges in high performance computing systems. In: International Symposium on Thermal Design and Thermophysical Property for Electronics (2008)"},{"key":"14_CR8","doi-asserted-by":"crossref","unstructured":"Heo, S., Barr, K., Asanovic, K.: Reducing power density through activity migration. In: Proceeding of the ISPD (2003)","DOI":"10.1145\/871506.871561"},{"key":"14_CR9","doi-asserted-by":"publisher","first-page":"94","DOI":"10.1145\/980152.980157","volume":"1","author":"K. Skadron","year":"2004","unstructured":"Skadron, K., Stan, M.R., Sankaranarayanan, K., Huang, W., Velusamy, S., Tarjan, D.: Temeprature-aware microarchitecture: modeling and implementation. Trans. Architecture Code Optimizations\u00a01, 94\u2013125 (2004)","journal-title":"Trans. Architecture Code Optimizations"},{"key":"14_CR10","doi-asserted-by":"crossref","unstructured":"Su, H., Liu, F., Devga, A., Acar, E., Nassif, S.: Full chip leakage estimation considering power supply and temperature variations. In: Proceeding of the ISPD, pp. 78\u201383 (2003)","DOI":"10.1145\/871506.871529"},{"key":"14_CR11","volume-title":"Computer methods for circuit analysis and design","author":"J. Vlach","year":"1983","unstructured":"Vlach, J., Singhal, K.: Computer methods for circuit analysis and design. Springer, Heidelberg (1983)"},{"key":"14_CR12","volume-title":"Fundamentals of heat and mass transfer","author":"F.P. Incropera","year":"2007","unstructured":"Incropera, F.P., Dewitt, D.P., Bergman, T.L., Lavine, A.S.: Fundamentals of heat and mass transfer. John Wiley and Sons, Chichester (2007)"}],"container-title":["Lecture Notes of the Institute for Computer Sciences, Social Informatics and Telecommunications Engineering","Nano-Net"],"original-title":[],"link":[{"URL":"http:\/\/link.springer.com\/content\/pdf\/10.1007\/978-3-642-04850-0_14","content-type":"unspecified","content-version":"vor","intended-application":"similarity-checking"}],"deposited":{"date-parts":[[2019,5,22]],"date-time":"2019-05-22T22:14:38Z","timestamp":1558563278000},"score":1,"resource":{"primary":{"URL":"http:\/\/link.springer.com\/10.1007\/978-3-642-04850-0_14"}},"subtitle":[],"short-title":[],"issued":{"date-parts":[[2009]]},"ISBN":["9783642048494","9783642048500"],"references-count":12,"URL":"https:\/\/doi.org\/10.1007\/978-3-642-04850-0_14","relation":{},"ISSN":["1867-8211","1867-822X"],"issn-type":[{"value":"1867-8211","type":"print"},{"value":"1867-822X","type":"electronic"}],"subject":[],"published":{"date-parts":[[2009]]}}}